WMSIC Electronic Components

XUNPU FPC-0.5AD-20PB

ModelFPC-0.5AD-20PB
PackageSMD,P=0.5mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU FPC-0.5AD-20PB
Type
XUNPU
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
FPC-0.5AD-20PB
Electronic Component
1
Package
SMD,P=0.5mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.46g
Electronic Component
0.5mm
Electronic Component
1
Electronic Component
BM0265023719
Electronic Component
Electronic Component
Operating Temperature
55℃~+85℃
Electronic Component
3.9mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
20P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FPC-0.5AD-20PB 柔性扁平电缆连接器产品概述

一、产品定位与核心价值

FPC-0.5AD-20PB是讯普(XUNPU) 品牌推出的0.5mm间距立贴式柔性扁平电缆(FPC)连接器,专为高密度、小体积电子设备的内部信号/电源连接设计。其核心价值在于平衡“小间距高密度”与“可靠连接、易装配”需求,适配各类便携及微型电子系统的模块化连接场景,是消费电子、可穿戴设备、工业控制等领域的优选组件。

二、核心参数全解析

该连接器的关键参数明确了性能边界与应用范围,具体如下:

2.1 电气性能

  • 额定电压:50V(AC/DC通用),满足常规低功耗设备的信号与电源传输需求;
  • 额定电流:500mA/触点,单连接器最大承载电流≤10A(20Pin总和),适配多数小型模块的功率需求;
  • 工作温度:-55℃+85℃,覆盖工业级(-40+85)与消费级(-20~+60)设备的典型环境温度区间,极端环境下仍能稳定工作。

2.2 机械尺寸

  • 引脚间距:0.5mm(行业标准小间距),支持高密度通道集成;
  • 触点数量:20Pin,可同时传输20路信号或电源;
  • 板上高度:仅3.9mm,适配超薄设备(如智能手表厚度通常<10mm);
  • 接入FPC厚度:0.3mm,兼容常规柔性电缆规格(市场主流FPC厚度多为0.2~0.3mm)。

2.3 材料与工艺

  • 触头材质:磷青铜(高弹性、抗疲劳,多次插拔后仍保持接触压力);
  • 触头镀层:锡(抗氧化、低接触电阻<20mΩ,易焊接且抗腐蚀);
  • 封装形式:SMD立贴式,支持自动化表面贴装,提升量产效率。

2.4 结构特性

  • 锁定方式:抽屉式(无需工具,插拔便捷,锁定可靠);
  • 触点类型:单侧垂直(FPC垂直插入,节省水平空间)。

三、结构设计亮点

3.1 抽屉式锁定:便捷与可靠的平衡

采用抽屉式解锁/锁定结构,操作简单:轻推抽屉即可解锁分离FPC,轻压抽屉至到位(可听到“咔嗒”声)即可锁定。该设计避免了传统卡扣式的“易断、难操作”问题,同时有效抵抗振动、冲击导致的FPC松动,提升连接可靠性。

3.2 单侧垂直触点:空间利用最大化

单侧垂直触点使FPC以垂直方向插入连接器,相比传统水平插入方式,可节省约50%的水平安装空间。例如,在智能手环内部,水平空间仅需5mm即可完成安装,适配“空间寸土寸金”的微型设备。

3.3 低板高设计:适配薄型设备趋势

3.9mm的板上高度配合立贴封装,可大幅降低设备内部堆叠高度。以智能手机为例,其内部模块堆叠高度通常控制在3~5mm,该连接器可完美融入,助力设备“轻薄化”设计。

3.4 触头材料:持久稳定的接触性能

磷青铜触头兼具高弹性(插拔寿命≥500次)与良好导电性,锡镀层则有效降低接触电阻,避免因氧化导致的信号衰减,确保长期使用中电气性能稳定。

四、典型应用领域

该连接器因“小间距、低板高、可靠连接”的特性,广泛应用于以下场景:

4.1 消费电子便携设备

  • 智能手机:内部FPC与主板、屏幕、摄像头的连接;
  • 智能手表:传感器模块(心率、加速度)与主控板的连接;
  • 蓝牙耳机:充电触点、麦克风FPC与主板的连接。

4.2 微型电子设备

  • 智能手环:运动传感器与数据存储模块的连接;
  • 微型无人机:电机控制FPC与飞控板的连接;
  • 可穿戴医疗设备:血糖传感器与无线传输模块的连接。

4.3 工业控制小型模块

  • 小型PLC:输入输出模块与主控板的连接;
  • 物联网传感器节点:温湿度传感器与通信模块的连接。

4.4 车载微型系统

  • 车载显示屏:触控FPC与主板的连接;
  • 车载摄像头:图像传感器FPC与图像处理模块的连接。

五、可靠性与环境适配性

  1. 宽温适应性:-55℃~+85℃的工作温度,可满足寒冷地区户外设备(如智能电表)与高温环境(如车载中控台)的使用需求;
  2. 抗振动冲击:抽屉式锁定与磷青铜触头的弹性设计,可承受常规振动(如车辆行驶、设备搬运),避免接触不良;
  3. 焊接可靠性:SMD立贴封装采用标准回流焊工艺,焊点与PCB结合牢固(剪切强度≥10N),减少虚焊、脱焊风险。

六、安装与维护要点

  1. 焊接工艺:遵循SMD立贴回流焊参数(预热150-180℃,峰值230-250℃,时间<30s),避免高温导致触头镀层熔化或壳体变形;
  2. FPC匹配:必须使用厚度0.3mm、间距0.5mm的FPC,确保触点完全对齐,避免接触不良;
  3. 锁定操作:插入FPC后确认锁定到位,未锁定可能导致信号中断;
  4. 存储维护:置于常温干燥环境(20-30℃,湿度<60%),避免潮湿或腐蚀性气体,插拔时避免过度用力防止触头变形。

FPC-0.5AD-20PB凭借其紧凑设计、可靠性能与易装配特性,成为小型电子设备内部连接的高性价比选择,可满足多数量产场景的需求。

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