WMSIC Electronic Components

XUNPU DSHP-02-TS-GER

ModelDSHP-02-TS-GER
PackageSMD,P=1.27mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU DSHP-02-TS-GER
Type
XUNPU
Minimum package
2000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
DSHP-02-TS-GER
Electronic Component
1
Package
SMD,P=1.27mm
Type
Flat slide
Electronic Component
DIP Switch
Electronic Component
0.257g
Electronic Component
Electronic Component
Pitch
1.27mm
Electronic Component
1
Electronic Component
BM0265845884
Electronic Component
3
Positions
2 positions
Circuit Structure
SPST
Voltage
24V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DSHP-02-TS-GER 平拨式开关产品概述

一、产品核心身份与定位

DSHP-02-TS-GER是讯普(XUNPU) 品牌推出的2位平拨凹槽式开关,采用单刀单掷(SPST)电路结构,搭载SMD表贴封装,专为小型化、低功耗电子设备的功能切换场景设计。其核心定位是兼顾操作便捷性与空间适配性,无需复杂电路即可实现两路通断控制,适配设备模式选择、参数配置等非高频操作需求。

二、关键性能参数详解

(1)电气性能

  • 额定电流:25mA(直流),适用于低功耗电路(如传感器节点、小型控制器),无需额外限流保护;
  • 额定电压:24V(直流),覆盖多数低压电子设备的工作范围(智能家居、便携式仪器等);
  • 接触电阻:典型值≤50mΩ,确保信号传输稳定,无明显压降影响设备性能。

(2)机械性能

  • 开关位数:2位,可独立控制两路通断,支持“单功能切换”或“双功能组合”(如“模式1+模式2”);
  • 脚间距:1.27mm,符合SMD封装标准间距,与多数PCB设计兼容,无需特殊布线;
  • 工作寿命:3千次,满足非高频操作场景(如设备出厂校准、日常模式切换,而非实时调节);
  • 操作力:典型值100-200gf,手感适中,避免过轻误触或过重操作疲劳。

(3)外观与材质

  • 颜色:黑色,视觉辨识度高,适配多数设备的中性外观设计,耐磨涂层不易因日常操作褪色;
  • 外壳材质:工程塑料(PC/ABS),耐高低温(-20℃至+85℃),适合不同环境下的稳定使用。

三、封装与安装适配性

DSHP-02-TS-GER采用SMD表贴封装(P=1.27mm),具有三大核心优势:

  1. 空间高效:无引脚穿透设计,仅需PCB表面焊盘布局,比通孔(DIP)封装节省30%以上空间,适配轻薄化设备;
  2. 生产适配:符合SMT贴片工艺,可通过贴片机快速组装,提升生产效率,降低人工成本;
  3. 操作防误:顶部凹槽深度约0.5mm,手指可直接嵌入拨动,或配合小镊子精准切换,相比传统拨杆开关,误触概率降低40%(讯普内部测试数据)。

四、典型应用场景

该开关的性能与封装特点,使其精准匹配以下场景:

  1. 便携式仪器:小型万用表的“量程锁定”“数据保持”切换,手持测温仪的“℃/℉”单位转换;
  2. 智能家居:智能插座的“定时模式”“离家模式”选择,智能灯的“亮度调节模式”切换;
  3. 小型医疗设备:血糖仪的“校准模式”“数据导出模式”,雾化器的“雾量档位”选择;
  4. 工业控制:传感器节点的“参数配置”“休眠模式”切换,小型PLC的“手动/自动”模式选择;
  5. 消费电子:蓝牙音箱的“EQ模式”(摇滚/古典)切换,无线耳机充电盒的“配对模式”选择。

五、品牌与可靠性保障

讯普(XUNPU)作为国内开关元器件制造商,DSHP-02-TS-GER经过严格可靠性测试:

  • 高低温循环:-20℃至+85℃循环50次,性能无衰减;
  • 振动测试:符合GB/T 2423.10标准(10-500Hz/2g),测试后接触电阻变化≤10%;
  • 耐湿测试:90%RH/40℃放置96小时,无氧化、功能异常。

其3千次工作寿命符合非高频操作场景的设计预期,长期使用稳定性可靠。

该产品以“小体积、易操作、高适配”为核心优势,成为小型电子设备功能切换的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.