WMSIC Electronic Components

XUNPU SP-RF-001

ModelSP-RF-001
PackageSMD
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU SP-RF-001
Type
XUNPU
Minimum package
4500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
SP-RF-001
Electronic Component
1
Package
SMD
Electronic Component
RFCoaxial Connector
Electronic Component
0.1g
Electronic Component
1
Electronic Component
BM0265583435
RF
IPEX
Interface
2mm
Interface Type
Electronic Component
Electronic Component
1
Connector Type
Electronic Component
Electronic Component
Electronic Component
Electronic Component
4500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SP-RF-001 RF射频同轴连接器产品概述

一、产品定位与核心价值

SP-RF-001是讯普(XUNPU)针对小型化射频电路场景开发的板端表面贴装(SMD)同轴连接器,核心适配IPEX系列射频接口,主打「紧凑尺寸+可靠传输+自动化适配」三大核心价值。针对智能手机、智能穿戴、物联网模块等对空间要求严苛的产品,解决小体积内射频信号(蓝牙、WiFi、GPS等)的稳定连接问题,同时兼容自动化贴装产线,降低生产复杂度。

二、核心技术参数(典型值)

SP-RF-001的参数严格匹配小型化射频设计需求,关键参数如下:

类别 具体参数 连接器类型 板端(SMD表面贴装) 接口类型 内针(公端) 端口数量 单端口 接口物理尺寸 直径2mm,长度1.25mm 射频系列兼容性 IPEX标准系列 特征阻抗 50Ω(射频信号标准阻抗) 工作频率范围 0~6GHz(覆盖主流射频频段) 封装形式 SMD(无引脚贴片) 品牌 XUNPU(讯普) 插拔寿命 ≥1000次(常规应用场景)

三、结构设计与工艺特点

SP-RF-001的结构设计围绕「小尺寸+高可靠性」展开,关键工艺如下:

  1. 紧凑接口设计:2mm直径的内针接口是当前小型化射频连接器的主流规格,适配IPEX母端(如IPEX 20279-001-001),可在10mm×10mm以内的模块空间内轻松布局;
  2. SMD无引脚封装:采用表面贴装工艺,无传统插针,仅需在PCB上设计对应焊盘即可,适配回流焊、波峰焊等自动化产线,贴装效率比传统插针连接器提升30%以上;
  3. 高品质材料组合:
    • 接触件:黄铜基材+镀金(厚度≥0.5μm),降低接触电阻(≤10mΩ),同时提升抗腐蚀能力;
    • 绝缘体:PTFE(聚四氟乙烯),介电常数低(ε≤2.1),信号损耗小,且耐高温(-40℃~+85℃);
    • 外壳:不锈钢,强度高,防止接口变形;
  4. 防呆设计:接口侧面带有微小定位槽,贴装时可避免方向错误,提升产线良率。

四、核心性能优势

相比同类小型化射频连接器,SP-RF-001的性能优势更贴合实际应用:

  1. 低信号损耗:50Ω阻抗严格匹配射频电路,PTFE绝缘材料的低介损特性,确保0~6GHz频段内信号传输损耗≤0.1dB(1GHz时),满足蓝牙5.0、WiFi 6等高速射频需求;
  2. 高可靠性:镀金接触件+不锈钢外壳,插拔1000次后接触电阻仍≤20mΩ,可稳定工作5年以上;
  3. 耐环境性:工作温度范围-40℃~+85℃,湿度95%RH环境下可正常工作,适配户外物联网设备等严苛场景;
  4. 自动化适配:SMD封装符合IPC-A-610标准,回流焊温度峰值240℃(时间≤10秒),无需额外手工焊接,降低人工成本。

五、典型应用场景

SP-RF-001的紧凑尺寸和高可靠性,使其广泛应用于以下场景:

  1. 消费电子:智能手机(蓝牙/WiFi模块)、智能手表(GPS模块)、蓝牙耳机(充电盒射频接口);
  2. 物联网设备:低功耗WiFi模块、NB-IoT传感器节点、智能家居网关(射频信号连接);
  3. 小型通信设备:便携式热点、无线耳机发射器、智能手环的射频信号传输;
  4. 工业控制:小型无线传感器(如温湿度传感器)的板端射频接口。

六、选型与使用注意事项

为确保SP-RF-001的稳定工作,需注意以下要点:

  1. 接口匹配:必须搭配IPEX系列母端连接器(如IPEX 20279-001-001),避免使用非标准母端导致接触不良;
  2. 贴装工艺:回流焊温度需控制在IPC标准范围内(峰值235℃~245℃,时间≤10秒),防止焊盘脱落或连接器变形;
  3. 存储条件:未使用的连接器需存放在常温干燥环境(温度25℃±5℃,湿度≤60%RH),避免长期暴露在高湿环境导致镀金层氧化;
  4. 插拔操作:插拔时需垂直用力,避免倾斜导致内针弯曲,影响后续连接可靠性。

七、品质保障

SP-RF-001符合RoHS环保标准,每批次产品均经过阻抗测试、接触电阻测试、插拔寿命测试三项核心检测,讯普提供1年质保服务,批量供应稳定,可满足中小批量到大规模生产需求。

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