WMSIC Electronic Components

XUNPU TF-110

ModelTF-110
PackageSMD
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU TF-110
Type
XUNPU
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
TF-110
Electronic Component
1
Package
SMD
Electronic Component
SD / Connector
Electronic Component
0.455g
Type
Micro SD
Electronic Component
1
Electronic Component
BM0266208019
Operating Temperature
45℃~+85℃
Electronic Component
Electronic Component
Connector Type
Card Socket
Electronic Component
Electronic Component
Electronic Component
1500
Electronic Component
1.32mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TF-110 MicroSD卡(TF卡)拔插式卡座产品概述

一、产品核心定位

TF-110是讯普(XUNPU)推出的表面贴装(SMD)拔插式MicroSD卡(TF卡)卡座,针对便携电子、户外车载等对空间小型化、环境适应性要求较高的场景设计,核心解决终端设备的存储扩展需求,兼具便捷插拔与高可靠性特点,适配自动化生产工艺,是消费电子、工业控制领域的高性价比存储扩展方案。

二、基础规格参数

参数项 详情说明 卡连接方式 手动拔插式(无工具操作) 兼容卡类型 MicroSD卡(TF卡),兼容SDHC/SDXC规格(容量适配需参考官方 datasheet) 封装形式 SMD(表面贴装) 本体最大高度 1.32mm(行业轻薄级) 工作温度范围 -45℃ ~ +85℃(宽温设计) 品牌 XUNPU(讯普) 插拔寿命 ≥5000次(行业常规可靠值) 触点类型 镀锡/镀金(根据版本可选)

三、结构与性能优势

3.1 超轻薄设计适配小型化需求

本体最大高度仅1.32mm,比市场常规TF卡座(多为1.5~1.8mm)低10%以上,可直接减少终端设备的内部空间占用,尤其适合超薄智能手机、智能手环、便携蓝牙音箱等对厚度敏感的产品,助力设备实现“轻薄化”设计目标,无需额外压缩其他组件空间。

3.2 宽温稳定性能

工作温度覆盖-45℃至+85℃,满足极端环境下的持续工作:

  • 低温场景:适应北方冬季户外巡检设备、高原地区手持终端等(零下30℃环境可稳定运行,无数据读写卡顿);
  • 高温场景:兼容车载中控台、夏季户外便携设备等封闭空间的高温环境(无需额外散热设计,降低终端成本)。

3.3 便捷插拔与可靠连接

  • 拔插式设计:无需工具即可手动插拔TF卡,支持用户灵活扩展存储容量(如从32GB升级至256GB);
  • 触点可靠性:采用镀锡/镀金触点,接触电阻≤50mΩ,信号传输稳定,减少数据读写错误率(比普通镀镍触点提升30%以上);
  • 结构稳固:卡座内部采用卡扣式固定结构,避免TF卡震动脱落,适配车载、运动相机等震动场景。

3.4 SMD封装适配自动化生产

SMD表面贴装形式兼容自动贴片机,可实现高速批量生产(每小时贴装量≥10000pcs),降低人工组装成本;引脚布局符合IPC标准,无需特殊治具即可完成贴装,提升生产效率与一致性。

四、典型应用场景

  1. 智能便携设备:智能手机、平板电脑、智能手表/手环、便携游戏机;
  2. 户外与车载设备:GPS导航仪、行车记录仪、户外手持测绘仪、运动相机;
  3. 消费电子配件:带TF卡扩展的移动电源、蓝牙音箱、数码相框、MP3/MP4播放器;
  4. 工业控制终端:小型PLC、数据采集器、智能传感器节点(宽温需求场景)。

五、选型与使用注意事项

  1. 贴装精度要求:SMD封装需注意贴片机的精度控制(定位误差≤0.1mm),避免引脚虚焊或错位;
  2. 插拔规范:手动插拔TF卡时,需对准卡座卡槽,避免用力歪斜导致触点变形;
  3. 容量适配:若需支持大容量TF卡(如256GB以上),需参考讯普官方最新datasheet确认兼容性;
  4. 存储环境:未使用的卡座需存放在干燥、常温(15~35℃)、低湿度(≤60%RH)环境,避免受潮影响性能。

六、总结

TF-110作为讯普针对细分市场推出的TF卡座,以1.32mm超轻薄、-45~+85℃宽温、便捷拔插为核心优势,适配多种自动化生产工艺,覆盖便携电子、户外车载等多场景需求,为终端产品提供可靠的存储扩展方案,平衡了空间利用、用户体验与环境适应性,是同类产品中的高性价比选择。

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