WMSIC Electronic Components

XUNPU WAFER-SH1.0-8PWB

ModelWAFER-SH1.0-8PWB
PackageSMD,P=1.0mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-SH1.0-8PWB
Type
XUNPU
Minimum package
2000

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-SH1.0-8PWB
Electronic Component
1
Package
SMD,P=1.0mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.31g
Electronic Component
1mm
Electronic Component
Electronic Component
PIN
8P
Electronic Component
1
Electronic Component
SH
Electronic Component
BM0265845881
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-SH1.0-8PWB 线对板针座产品概述

一、产品核心定位与应用场景

WAFER-SH1.0-8PWB是一款1mm间距单排卧贴式线对板针座,专为空间受限的小型化电子设备设计,聚焦小功率信号/电源连接需求。其8Pin(1×8P)紧凑结构、卧贴SMD安装方式,适配以下典型场景:

  • 可穿戴设备:智能手环、蓝牙耳机的内部模块桥接(如传感器与主板连接);
  • 智能家居:温湿度/人体感应传感器与控制器的信号传输;
  • 工业控制:微型PLC、传感器节点的辅助电路连接;
  • 消费电子:便携式充电器、小型蓝牙音箱的内部电源/数据传输。

二、关键参数与性能优势

1. 小型化核心参数

  • 间距1mm(行业窄间距设计),相比2.0mm间距产品体积缩小近半;
  • 板上尺寸:X轴10.35mm(间距线长度)、Y轴4.3mm(宽度)、Z轴3.15mm(高度),适配薄型设备内部空间。

2. 电气与环境性能

  • 额定电流1A、电压50V,满足小功率信号(I2C/SPI)及低功耗电源传输;
  • 触头:黄铜材质+锡镀层,导电性能优异,锡镀层可防氧化,延长触头寿命;
  • 工作温度:-40℃~+85℃,覆盖工业级与消费级设备的典型使用环境;
  • 塑料外壳:LCP(液晶聚合物)材质,耐温、机械强度及耐化学腐蚀性优于普通工程塑料。

3. 结构增强设计

配备辅助焊脚,增加焊接点数量,分散焊接应力,避免振动/插拔导致的针脚脱落。

三、结构设计与可靠性

1. 插针与外壳设计

  • 单排1×8P插针布局,间距精准(±0.05mm),确保与线端连接器插拔对位精度;
  • 米色LCP外壳:颜色辨识度高,便于生产检测,且长期使用不易变形。

2. 辅助焊脚的作用

焊脚位于针座两侧,焊接时与PCB形成额外固定点:

  • 增强焊接强度(拉力≥10N);
  • 减少插针与PCB的应力集中,降低机械振动导致的开路风险。

3. 触头可靠性

黄铜触头经精密加工,接触面积稳定,插拔力均匀(行业常规1~3N),减少触头磨损;锡镀层厚度≥5μm,可抵御潮湿、盐雾腐蚀。

四、安装与兼容性说明

1. 安装方式

  • 卧贴SMD(表面贴装),适配回流焊工艺,可通过自动化贴片机批量生产,无需手工焊接;
  • 焊接注意:回流焊温度≤260℃(LCP耐温范围),避免外壳变形。

2. 兼容性

  • 参考系列为SH,可与同系列1mm间距线端连接器(如SH1.0端子)完全兼容;
  • 插针布局符合IPC标准,适配主流PCB焊盘设计,无需额外修改板级布局。

五、品牌与品质保障

WAFER-SH1.0-8PWB由讯普(XUNPU)电子出品,遵循ISO9001质量管理体系,每批次均通过以下测试:

  • 高低温循环:-40℃~+85℃循环100次,性能无衰减;
  • 焊接强度:辅助焊脚拉力≥10N,插针拉力≥5N;
  • 插拔寿命:与同系列线端连接器插拔≥500次,接触电阻变化≤10%。

该产品已广泛应用于国内中小型电子厂商的量产项目,以高可靠性与成本优势获得市场认可。

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