Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMC-202-6 是一款高性能的自弹式 MicroSIM卡连接器,由知名品牌 XUNPU(讯普)制造,采用表面贴装(SMD)封装设计。这款产品专为便捷连接和稳定信号传输而设计,适用于各种电子设备,如智能手机、平板电脑、移动终端设备及 IoT 设备等。
自弹式设计: SMC-202-6 的自弹式设计使得 MicroSIM 卡在插入后能够自动弹出,用户体验极为方便。这种设计减少了用户在使用时的操作繁琐性,同时提升了使用的可靠性。
紧凑型封装: 1.35mm 的高度使得该连接器非常适合当今市场对超薄设备的需求。小巧的体积不仅帮助设计师节省空间,同时能够满足现代电子设备轻薄化的趋势。
高可靠性: 该产品采用高质量的材料和精密的制造工艺,确保长时间使用过程中的接触稳定性和耐用性,适合各种环境下的使用。
广泛的兼容性: SMC-202-6 设计兼容多种 MicroSIM 卡和相关设备,适合广泛的应用场景。无论是消费电子产品,还是专业通信设备均可应用此连接器。
易于安装: 作为表面贴装(SMD)元件,SMC-202-6 支持自动化生产线的贴装工艺,提高了生产效率和装配精度。
SMC-202-6 适用场合极为广泛,主要应用于以下领域:
XUNPU(讯普)凭借多年的行业经验和技术积累,将创新和高品质融入每一款产品中,SMC-202-6 作为旗下产品,凭借其卓越的性能和可靠性,得到了市场的广泛认可。随着5G通信、物联网及智能设备的发展,MicroSIM卡连接器需求不断攀升,而这款产品的推出正好满足了市场对高品质、高兼容性连接器的需求。
总之,SMC-202-6 自弹式 MicroSIM卡连接器是一款兼具高性能与易用性的电子元器件,广泛适用于各类设备的连接需求。其自弹式设计、高可靠性和紧凑型封装,使其成为现代电子产品理想的选择。作为一个致力于技术创新与高品质的品牌,XUNPU(讯普)将继续为客户提供卓越的电子元器件解决方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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