WMSIC Electronic Components

XUNPU WAFER-SH1.0-2PWB

ModelWAFER-SH1.0-2PWB
PackageSMD,P=1.0mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-SH1.0-2PWB
Type
XUNPU
Minimum package
2000

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-SH1.0-2PWB
Electronic Component
1
Package
SMD,P=1.0mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.2g
Electronic Component
1mm
Electronic Component
Electronic Component
PIN
2P
Electronic Component
1
Electronic Component
SH
Electronic Component
BM0265062287
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-SH1.0-2PWB 线对板针座产品概述

WAFER-SH1.0-2PWB是讯普(XUNPU)SH系列下的小间距卧贴式线对板针座,专为高密度、紧凑空间的电子设备连接需求设计,核心聚焦1mm间距、2P单排结构,兼具电气可靠性与安装便捷性,广泛适配消费电子、工业控制等多领域应用。

一、核心参数与产品定位

该产品属于1x2P单排针座,关键参数明确且针对性强:

  • 结构设计:1排2针(1x2P),间距1mm(小间距适配高密度布局);
  • 封装安装:SMD卧贴(表面贴装,兼容自动化生产);
  • 电气额定值:1A(电流)、50V(电压),满足小功率信号/电源传输;
  • 环境适应性:工作温度-40℃~+85℃,覆盖宽温场景;
  • 附加特征:内置辅助焊脚,增强焊接强度与抗振性能。

其定位为低成本、高可靠的小型化连接方案,解决传统插件针座空间占用大、装配效率低的问题,适配对体积敏感的电子模块。

二、物理结构与安装特性

1. 紧凑体积适配窄空间

产品物理尺寸精准控制:

  • Z轴(板上高度):3.15mm,降低设备整体厚度;
  • X轴(底边长度):4.35mm,Y轴(宽度):4.3mm,单排2针结构适配PCB窄区域布局;
  • 外壳颜色:米色LCP塑料,外观规整易识别,适配设备内部美学需求。

2. 辅助焊脚强化可靠性

内置辅助焊脚是核心设计亮点:

  • 焊接时额外增加焊点,提升焊接强度,减少振动导致的针脚脱落风险;
  • 与主焊脚形成双固定,适配回流焊工艺(峰值温度260℃左右),长期使用无松动。

3. 卧贴安装兼容自动化

SMD卧贴封装优势显著:

  • 无需PCB插件孔,节省钻孔成本与空间;
  • 兼容SMT自动化生产线,提高生产效率,降低手工焊接误差。

三、电气性能与材料选型

1. 触头性能稳定可靠

  • 触头材质:黄铜(导电率高、机械强度优,避免接触电阻过大);
  • 镀层工艺:锡镀层(抗氧化、焊接性好,接触电阻稳定在低水平,减少信号衰减);
  • 额定电流1A满足多数小型设备的电源/信号传输需求。

2. 绝缘与环境适应性

  • 塑料外壳:LCP(液晶聚合物),耐高温、耐化学腐蚀,尺寸稳定性佳,适配回流焊高温;
  • 绝缘性能:LCP材料绝缘电阻高,防止针脚间短路,满足50V额定电压安全要求;
  • 宽温范围:-40℃~+85℃,可应对户外低温、设备运行高温等极端场景。

四、典型应用场景

该产品因小体积、高可靠特性,适配多领域需求:

  1. 消费电子:智能手机、智能手表、蓝牙耳机等便携设备的内部电池、传感器连接;
  2. 工业控制:小型PLC、工业传感器模块、物联网终端的信号/电源传输;
  3. 汽车电子:车载小模块(如胎压监测传感器、车载音响辅助部件)的内部连接(符合汽车级宽温要求);
  4. 医疗设备:小型医疗仪器(血糖仪、电子体温计)的组件连接,需小体积与稳定性能。

五、品牌与配套优势

  1. 讯普SH系列成熟性:SH系列为讯普经典线对板连接器系列,生产工艺成熟,质量稳定,批量供货能力强;
  2. 完整配套方案:可与讯普SH系列线端连接器(如SH1.0-2P端子线)配套使用,形成完整线对板连接系统,减少选型复杂度;
  3. 成本优势:性价比高,适合批量应用,降低设备整体BOM成本。

总结:WAFER-SH1.0-2PWB以1mm小间距、卧贴式设计为核心,结合辅助焊脚与LCP材料的可靠性,成为紧凑空间电子设备的优选连接方案,兼顾性能、成本与生产适配性,适配多行业需求。

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