WMSIC Electronic Components

XUNPU FPC-05F-12PH20

ModelFPC-05F-12PH20
PackageSMD, P=0.5mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU FPC-05F-12PH20
Type
XUNPU
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
FPC-05F-12PH20
Electronic Component
1
Package
SMD, P=0.5mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.385g
Electronic Component
0.5mm
Electronic Component
1
Electronic Component
BM0265062281
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
2mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
12P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FPC-05F-12PH20 FFC/FPC连接器产品概述

FPC-05F-12PH20是讯普(XUNPU)针对小型化电子设备柔性连接推出的12Pin连接器,核心聚焦“高密度布线、便捷插拔、超薄安装”三大需求,适配0.3mm厚度FFC/FPC电缆,广泛覆盖便携消费电子、小型医疗等场景。

一、产品定位与核心功能

该连接器的核心定位是小型设备的柔性电路连接方案,主要实现FFC(柔性扁平电缆)或FPC(柔性印刷电路)与PCB之间的信号/电力传输。区别于传统连接器,其通过“翻盖式锁定+下接触点+卧贴安装”的组合设计,解决了小型设备“空间紧凑、插拔频繁、布线密集”的痛点,同时平衡了成本与可靠性。

二、基础参数全解析

类别 具体参数 关键说明 电气性能 额定电压50V、额定电流500mA(单Pin) 满足常规低压信号/小功率传输 环境范围 工作温度-25℃~+85℃ 覆盖民用/轻量工业场景 机械规格 12Pin触点、0.5mm间距、0.3mm电缆厚度、2mm板高 高密度+超薄设计(适配轻薄设备) 安装方式 卧贴(SMD) 无穿孔贴装,节省PCB垂直空间 锁定结构 翻盖式 工具-free插拔,批量组装高效 触头材质 磷青铜基底+锡镀层 弹性好、抗氧化、接触电阻稳定 封装规格 SMD封装,Pin间距0.5mm 适配标准贴装设备(回流焊兼容)

三、结构设计的实用优势

3.1 翻盖式锁定:快速插拔无工具依赖

翻盖打开后可直接插入0.3mm厚度的FFC/FPC电缆,闭合翻盖即完成锁定,无需额外工具。该设计适合批量生产组装,同时避免传统锁扣式连接器的误操作风险(如锁扣断裂、未完全锁定)。

3.2 下接触点+卧贴:空间利用最大化

  • 下接触点:电缆从连接器下方接入,PCB上方无空间占用,可在同一区域布局更多元件(如传感器、蓝牙模块);
  • 卧贴安装:贴装于PCB表面,无需钻孔,节省PCB层数与垂直空间,板上高度仅2mm,可适配厚度不足5mm的便携设备(如智能手表、TWS充电盒)。

3.3 触头设计:平衡可靠性与成本

磷青铜基底具有良好弹性与抗疲劳性,可承受多次插拔;锡镀层有效防止触头氧化,降低接触电阻(<50mΩ)。相比镀金镀层,锡镀层在保证基本可靠性的前提下,更适合中低端小型设备的成本控制需求。

四、典型应用场景

  1. 便携消费电子:智能手表(连接屏幕与主板)、TWS蓝牙耳机(充电盒内布线)、运动手环(传感器与主控连接);
  2. 小型医疗设备:便携式血糖仪(数据传输)、血氧仪(传感器连接);
  3. 智能家居:智能门锁传感器(门磁/指纹模块)、温湿度模块(低功耗连接);
  4. 汽车电子:车载小屏控制器(后排娱乐屏)、氛围灯模块(柔性布线)。

五、可靠性与环境适应性

  • 温度稳定性:-25℃~+85℃的工作范围,可满足冬季户外便携设备、夏季车内设备的使用需求;
  • 接触可靠性:单Pin额定电流500mA,可承载常规信号(如I2C、SPI)与小功率电力(如5V/1A以内),插拔次数可达100次以上(符合行业标准);
  • 抗振动性能:卧贴安装配合连接器的结构强度,可承受0.5G~2G的振动(适配汽车电子、便携设备的移动场景)。

六、品牌与品质保障

讯普(XUNPU)作为国内连接器领域的成熟厂商,FPC-05F-12PH20符合RoHS环保标准,批量生产一致性好(Pin位公差±0.05mm),可提供选型指导、贴装工艺支持(如回流焊温度曲线建议),适合OEM/ODM客户的批量采购需求。

总结

FPC-05F-12PH20通过“高密度、超薄化、便捷插拔”的设计,精准匹配小型电子设备的柔性连接需求,在成本可控的前提下兼顾可靠性与环境适应性,是同类场景下的高性价比选择。

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