WMSIC Electronic Components

XUNPU WAFER-PH2.0-6PZZ

ModelWAFER-PH2.0-6PZZ
PackageThrough-hole, P=2mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-PH2.0-6PZZ
Type
XUNPU
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
WAFER-PH2.0-6PZZ
Electronic Component
1
Package
Through-hole, P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.56g
Electronic Component
2mm
Electronic Component
Electronic Component
PIN
6P
Electronic Component
1
Electronic Component
PH
Electronic Component
BM0262715215
Electronic Component
PA66
Electronic Component
Through-hole

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-PH2.0-6PZZ 产品概述

一、产品简介

WAFER-PH2.0-6PZZ 为 XUNPU(讯普)品牌线对板直插式针座,属于常用的 PH 系列(1x6P,P=2.0mm)。该连接器为单排 6PIN 的直插(through-hole)结构,适用于常规电子板对板/线对板连接,体积小巧、可靠性高、便于批量装配。

二、关键规格

  • 排数/针数:1 排 × 6PIN(总 PIN 数 6P)
  • 间距:2.00 mm(PH 标准)
  • 额定电流:2 A / PIN
  • 额定电压:250 V
  • 工作温度:-25 ℃ ~ +85 ℃
  • 接触材质:黄铜(Brass)
  • 接触镀层:镀锡(Sn)
  • 外壳材料:PA66,阻燃等级 UL94V-0,颜色:白色

三、机械与尺寸参数

  • 安装方式:直插(插件、通孔)
  • Z 轴(板上高度):6.05 mm
  • X 轴(底边长度,间距线):14.00 mm
  • Y 轴(底边宽度):4.70 mm
    这些尺寸适配常见 2.0mm 间距的插头与线缆,便于在 PCB 布局中节省空间并保证可靠插接行程。

四、特性与优点

  • 结构稳固:黄铜触头提供良好机械强度与耐久性,适合频繁插拔场合。
  • 焊接性好:镀锡处理提升可焊性与抗氧化能力,适用于波峰焊或手工焊接。
  • 阻燃与耐温:PA66 材质配合 UL94V-0 阻燃等级,满足一般工业电子产品的安全要求;工作温度范围覆盖消费与工业级应用。
  • 标准化接口:2.0mm 间距为行业常用规格,兼容多种线束端子与外壳件,便于替换与设计复用。

五、典型应用场景

适用于家用电器、通信设备、显示器驱动板、LED 驱动、电源模块、工业控制板、仪器仪表等需要小型线对板连接且电流在 2A 左右的场合。

六、安装与使用建议

  • PCB 设计时按标称间距 2.0mm 开孔/通孔布局,预留焊盘与强度补强区,避免应力集中导致焊点断裂。
  • 焊接建议采用波峰焊或手工焊接工艺,注意温度与时间控制以免损伤塑料件。
  • 在高振动或频繁插拔环境下,建议评估使用夹持或加固结构以提高稳定性。
  • 存储与装配时避免高湿、高温环境,防止接触件氧化影响可靠性。

七、包装与质保

常见以散装或盘装供货,出厂前通过外观、电气连通性及机械耐久性等检验。建议向供应商确认批次出货、包装方式与质保条款。

如需 3D 尺寸图、PCB 针脚封装文件(Footprint)或大批量采购报价,可提供具体用途与数量,以便进一步支持。

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