WMSIC Electronic Components

XUNPU WAFER-GH1.25-10PWB

ModelWAFER-GH1.25-10PWB
PackageSMD,P=1.25mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-GH1.25-10PWB
Type
XUNPU
Minimum package
1000

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-GH1.25-10PWB
Electronic Component
1
Package
SMD,P=1.25mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.63g
Electronic Component
1.25mm
Electronic Component
Electronic Component
PIN
10P
Electronic Component
1
Electronic Component
GH
Electronic Component
BM0265583441
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-GH1.25-10PWB线对板针座产品概述

一、产品基本定位与典型应用场景

WAFER-GH1.25-10PWB是讯普(XUNPU)推出的GH系列线对板针座,聚焦小型化电子设备的低压小电流连接需求,核心定位为“紧凑尺寸+可靠焊接+标准化适配”。典型应用覆盖三类场景:

  1. 消费电子:智能手环、蓝牙耳机、便携音箱等微型设备的内部信号/电源连接;
  2. 智能家居:温湿度传感器、人体感应模块、小型控制器(如智能开关)的传输接口;
  3. 工业控制:微型PLC模块、传感器节点、小型执行器的内部连接(需结合环境验证)。

二、核心结构与尺寸参数

产品采用标准化GH系列设计,关键结构与尺寸如下:

  1. 插针结构:单排10针(1×10P),间距1.25mm,符合GH系列针座的行业通用规格;
  2. 安装方式:卧贴(SMD)封装,适配自动化贴片生产线,无需手工焊接;
  3. 辅助焊脚:额外设置辅助焊脚,提升焊接可靠性,减少虚焊、脱落风险;
  4. 关键尺寸:
    • Z轴(板上高度):4.35mm,降低设备整体厚度;
    • X轴(板上底边长度):15.75mm(10针×1.25mm+两端余量);
    • Y轴(板上底边宽度):5mm,占用PCB面积极小;
  5. 外观特征:米色塑料主体,便于生产过程中的视觉识别。

三、电气性能指标

满足常规低压小电流设备的核心需求:

  1. 额定参数:额定电流1A,额定电压125V,适配多数小型设备的功率范围;
  2. 触头性能:触头采用黄铜材质+锡镀层,接触电阻低且稳定,抗腐蚀能力强(长期使用不易氧化);
  3. 绝缘性能:LCP塑料主体绝缘电阻高,满足电气安全标准。

四、机械性能与环境适应性

  1. 温度范围:工作温度-25℃~+85℃,可适应北方冬季、南方夏季的室内环境;
  2. 机械强度:LCP塑料耐高温、耐冲击,触头黄铜材质具备良好插拔寿命(具体次数参考讯普官方规格);
  3. 焊接可靠性:辅助焊脚增强与PCB的焊接强度,适配回流焊工艺,降低批量生产不良率。

五、适配与安装特性

  1. 兼容性:可与讯普GH系列线端端子配套使用,实现线对板的完整连接(无需额外适配);
  2. 安装效率:卧贴SMD封装适合自动化贴片设备,生产效率高,减少人工成本;
  3. PCB适配:需在PCB上设计1.25mm间距焊盘,辅助焊脚需匹配对应焊盘位置,确保焊接稳定。

六、材料与环保特性

  1. 触头材质:黄铜+锡镀层,符合RoHS、REACH环保标准,无铅无有害物质;
  2. 塑料材质:LCP(液晶聚合物),环保耐老化,长期使用不释放有害物质;
  3. 包装方式:通常采用卷装或托盘包装,适合自动化生产(包装数量参考讯普官方规格)。

WAFER-GH1.25-10PWB凭借紧凑尺寸、可靠性能与标准化适配,成为小型化电子设备内部连接的优选组件之一,适用于对空间敏感的量产场景。

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