WMSIC Electronic Components

XUNPU WAFER-ZH1.5-2PLB

ModelWAFER-ZH1.5-2PLB
PackageSMD,P=1.5mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-ZH1.5-2PLB
Type
XUNPU
Minimum package
1500

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-ZH1.5-2PLB
Electronic Component
1
Package
SMD,P=1.5mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.35g
Electronic Component
1.5mm
Electronic Component
Electronic Component
PIN
2P
Electronic Component
1
Electronic Component
ZH
Electronic Component
BM0264549575
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-ZH1.5-2PLB 线对板针座产品概述

一、产品定位与核心属性

WAFER-ZH1.5-2PLB是讯普(XUNPU)ZH系列下的小间距线对板针座,专为紧凑型电子设备的信号与小功率电源传输设计。核心属性明确:采用1.5mm标准间距、1×2P(2Pin单排)结构,立贴式SMD安装方式,适配自动化贴片生产,是小型化产品中替代传统2.54mm间距连接器的主流选择。

二、关键参数深度解析

该型号参数覆盖电气、机械、材料三大维度,直接决定了其应用场景与可靠性:

1. 电气性能

  • 额定电流1A(AC/DC):满足低功耗MCU、传感器、小型执行器的供电需求,避免过载风险;
  • 额定电压250V:覆盖常规低压电路(如12V/24V电源、信号总线),符合安全标准。

2. 机械尺寸

  • 1.5mm间距:相比2.54mm间距节省约40%PCB空间,适配便携设备的高密度布局;
  • 板上尺寸:Z轴高度5.1mm(避免碰撞)、X轴底边6mm、Y轴宽度5.2mm,单排2Pin结构的整体占用极小;
  • 1×2P结构:单排双Pin设计,简化布局同时满足基本信号/电源的“正负极”或“信号+地”传输。

3. 材料与环境

  • 触头:黄铜基底(高导电率+机械强度)+锡镀层(优异焊接性、抗氧化);
  • 外壳:LCP(液晶聚合物)——耐温范围-25℃~+85℃,可承受回流焊高温(260℃左右),适配SMD生产;
  • 附加特征:辅助焊脚——增强焊接强度,降低振动/冲击导致的焊盘脱落风险。

三、结构设计优势

该型号针对小型化需求做了针对性优化:

1. 立贴SMD适配性

无需PCB钻孔,直接通过贴片焊盘焊接,减少生产工序,提升自动化效率;同时避免插件孔对PCB布线的限制,适合高密度板设计。

2. 辅助焊脚强化

在常规2Pin焊盘外增加额外焊脚,分散焊接应力,尤其适合手持设备(如智能手环)的振动场景,大幅降低虚焊概率。

3. 触头精准设计

采用精密冲压工艺,保证接触点平整度与一致性,插拔寿命可达500次以上,长期使用仍能保持稳定接触电阻。

四、典型应用场景

因尺寸紧凑、性能适配,该型号广泛用于以下领域:

  1. 消费电子:便携蓝牙音箱、智能手环/手表的电池与主板连接,无线耳机的内部模块对接;
  2. 小型家电:智能插座、迷你加湿器的控制板与电源板传输,小型厨电的传感器接口;
  3. 工业控制:小型温湿度传感器模块与PLC子板的信号传输,低功耗工业物联网节点的连接;
  4. 医疗设备:便携血糖检测仪、小型雾化器的内部组件对接(符合医疗设备“小尺寸、低功耗”要求)。

五、可靠性与使用注意事项

1. 可靠性保障

  • LCP外壳耐温性好,长期使用无变形,保证插拔精度;
  • 锡镀层抗氧化,潮湿环境下仍能维持稳定接触;
  • 工作温度范围覆盖常规室内/户外便携场景(如冬季-10℃、夏季40℃)。

2. 使用要点

  • 焊接采用标准回流焊(避免手工焊高温损坏塑料);
  • 插拔线端需垂直操作,禁止斜向用力导致针座变形;
  • 选型时需确认匹配ZH系列线端连接器,确保接触紧密。

六、品牌与选型总结

讯普(XUNPU)ZH系列是国内成熟的小间距连接器品牌,WAFER-ZH1.5-2PLB凭借“紧凑尺寸+高可靠性+低成本”,成为小型电子设备连接的高性价比选择。选型时需重点确认:间距1.5mm、2Pin单排、立贴SMD,以及电流/电压需求不超过1A/250V。

该型号通过优化结构与材料,平衡了“小尺寸”与“可靠性”,是便携式、小型化电子设备的理想连接组件。

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