WMSIC Electronic Components

XUNPU WAFER-SH1.0-4PLB

ModelWAFER-SH1.0-4PLB
PackageSMD,P=1.0mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-SH1.0-4PLB
Type
XUNPU
Minimum package
1500

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-SH1.0-4PLB
Electronic Component
1
Package
SMD,P=1.0mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.29g
Electronic Component
1mm
Electronic Component
Electronic Component
PIN
4P
Electronic Component
1
Electronic Component
SH
Electronic Component
BM0265062318
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

讯普WAFER-SH1.0-4PLB线对板针座产品概述

一、产品定位与核心属性

讯普WAFER-SH1.0-4PLB是一款专为高密度小型化电路设计的线对板连接组件,属于讯普SH系列标准产品。该针座采用1mm间距单排4Pin(1×4P) 布局,支持表面贴装立贴(SMD) 安装方式,核心作用是实现导线与PCB板之间的稳定电气连接,适配智能穿戴、工业控制、汽车电子等轻量化设备的集成需求。

二、关键性能参数解析

该针座的性能参数针对低功率场景优化,核心指标明确且实用:

  • 电气性能:额定电流1A、额定电压50V,满足常规低功率信号传输(如传感器数据、控制指令)及小电流供电需求;
  • 环境适应性:工作温度范围覆盖-40℃~+85℃,具备工业级温宽,可在低温存储、高温工作环境下稳定运行;
  • 机械尺寸:板上高度4.4mm,X轴(间距线方向)底边长度6.35mm,Y轴宽度3.05mm,紧凑外形有效节省PCB布局空间,适配窄条区域集成;
  • 材料选型:触头采用黄铜(导电率稳定、接触电阻低)+锡镀层(提升焊接兼容性与防氧化能力);塑料外壳选用LCP(液晶聚合物),耐高温(可承受回流焊260℃左右高温)、耐化学腐蚀,尺寸精度高。

三、结构设计特点

  1. 立贴SMD安装:无需PCB钻孔,适配自动化贴片生产,提升组装效率;
  2. 辅助焊脚设计:在常规触头焊脚外增加2个辅助固定点,显著增强焊接强度,防止针座因导线拉扯、振动脱落;
  3. 1mm间距单排布局:相比多排设计更节省横向空间,适合PCB板上高密度窄区域布局;
  4. 米色LCP外壳:颜色统一便于装配识别,且LCP材质低吸水性、高刚性,长期使用中尺寸稳定,避免因环境湿度变化变形。

四、典型应用场景

基于紧凑尺寸、稳定性能与工业级温宽,该针座广泛应用于:

  • 小型消费电子:智能手环、蓝牙耳机、便携式充电设备的内部信号/供电连接;
  • 工业控制:小型传感器节点(如温度/湿度传感器)、微型PLC模块、工业物联网终端的信号传输;
  • 通信设备:微型基站模块、光纤收发器、5G小基站的辅助电路连接;
  • 汽车电子:车载小型传感器(如胎压监测辅助电路)、低功率车载终端的内部连接。

五、品质与可靠性保障

讯普对该产品的品质管控贯穿全流程:

  • 触头镀层采用均匀电镀工艺,镀层厚度符合行业标准,确保焊接可靠性与接触稳定性;
  • 塑料外壳注塑精度控制在±0.05mm以内,适配对接端子的精准插拔,减少接触不良风险;
  • 产品经过温湿度循环测试(-40℃+85℃,50循环)、振动测试(102000Hz,加速度1g),满足电子设备的可靠性要求;
  • 符合RoHS环保指令,无铅、无镉等有害物质残留,适配全球市场需求。

该产品凭借紧凑设计、稳定性能与高可靠性,成为小型化电子设备线对板连接的实用选择。

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