WMSIC Electronic Components

XUNPU WAFER-PH2.0-2PZZ

ModelWAFER-PH2.0-2PZZ
PackageThrough-hole, P=2mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-PH2.0-2PZZ
Type
XUNPU
Minimum package
2000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
WAFER-PH2.0-2PZZ
Electronic Component
1
Package
Through-hole, P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.13g
Electronic Component
2mm
Electronic Component
Electronic Component
PIN
2P
Electronic Component
1
Electronic Component
PH
Electronic Component
BM0262715245
Electronic Component
PA66
Electronic Component
Through-hole

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-PH2.0-2PZZ 产品概述

一、产品概述

WAFER-PH2.0-2PZZ 为 XUNPU(讯普)品牌线对板直插针座,属 PH 系列兼容规格,节距 P=2.0mm,排数 1 排、每排 2 PIN(1x2P)。该器件采用直插(Through-Hole)安装方式,适用于小电流、低电压的板对线连接场景,外形紧凑、可靠性高,常用于消费电子、通信设备、工业控制与物联网终端等空间受限的连接点。

二、主要电气与机械参数

  • 总 PIN 数:2P(1x2)
  • 节距(P):2.0 mm
  • 额定电流:2 A
  • 额定电压:250 V
  • 工作温度:-25 ℃ ~ +85 ℃
  • Z 轴(板上高度):6.05 mm
  • X 轴(板上底边长度,按间距线计):6.00 mm
  • Y 轴(板上底边宽度):4.70 mm

三、结构与材质

  • 触头材质:黄铜(良好导电性与机械强度)
  • 触头镀层:镀锡(提升焊接性与防腐蚀性能)
  • 塑料外壳:PA66;阻燃等级 UL94V-0(白色)
  • 安装方式:直插(插件)

四、性能与可靠性

  • 机械与电性能匹配常见低功耗应用,2A 额定电流满足多数信号与小功率供电要求;250V 额定电压适配一般板间/线间隔离需求。
  • 黄铜触点配合镀锡处理,具备良好导电性与表面焊接性能,同时对环境腐蚀有基本防护。
  • PA66(UL94V-0)外壳保证耐温与阻燃性,适合一般工业与民用环境。
  • 推荐遵循常规焊接与装配工艺,避免超过材料热稳定范围以保持长期可靠性。

五、典型应用场景

  • PCB 与线束间的电源/信号连接(小家电、LED 驱动、传感器模组)
  • 终端设备内部模块互联(路由、网关、智能家居)
  • 工业控制板的小电流分配与测试接口
  • 样品快速连接与开发板接口

六、安装与使用建议

  • 推荐 PCB 开孔与焊盘参考常规 PH 系列:间距 2.0mm,孔径建议约 0.8–1.0 mm(根据板材与波峰/手工焊工艺微调)。
  • 直插后可采用手工焊或波峰焊,焊接时注意勿过度加热塑料件,工艺温度与时间遵循 PA66 与元件耐热极限。
  • 插拔次数有限,建议用于固定连接或低频插拔场合;如需频繁插拔,建议选用专用连接器或加强型触点结构。
  • 存储与装配环境尽量干燥,避免长期潮湿以减少氧化与焊接困难。

七、包装与订购信息

  • 品牌:XUNPU(讯普)
  • 封装形式:插件,P=2.0mm
  • 产品型号:WAFER-PH2.0-2PZZ
  • 如需样品、批量报价或 3D/二维尺寸图,请提供订购数量与用途,以便提供更详细的技术支持与建议。

如需更详尽的 PCB 封装建议、焊接工艺参数或定制化要求(如镀层、镀金处理、耐温等级提升等),可进一步说明使用场景与环境条件。

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