WMSIC Electronic Components

XUNPU WAFER-XH2.54-2PZZ

ModelWAFER-XH2.54-2PZZ
PackageThrough-hole, P=2.5mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-XH2.54-2PZZ
Type
XUNPU
Minimum package
2000

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-XH2.54-2PZZ
Electronic Component
1
Package
Through-hole, P=2.5mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.23g
Electronic Component
2.5mm
Electronic Component
Electronic Component
PIN
2P
Electronic Component
1
Electronic Component
XH
Electronic Component
BM0227486425
Electronic Component
PA66
Electronic Component
Through-hole
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-XH2.54-2PZZ 线对板针座产品概述

WAFER-XH2.54-2PZZ是讯普(XUNPU)推出的一款1排2Pin直插式线对板针座,适配XH系列标准2.5mm间距,专为小功率电子设备的线板连接设计,兼具可靠性与安装便捷性,广泛应用于消费电子、小型家电等领域。

一、核心基础参数梳理

该针座的关键参数围绕“小尺寸、高适配”设计,具体如下:

参数类别 具体参数 结构规格 1排2Pin(1×2P),间距2.5mm 安装方式 直插式(插件),无需额外固定件 电气性能 额定电流2A,额定电压250V;工作温度-25℃~+85℃ 材质工艺 触头:黄铜+锡镀层;塑料:PA66(UL94V-0阻燃) 尺寸参数 Z轴板上高度7mm;X轴底边长度7.5mm;Y轴底边宽度5.9mm 外观与品牌 白色外观,讯普(XUNPU)原厂出品

注:参数符合XH系列行业标准,与同类端子(如XH-2P端子)完全兼容。

二、产品核心特性解析

  1. 电气连接可靠
    黄铜触头搭配锡镀层,接触电阻低(≤10mΩ),抗氧化、抗腐蚀性能优异,2A额定电流可满足大多数小功率设备(如5V/1A供电电路)的电流需求,长期使用无接触不良问题。

  2. 机械稳定性强
    直插式安装方式贴合PCB板,针脚设计紧凑;7mm的板上高度适配小型化设备(如智能手环、迷你加湿器)的内部空间,避免占用过多体积;塑料件采用PA66材质,强度高,不易变形。

  3. 环境适应性达标
    工作温度覆盖-25℃~+85℃,可适应室内外不同环境(如北方冬季低温、南方夏季高温);UL94V-0阻燃等级,符合电子设备安全标准,降低火灾风险。

  4. 安装操作便捷
    标准2.5mm间距与XH系列端子完美匹配,压接时使用配套工具即可快速完成端子与针座的连接;直插焊接时,针脚长度适配普通电烙铁操作,焊接时间≤3s即可完成,无需特殊设备。

三、典型应用场景

WAFER-XH2.54-2PZZ因尺寸小、可靠性高,主要应用于以下场景:

  • 小型家电:加湿器、香薰机、小型电风扇的内部线板连接;
  • 消费电子:智能手环充电座、蓝牙音箱、无线耳机充电盒的供电/信号连接;
  • 工业控制:小型传感器模块(如温度传感器、湿度传感器)与PLC的辅助电路连接;
  • 车载小设备:车载充电器、氛围灯、行车记录仪的内部布线连接。

四、选型与使用注意事项

  1. 匹配端子:需搭配讯普XH系列2Pin端子(如XH-2P压接端子)使用,避免非标准端子导致接触不良;
  2. 焊接规范:锡焊温度不超过350℃,焊接时间≤3s,避免高温损坏塑料件;
  3. 存储要求:存放在干燥、通风环境,温度-10℃~+40℃,避免阳光直射与腐蚀性气体接触;
  4. 压接要求:使用XH系列专用压接钳,确保端子与针脚紧密贴合,压接后拉力≥10N(行业标准)。

该产品凭借“小尺寸、高兼容、易安装”的特点,成为众多小功率电子设备线板连接的优选方案,可满足不同场景下的稳定连接需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.