WMSIC Electronic Components

XUNPU WAFER-MX1.25-3PWB

ModelWAFER-MX1.25-3PWB
PackageSMD,P=1.25mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-MX1.25-3PWB
Type
XUNPU
Minimum package
2000

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-MX1.25-3PWB
Electronic Component
1
Package
SMD,P=1.25mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.29g
Electronic Component
1.25mm
Electronic Component
Electronic Component
PIN
3P
Electronic Component
1
Electronic Component
PicoBlade(MX 1.25)
Electronic Component
BM0265062309
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-MX1.25-3PWB 线对板针座产品概述

WAFER-MX1.25-3PWB是讯普(XUNPU)推出的一款小间距线对板连接针座,适配PicoBlade(MX 1.25)系列接插件,专为小型化电子设备的信号与低功率电源传输设计。产品采用卧贴SMD封装,结构紧凑、性能稳定,能满足多数紧凑空间的连接需求。

一、产品核心定位与基础参数

该针座属于1排3Pin单排针座,间距1.25mm(行业标准小间距规格),总PIN数3P,安装方式为卧式表面贴装(SMD)。外观为米色,是线对板连接中常用的标准化针座类型——通过与对应端子配合,实现线缆与PCB板的可靠连接。

核心基础参数需重点关注:

  • 电气额定值:1A(电流)、125V(电压),适配小功率信号/电源传输;
  • 尺寸规格:Z轴板上高度3.6mm,X轴底边长度8.75mm,Y轴宽度5.25mm,适合高密度PCB布局;
  • 附加特征:带辅助焊脚,可增强焊接强度与机械稳定性。

二、结构设计与材料特性

1. 紧凑结构适配小型化需求

卧贴设计是该针座的核心优势:与立贴相比,卧贴可降低PCB板的Z轴高度占用,更适合手机、智能穿戴等对厚度敏感的设备。同时,1.25mm小间距在保证连接可靠性的前提下,大幅减少了PCB占位面积,适配高密度布线场景。

2. 材料选择兼顾性能与成本

  • 塑料主体:采用LCP(液晶聚合物)材质,具备优异的耐高温性(可承受焊接高温)、尺寸稳定性(不易变形)与耐化学性,适配SMT回流焊工艺;
  • 触头组件:触头基材为黄铜(导电性能优异),表面镀锡(Sn),可降低接触电阻、提升抗氧化能力,保证长期连接可靠性;
  • 辅助焊脚:额外设计的辅助焊脚可增加与PCB的焊接点数量,减少焊接应力对触头的影响,同时防止针座在使用中脱落或移位。

三、电气与环境性能指标

该针座的性能参数完全覆盖常规电子设备的使用场景:

  • 电气性能:额定电流1A(AC/DC通用)、额定电压125V,满足多数消费电子、小型工业设备的信号传输与低功率供电需求;
  • 环境适应性:工作温度范围-25℃~+85℃,可适应室内常温至部分户外低温/高温环境(如智能家居控制器、小型传感器模块);
  • 接触可靠性:锡镀层触头的接触电阻低(通常≤20mΩ),插拔次数可达数百次(与对应端子配合),能满足常规设备的寿命要求。

四、安装与可靠性优势

1. 自动化贴装适配量产

卧贴SMD封装完全兼容自动化贴片机,无需额外手工焊接,可提升产线效率,降低人工成本,适合批量生产场景;

2. 焊接与机械稳定性

辅助焊脚设计是提升可靠性的关键:除触头焊接点外,辅助焊脚可进一步固定针座,减少振动、冲击对连接的影响(如车载小型配件、手持设备);

3. 工艺兼容性

LCP塑料主体可承受SMT回流焊的高温(260℃左右),不会出现变形、开裂等问题,适配主流电子制造工艺。

五、典型应用场景

WAFER-MX1.25-3PWB因小尺寸、小电流、高可靠性的特点,广泛应用于以下领域:

  • 消费电子:智能穿戴(手环、手表内部连接)、蓝牙耳机(充电仓与电池连接)、小型音频设备;
  • 工业控制:小型传感器模块(温度、湿度传感器)、微型控制器(PLC子模块);
  • 智能家居:智能灯控、小型安防设备(无线摄像头内部连接);
  • 汽车电子:车载小型配件(USB接口模块、氛围灯控制器)。

总结来说,WAFER-MX1.25-3PWB是一款性价比高、适配性强的小间距线对板针座,能满足多数小型化电子设备的连接需求,尤其适合对尺寸、量产效率有要求的应用场景。

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