WMSIC Electronic Components

XUNPU FPC-05FB-20PH20

ModelFPC-05FB-20PH20
PackageSMD, P=0.5mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU FPC-05FB-20PH20
Type
XUNPU
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
FPC-05FB-20PH20
Electronic Component
1
Package
SMD, P=0.5mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.489g
Electronic Component
0.5mm
Electronic Component
1
Electronic Component
BM0265583434
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
2mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
20P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FPC-05FB-20PH20 FFC/FPC连接器产品概述

一、产品基础信息

FPC-05FB-20PH20是讯普(XUNPU) 品牌推出的小型化FFC/FPC连接器,专为轻薄电子设备的柔性电路连接设计。核心规格为:表面贴装(SMD)封装、针脚间距0.5mm、触点数量20Pin,完全适配主流FFC/FPC柔性电缆,是便携电子、小型智能设备的理想连接方案。

二、核心结构设计特性

1. 翻盖式锁定机制

采用翻盖式锁定设计,无需工具即可操作:轻翻锁盖插入电缆后闭合,锁盖机械结构紧密卡合,有效抵抗振动、冲击,避免电缆脱落,连接可靠性显著提升。

2. 双侧触点/上下接结构

不同于单侧触点,该连接器采用双侧触点(上下接) 设计——电缆插入后上下触点同时接触导体,接触面积更大、力分布均匀,减少接触电阻与信号损耗,避免单侧接触不良导致的中断问题。

3. 低-profile紧凑设计

板上高度仅2mm,针脚间距0.5mm,整体尺寸极致紧凑,完美适配智能手表、蓝牙耳机等对空间严苛的设备,节省PCB布局空间,助力设备轻薄化。

三、电气与环境性能参数

1. 电气性能

  • 额定电压:50V(AC/DC通用),满足小功率信号与低功耗电力传输;
  • 额定电流:500mA/每Pin,适配多数便携设备的供电与信号传输;
  • 触头材质:磷青铜,弹性、耐磨性优异,长期使用不易变形;
  • 触头镀层:锡镀层,导电稳定且防氧化,延长使用寿命。

2. 环境适应性

工作温度范围**-25℃~+85℃**,覆盖家庭、办公、户外常规场景,高低温交替下性能稳定,无需额外防护即可满足一般设备可靠性要求。

四、安装与适配要求

1. 安装方式

采用卧贴(SMD) 安装,可通过SMT工艺直接贴装PCB,适配自动化生产,提升效率;同时避免插件式穿孔工艺,进一步节省PCB空间。

2. 电缆适配

仅支持0.3mm厚度的FFC/FPC柔性电缆(市场主流规格),无需定制电缆,降低系统集成成本。

五、典型应用场景

FPC-05FB-20PH20凭借紧凑尺寸与可靠性能,广泛应用于:

  1. 消费电子:智能手机、平板、智能手表、蓝牙耳机的内部连接(屏幕/电池与主板);
  2. 智能家居:智能音箱、门锁、小型安防设备的模块连接;
  3. 小型医疗器械:便携式血糖仪、血压计的信号传输;
  4. 汽车电子:车载小型显示屏、音响的柔性连接(非高压场景);
  5. 工业控制:小型PLC模块、传感器节点的内部电路连接。

六、产品优势总结

  • 高可靠性:翻盖锁定+双侧触点,抗振动、接触稳定,故障风险低;
  • 小型化:2mm板高+0.5mm间距,适配轻薄设备设计;
  • 易集成:卧贴SMD+通用0.3mm电缆,适配自动化生产与主流柔性电缆;
  • 稳定耐用:磷青铜触头+锡镀层,宽温范围,长期性能可靠;
  • 成本友好:讯普成熟工艺,性价比高,适合批量应用。

该产品平衡了小型化、可靠性与成本,是轻量电子设备柔性连接的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.