WMSIC Electronic Components

XUNPU WAFER-PH2.0-5PZZ

ModelWAFER-PH2.0-5PZZ
PackageThrough-hole, P=2mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-PH2.0-5PZZ
Type
XUNPU
Minimum package
2000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
WAFER-PH2.0-5PZZ
Electronic Component
1
Package
Through-hole, P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.25g
Electronic Component
2mm
Electronic Component
Electronic Component
PIN
5P
Electronic Component
1
Electronic Component
PH
Electronic Component
BM0257623460
Electronic Component
PA66
Electronic Component
Through-hole

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-PH2.0-5PZZ 线对板针座产品概述

一、产品核心身份与应用定位

WAFER-PH2.0-5PZZ是讯普(XUNPU)品牌PH系列的单排5针直插式线对板针座,核心间距2.0mm,属于小间距、高可靠的电子连接组件。该产品定位在中低功率电子设备的信号与电力传输场景,兼顾紧凑空间适配性与长期使用稳定性,是工业控制、消费电子、汽车辅助电路等领域的常用连接方案。

二、关键电气性能参数

产品电气性能满足常规电子设备的核心需求:

  • 额定电流:2A(AC/DC通用),可稳定传输小功率电力(如传感器供电)与数字/模拟信号;
  • 额定电压:250V(AC),覆盖低压交流/直流应用,避免绝缘击穿风险;
  • 工作温度范围:-25℃~+85℃,适应室内外常规环境(如家庭、工业车间、户外小型终端),无需额外温控;
  • 接触可靠性:黄铜触头+锡镀层设计,接触电阻低且稳定,长期使用无氧化失效问题。

三、机械结构与工艺细节

机械设计兼顾紧凑性与安装便利性:

  • 插针结构:单排5针(1x5P),总PIN数5,符合PH系列2.0mm间距标准;
  • 安装方式:直插式(插件封装),适配PCB板钻孔焊接,工艺成熟且无需特殊工具;
  • 尺寸参数:
    • Z轴(板上垂直高度):6.05mm,节省PCB垂直空间,适合薄型设备;
    • X轴(板上边线长度):12mm,单排5针的间距方向总长度,便于PCB布局;
    • Y轴(板上横向宽度):4.7mm,横向尺寸紧凑,减少PCB占用面积;
  • 触头工艺:黄铜触头经精密加工,锡镀层厚度均匀,保证插拔次数与接触稳定性。

四、材料选型与可靠性保障

材料选择聚焦安全、耐候、可靠三大核心:

  • 塑料主体:PA66(尼龙66)材质,机械强度高(耐冲击、抗变形),耐温性匹配工作温度范围;
  • 阻燃等级:UL94V-0级,属于高阻燃标准,遇火时仅自熄不蔓延,符合电子设备安全规范;
  • 触头材料:黄铜(高导电率、易加工),锡镀层(抗氧化、降低接触电阻),避免长期使用中接触不良;
  • 外观颜色:白色,便于设备内部识别与外观统一,无特殊污染风险。

五、安装适配与兼容性

  • PCB适配:直插式封装适配常规FR-4等PCB板,钻孔直径与插针尺寸匹配,焊接后牢固可靠;
  • 系列兼容性:完全兼容PH系列2.0mm间距的线端连接器(如PH2.0端子线),可实现线对板的稳定对接;
  • 安装注意点:焊接温度建议控制在260℃以下(持续时间≤3秒),避免塑料主体变形;插针需与PCB钻孔对齐,防止虚焊。

六、典型应用场景

该产品因紧凑尺寸与可靠性能,广泛应用于:

  1. 消费电子:小型家电(加湿器、智能插座、空气净化器)、数码产品(便携音箱、智能手环充电座)的内部连接;
  2. 工业控制:小型PLC模块、传感器接口(温度/压力传感器)、小型继电器组的信号传输;
  3. 汽车电子:低压辅助电路(车内照明、小功率执行器、车载充电器接口);
  4. 通信设备:小型基站模块、路由器/交换机的内部模块连接、光模块接口。

整体而言,WAFER-PH2.0-5PZZ凭借PH系列的成熟设计、可靠的电气与机械性能,成为小间距线对板连接的高性价比选择,可满足多领域电子设备的连接需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.