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WAFER-MX1.25-3PWB是讯普(XUNPU)推出的一款小间距线对板连接针座,适配PicoBlade(MX 1.25)系列接插件,专为小型化电子设备的信号与低功率电源传输设计。产品采用卧贴SMD封装,结构紧凑、性能稳定,能满足多数紧凑空间的连接需求。
该针座属于1排3Pin单排针座,间距1.25mm(行业标准小间距规格),总PIN数3P,安装方式为卧式表面贴装(SMD)。外观为米色,是线对板连接中常用的标准化针座类型——通过与对应端子配合,实现线缆与PCB板的可靠连接。
核心基础参数需重点关注:
卧贴设计是该针座的核心优势:与立贴相比,卧贴可降低PCB板的Z轴高度占用,更适合手机、智能穿戴等对厚度敏感的设备。同时,1.25mm小间距在保证连接可靠性的前提下,大幅减少了PCB占位面积,适配高密度布线场景。
该针座的性能参数完全覆盖常规电子设备的使用场景:
卧贴SMD封装完全兼容自动化贴片机,无需额外手工焊接,可提升产线效率,降低人工成本,适合批量生产场景;
辅助焊脚设计是提升可靠性的关键:除触头焊接点外,辅助焊脚可进一步固定针座,减少振动、冲击对连接的影响(如车载小型配件、手持设备);
LCP塑料主体可承受SMT回流焊的高温(260℃左右),不会出现变形、开裂等问题,适配主流电子制造工艺。
WAFER-MX1.25-3PWB因小尺寸、小电流、高可靠性的特点,广泛应用于以下领域:
总结来说,WAFER-MX1.25-3PWB是一款性价比高、适配性强的小间距线对板针座,能满足多数小型化电子设备的连接需求,尤其适合对尺寸、量产效率有要求的应用场景。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
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Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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