WMSIC Electronic Components

XUNPU WAFER-HY2.0-8PZZ

ModelWAFER-HY2.0-8PZZ
PackageTHT,P=2MM
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-HY2.0-8PZZ
Type
THT, P=2MM
Minimum package
1000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
WAFER-HY2.0-8PZZ
Electronic Component
1
Package
Through-hole, P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.452g
Electronic Component
2mm
Electronic Component
Electronic Component
PIN
8P
Electronic Component
1
Electronic Component
HY
Electronic Component
BM0264968607
Electronic Component
LCP
Electronic Component
Through-hole

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-HY2.0-8PZZ 产品概述

一、产品基本定义与定位

WAFER-HY2.0-8PZZ是讯普(XUNPU)HY系列的单排8针直插式线对板针座,专为紧凑空间内的电气连接需求设计。该产品采用插件式安装,通过与配套线端连接器配合,实现PCB板与导线的稳定导通,兼具小型化、高可靠性与成本优势,广泛适配消费电子、工业控制、小型通信设备等领域。

二、关键技术参数

2.1 电气性能参数

  • 额定电流:2A(持续工作下稳定承载小功率电路需求,避免过载风险);
  • 额定电压:250V(AC/DC通用,符合低压电气安全标准);
  • 触头结构:黄铜基体+表面锡镀层——黄铜导电性优异,锡镀层降低接触电阻(≤10mΩ)、提升抗氧化能力,减少信号/电流损耗。

2.2 机械结构参数

  • 插针规格:1×8P(单排8针布局,无冗余针脚,节省空间);
  • 间距:2mm(HY系列标准间距,兼容性强,易与同系列线端配合);
  • 安装方式:直插式(PCB板通孔焊接,安装简单,适合批量生产);
  • 尺寸参数:Z轴板上高度8mm(垂直方向占用空间小),X轴底边长度18mm(单排8针间距线总长度),Y轴底边宽度5.1mm(水平方向窄,适配紧凑PCB布局)。

2.3 材料与可靠性参数

  • 塑料主体:LCP(液晶聚合物)——耐高低温、尺寸稳定性强,焊接时不易变形;
  • 阻燃等级:UL94V-0(高阻燃性,符合电子电器安全规范,降低火灾风险);
  • 工作温度范围:-45℃~+85℃(宽温适应性,可满足低温户外或高温设备内部场景);
  • 外观颜色:白色(便于识别,避免与其他针座混淆)。

三、核心产品优势

  1. 小型化高密度布局:2mm间距+紧凑尺寸(18mm×5.1mm×8mm),可在PCB板上实现高密度连接,尤其适合便携式设备、小型模块的空间限制;
  2. 稳定可靠的电气连接:黄铜触头+锡镀层设计,接触电阻低且长期稳定,避免信号衰减或电流中断;
  3. 宽温与阻燃安全:LCP材料耐高低温,UL94V-0阻燃,适应 harsh环境(如工业现场、车载小部件);
  4. 安装便捷与兼容性:直插式安装无需复杂工具,与讯普HY系列2mm间距8P线端连接器完美适配,降低选型/组装成本;
  5. 高性价比:成熟工艺生产,成本可控,适合中低端电子设备的批量应用。

四、典型应用场景

  1. 消费电子:小型家电(加湿器、智能台灯)、便携式设备(蓝牙音箱、智能手环内部模块连接);
  2. 工业控制:小型PLC、传感器节点(温度/压力变送器)、工业仪表的板级连接;
  3. 汽车电子:车载小部件(车载充电器、氛围灯控制器、倒车雷达辅助模块);
  4. 通信设备:小型路由器、交换机、无线AP的内部子板连接。

五、安装与选型注意事项

  1. 焊接规范:烙铁温度控制在350℃±10℃,单次焊接时间≤3秒,避免LCP塑料变形;
  2. 配套匹配:需与讯普HY系列2mm间距8P线端连接器(如HY2.0-8P端子线)配合,确保插合紧密;
  3. 参数限制:实际电流≤2A、电压≤250V,防止过载;
  4. 存储环境:常温干燥(25℃±5℃,湿度≤60%),避免阳光直射与潮湿,防止镀层氧化。

该产品通过平衡性能、成本与可靠性,成为小型电子设备板端连接的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.