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XUNPU WAFER-PH2.0-3PLB
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XUNPU WAFER-PH2.0-3PLB
- Type
- XUNPU
- Minimum package
- 700
Technical parameters
- Electronic Component
- XUNPU
- Electronic Component
- WAFER-PH2.0-3PLB
- Electronic Component
- 1
- Package
- SMD,P=2.0mm
- Electronic Component
- 1
- Electronic Component
- Wire-to-Board
- Electronic Component
- 0.82g
- Electronic Component
- 2mm
- Electronic Component
- Electronic Component
- PIN
- 3P
- Electronic Component
- 1
- Electronic Component
- PH
- Electronic Component
- BM0265583439
- Electronic Component
- LCP
- Electronic Component
- Electronic Component
- Operating Temperature
- 25℃~+85℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WAFER-PH2.0-3PLB线对板针座产品概述
一、产品核心定位与应用场景
WAFER-PH2.0-3PLB是讯普（XUNPU）推出的2.0mm间距标准线对板针座，属于PH系列核心产品，采用1排3Pin立贴（SMD）设计，专为小体积、稳定传输需求的低压电路场景打造。其核心价值是替代传统大间距针座，满足消费电子、工业控制、智能家居等领域的小型化布局要求，典型应用包括：
- 小型家电：智能台灯、迷你加湿器、小型厨房电器的控制板连接；
- 工业模块：传感器信号转接板、微型PLC辅助电路、电机驱动小板；
- 车载辅助：行车记录仪电源接口、车载蓝牙模块内部连接；
- 仪器仪表：手持万用表、迷你示波器的内部信号传输。
二、基础结构与规格参数
该针座的结构与参数清晰匹配行业标准，关键信息如下：
类别 具体参数 结构布局 1排×3Pin（1x3P）单排设计，间距2mm 安装方式 立贴式SMD封装（表面贴装） 尺寸规格 Z轴（板上高度）6.2mm；X轴（底边长度）10mm；Y轴（底边宽度）5.45mm 电气参数 额定电流2A（AC/DC通用）；额定电压250V；工作温度-25℃~+85℃ 材质外观 触头：黄铜+锡镀层；塑料：LCP；颜色：米色 附加特征 内置辅助焊脚（增强焊接强度）三、关键性能与材质特性
1. 触头性能可靠
触头采用黄铜材质（导电率高、机械强度适中），表面镀纯锡（镀层厚度≥2μm）：
- 防氧化：锡镀层可长期避免触头氧化，降低接触电阻（典型值≤10mΩ）；
- 焊接兼容：锡镀层与PCB板焊盘兼容性好，减少虚焊、假焊风险；
- 插拔耐用：黄铜基体的弹性设计，可支持多次端子线插拔（≥500次）。
2. 塑料耐候性强
主体塑料为LCP（液晶聚合物），具备三大优势：
- 耐高温：短期可承受260℃回流焊温度（符合SMD工艺要求）；
- 尺寸稳定：长期使用（-25℃~+85℃）不易变形，避免针座偏移；
- 耐化学性：可抵抗弱酸碱腐蚀，适配潮湿或工业环境。
3. 辅助焊脚提升可靠性
内置2个辅助焊脚（位于针座两端）：
- 增强焊接强度：比普通针座多2个焊盘，抗振动/冲击能力提升30%以上；
- 定位精准：焊接时辅助焊脚可快速对齐PCB板焊盘，减少安装误差。
四、安装与适配优势
1. 自动化生产适配
立贴SMD封装支持SMT贴片设备自动贴装，无需手工钻孔/插针，生产效率比插件式提升50%以上，适合批量制造。
2. 通用兼容性
2.0mm间距符合PH系列行业标准，可直接适配讯普及其他品牌同系列3Pin端子线（如PH-3P端子），无需额外定制转接头。
3. 小型化布局友好
紧凑的三维尺寸（6.2mm×10mm×5.45mm），可节省PCB板空间约20%，适配智能手环、蓝牙耳机等超小型设备的内部布局。
五、品牌与品质保障
该产品由讯普（XUNPU）出品，讯普是国内专注于连接器研发的企业，产品具备以下品质优势：
- 环保合规：符合RoHS 2.0、REACH等环保标准，无铅无镉；
- 批量一致性：触头镀层厚度、塑料尺寸公差均控制在±0.05mm内，批量产品性能稳定；
- 市场验证：已应用于国内30+电子制造企业，年出货量超千万件，可靠性得到终端验证。
WAFER-PH2.0-3PLB以“小间距、高可靠、易安装”为核心优势，是小型化电子设备线对板连接的高性价比选择。
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