WMSIC Electronic Components

XUNPU PH2.54-01-04PZD PH2.54

ModelPH2.54-01-04PZD
PackageThrough-hole, P=2.54mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU PH2.54-01-04PZD
Type
XUNPU
Minimum package
2000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
PH2.54-01-04PZD
Electronic Component
2.5mm
Electronic Component
1
Package
Through-hole, P=2.54mm
Electronic Component
Electronic Component
Electronic Component
Pin Header
Electronic Component
0.23g
Electronic Component
2.54mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0265062277
Electronic Component
Through-hole
Operating Temperature
40℃~+105℃
PIN
4P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PH2.54-01-04PZD 直插方针排针产品概述

一、产品核心定位与基础参数

PH2.54-01-04PZD是讯普(XUNPU)品牌推出的单排4PIN直插方针排针,属于2.54mm标准间距系列,专为电子设备PCB板间信号/电力传输设计,兼顾可靠性与安装便捷性,适配多领域紧凑型设备需求。

基础参数明确:

  • 插针结构:1×4P(单排4针布局)
  • 间距(Pitch):2.54mm(行业通用标准,兼容性强)
  • 针型:方针(方形插针,区别于圆针)
  • 安装方式:直插式(插件焊接)
  • 总PIN位数:4P
  • 塑壳颜色:黑色(耐温、抗污、易识别)

二、关键性能指标

1. 电气性能

额定电流3A,可同时满足小功率电力传输+信号传输双重需求(如小型电机驱动、LED模组供电、传感器信号传输);触头采用黄铜材质(导电率≈28%IACS),表面镀金镀层(抗氧化、降低接触电阻至≤10mΩ),保证长期接触稳定,减少信号衰减。

2. 环境适应性

工作温度范围-40℃~+105℃,覆盖工业级、车载级、户外消费电子等场景(如安防监控、智能家居、车载小模块),可承受高低温循环、湿热环境(湿度95%RH以下),无性能衰减。

3. 机械参数

  • 配合针长度:6mm(适配标准排母对接,插入深度充足,避免虚接)
  • 端接针长度:3mm(适合PCB板焊接,焊接牢固且不占用过多空间)
  • 塑壳高度:2.5mm(紧凑设计,降低设备整体厚度,适配超薄设备)

三、结构设计特点

1. 方针结构优势

方形插针比传统圆针接触面积提升约30%,对接时压力分布更均匀,减少接触电阻波动(波动范围≤5mΩ),尤其适合高频信号传输(如10MHz以内数字信号),避免信号干扰。

2. 直插式安装便捷

无需额外焊接工艺调整,直接插入PCB板焊盘即可焊接;单排设计节省PCB布局空间(宽度仅约5mm),适配紧凑型设备(如智能手环主板、小型传感器节点)。

3. 塑壳与针脚稳定性

黑色塑壳采用耐高温PA66工程塑料,与针脚注塑成型结合紧密(拉力≥5N/针),避免针脚松动;针脚端接部分采用倒角设计,方便插入焊盘,提升安装效率(人工焊接效率比无倒角针脚高约20%)。

四、典型应用场景

PH2.54-01-04PZD的参数与设计使其适配多领域:

  1. 消费电子:智能家居设备(智能开关、温湿度传感器模块)、小型家电(加湿器、扫地机器人)的PCB板间连接;
  2. 工业控制:小型PLC模块、传感器节点(压力/流量传感器)、工业仪器仪表的信号传输;
  3. 车载电子:车载小功率模块(车载充电器、氛围灯控制器)的内部连接(宽温范围适配车载-20℃~85℃环境);
  4. 安防监控:摄像头模块、门禁控制器的PCB板间对接,满足户外环境高低温需求。

五、品牌与品质保障

讯普(XUNPU)作为专业连接器品牌,PH2.54系列产品遵循ISO9001质量体系生产,触头镀层厚度均匀(符合行业标准≥0.5μm),产品一致性好(批量采购无差异化问题);同时满足RoHS环保要求,不含铅、镉等有害物质,适配全球市场合规需求。

该产品以“标准间距+高可靠性+紧凑设计”为核心,是电子设备PCB板间连接的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.