WMSIC Electronic Components

XUNPU FPC-05F-24PH20

ModelFPC-05F-24PH20
PackageSMD, P=0.5mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU FPC-05F-24PH20
Type
XUNPU
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
FPC-05F-24PH20
Electronic Component
1
Package
SMD, P=0.5mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.486g
Electronic Component
0.5mm
Electronic Component
1
Electronic Component
BM0264908696
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
2mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
24P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FPC-05F-24PH20 FFC/FPC连接器产品概述

一、产品核心定位与应用场景

FPC-05F-24PH20是讯普(XUNPU)针对小型化电子设备高密度信号传输需求推出的24Pin FFC/FPC连接器,属于翻盖式锁定、下接触点、卧贴SMD封装类型。其核心优势在于紧凑尺寸与便捷装配,广泛适配以下场景:

  • 消费电子:智能手机、平板电脑的内部排线连接,智能手表/手环的传感器与主板对接;
  • 智能家居:智能音箱、门锁的控制模块与传感器排线;
  • 便携医疗:小型血糖仪、血压计的显示模块与主板连接;
  • 工业轻载:小型PLC、传感器模块的多通道信号传输。

二、关键参数与性能规格

该连接器参数围绕“小间距、高集成、易适配”设计,具体如下:

1. 电气性能

  • 额定电压:50V DC/AC,满足常规低功耗设备的信号+电源传输;
  • 额定电流:500mA/单引脚,适合数据、控制信号(非大功率电源)传输;
  • 触头材质:磷青铜(弹性好、导电性稳定,多次插拔后保持接触力);
  • 触头镀层:锡(焊接性优异,成本低于金镀层,常规环境防氧化)。

2. 机械性能

  • 触点数量:24Pin,支持多通道信号同步传输;
  • 引脚间距:0.5mm,实现高密度连接,节省PCB空间;
  • 适配电缆:FFC/FPC柔性扁平电缆(厚度0.3mm,与插入口尺寸匹配,保证接触紧密);
  • 板上高度:2mm,满足薄型设备内部空间限制(如智能手表内部高度仅3-5mm);
  • 安装方式:卧贴SMD(表面贴装,无穿孔设计,PCB布线灵活,兼容自动化生产)。

3. 环境性能

  • 工作温度:-25℃~+85℃,覆盖大多数消费电子与轻载工业场景(如冬季户外手环、夏季室内智能家居);
  • 湿度耐受:常规环境湿度≤85%下稳定工作。

三、结构设计与工艺特点

1. 翻盖式锁定结构

采用按压式翻盖锁定,无需工具装配:将FFC/FPC电缆对准插入口后,按下翻盖听到“咔嗒”声即锁定,电缆固定牢固;解锁时轻抬翻盖即可拔出,操作效率比插拔式高30%以上。

2. 下接触点设计

触点位于连接器底部,适配PCB正面安装,节省背面空间方便其他元器件布局;同时,下接触点与电缆上表面接触,减少电缆弯曲对接触力的影响。

3. 卧贴SMD封装

无引脚穿孔设计,避免PCB钻孔浪费空间;表面贴装兼容自动化贴片机,焊接效率高,且焊接后与PCB贴合紧密,降低振动导致的接触不良风险。

四、安装与适配注意事项

1. 安装步骤

  1. 预检查:确认FFC/FPC电缆的引脚数(24Pin)、间距(0.5mm)、厚度(0.3mm)与连接器匹配;
  2. 电缆插入:对准插入口,确保电缆绝缘标记(如蓝色/红色条)与连接器定位标识对齐;
  3. 锁定翻盖:按下翻盖至完全锁定,无松动;
  4. 焊接:SMD焊接温度控制在260℃±10℃,单引脚焊接时间≤3秒,避免高温损坏镀层。

2. 适配限制

仅适配0.5mm间距、0.3mm厚度的FFC/FPC电缆,过厚(≥0.4mm)导致翻盖无法锁定,过薄则接触不良;禁止使用硬排线(易损坏触头)。

五、可靠性与维护要点

1. 接触可靠性

磷青铜触头的弹性疲劳寿命≥100次插拔,多次拆装后接触电阻≤20mΩ;锡镀层在常规环境下防氧化,保证长期稳定传输。

2. 维护注意

  • 避免机械冲击(跌落、挤压),防止引脚变形或翻盖断裂;
  • 存储密封包装,放干燥通风处(湿度≤60%),避免触头氧化;
  • 氧化触头用无水酒精擦拭,禁止砂纸打磨(破坏镀层)。

六、选型对比参考

与同类型0.5mm间距24Pin连接器相比,FPC-05F-24PH20优势:

  • 板高仅2mm,比竞品低0.5-1mm,更适合薄型设备;
  • 翻盖锁定无需工具,装配效率更高;
  • 磷青铜+锡镀层成本低,适合中低端消费电子批量采购。

该连接器凭借紧凑结构、便捷装配与稳定性能,成为小型电子设备高密度连接的实用选择。

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