Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XUNPU TYPEC-324G-BCP24
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XUNPU TYPEC-324G-BCP24
- Type
- XUNPU
- Minimum package
- 900 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- XUNPU
- Electronic Component
- TYPEC-324G-BCP24
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- USB Connector
- Electronic Component
- 0.897g
- (L)
- 7.9mm
- Electronic Component
- 1
- Electronic Component
- USB 3.1
- Electronic Component
- BM0265370459
- Electronic Component
- Electronic Component
- Operating Temperature
- 45℃~+85℃
- Electronic Component
- 1
- Electronic Component
- 1
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TYPEC-324G-BCP24 USB 3.1 Type-C 卧贴连接器产品概述
一、产品定位与典型应用
TYPEC-324G-BCP24是讯普（XUNPU）推出的紧凑型全功能Type-C母座，专为需要「高速数据传输+大电流供电+小型化布局」的电子设备设计。核心定位是兼顾性能与空间效率，适配中高端便携、工业、消费电子场景，典型应用包括：
- 便携设备：智能手表、无线耳机充电盒、5A快充移动电源；
- 工业终端：小型PLC模块、物联网网关、工业传感器节点；
- 消费电子：蓝牙音箱、智能遥控器、微型投影仪；
- 医疗电子：便携式监护仪、血糖仪（快充/低功耗需求）。
二、核心技术参数详解
该连接器参数精准匹配设备需求，关键指标如下：
- 接口与协议：Type-C母座，兼容USB 3.1 Gen1（理论传输速率5Gbps），向下兼容USB 2.0/1.1；
- 电气性能：额定电源电流5A（支持PD快充），额定电压30V，24Pin全功能触点（覆盖数据、电源、CC控制通道）；
- 物理尺寸：体长7.9mm，封装尺寸7.9×8.94×3.16mm（长×宽×高），卧贴SMD设计无引脚突出；
- 可靠性参数：插拔寿命≥1万次，满足频繁插拔场景；
- 环境适应性：工作温度-45℃~+85℃，黑色胶芯耐温耐腐蚀。
三、结构设计与工艺优势
- 小型化紧凑布局：体长仅7.9mm，封装高度3.16mm，适配PCB高密度布局（如便携设备窄边框），节省设备内部空间；
- 卧贴SMD工艺：表面贴装无通孔引脚，支持回流焊自动化生产，贴装精度高，降低人工成本与焊接不良率；
- 触点与胶芯优化：24Pin全功能触点采用耐磨材料（讯普工艺保障接触稳定性），黑色PBT胶芯耐温性强，避免高温变形；
- 品牌工艺沉淀：讯普作为专业连接器厂商，产品经过振动、冲击、盐雾测试，性能一致性可靠。
四、可靠性与环境适应性
- 长寿命插拔：≥1万次插拔寿命（按每天10次计算，可用近3年），满足便携设备频繁插拔需求；
- 宽温工作范围：-45℃~+85℃覆盖工业级与消费级环境，适配户外设备（低温地区终端）、车载辅助设备；
- 电气稳定性：额定5A电流下长期工作无发热异常，触点接触电阻低于行业标准，保障数据与供电可靠性。
五、安装与系统兼容性
- 便捷安装：SMD卧贴设计无需钻孔，仅需PCB对应焊盘，支持回流焊/波峰焊（适配工艺），适配自动化生产线；
- 全场景兼容：
- 协议兼容：USB 3.1/2.0/1.1，支持PD3.0快充（5A电流）；
- 接口兼容：与所有Type-C公头匹配（全功能、快充、数据传输场景）；
- 平台适配：兼容主流MCU/SoC（STM32、高通、联发科等），无需额外适配电路。
总结：TYPEC-324G-BCP24凭借高速传输、大电流、小型化与高可靠性，成为便携设备、工业终端等领域的高性价比Type-C连接器选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
