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XUNPU PCIE-52P40H
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XUNPU PCIE-52P40H
- Type
- XUNPU
- Minimum package
- 650 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XUNPU
- Electronic Component
- PCIE-52P40H
- Electronic Component
- 1
- Package
- SMD, P=0.8mm
- Electronic Component
- PCI / PCIe Connector
- Electronic Component
- 0.702g
- PIN
- 52P
- Electronic Component
- 1
- Electronic Component
- BM0265978639
- Electronic Component
- Electronic Component
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- 4mm
- Electronic Component
- Electronic Component
- Data PIN
- 36P
- Connector Type
- mPCI-E
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PCIE-52P40H（mPCI-E 52P卧贴金手指连接器）产品概述
一、产品基本定位
PCIE-52P40H是讯普（XUNPU）品牌针对小型化高密度板间连接需求开发的mPCI-E金手指连接器，采用SMD卧贴封装，核心解决模块与主板之间的稳定数据传输问题。产品适配工业控制、消费电子、通信等多领域，兼具宽温可靠性与易生产性，是轻薄化设备的理想连接方案。
二、核心规格参数
参数项 规格值 连接器类型 mPCI-E（迷你PCI Express） 总PIN数 52Pin（52P） 数据传输PIN数 36Pin（36P） 安装方式 表面贴装（SMD）卧贴 针距（Pitch） 0.8mm 板上高度（Profile） 4mm 附加结构 带定位柱 工作温度范围 -40℃ ~ +85℃ 接触材料 镀金（典型厚度0.3μm） 接触电阻 ≤20mΩ（DC 1A） 绝缘电阻 ≥1000MΩ（DC 500V） 耐电压 AC 500V（50Hz/1min）三、结构设计特点
- 低Profile卧贴设计：板上高度仅4mm，可适配笔记本、物联网终端等轻薄设备的内部空间，避免与周边元器件干涉；
- 定位柱增强稳定性：本体集成2个定位柱，贴装时精准定位PCB板，防止偏移，提升批量生产一致性；
- 金手指接触可靠：采用镀金金手指结构，接触面积大、耐磨性能优，典型插拔次数≥50次，长期使用无信号衰减；
- 高密度针距布局：0.8mm针距集成52Pin（含36P数据PIN），满足多通道高速数据传输需求，适配1x/2x PCI-E等协议。
四、典型应用场景
- 工业控制设备：PLC、工业传感器模块等，宽温范围覆盖车间（-20℃60℃）与户外（-40℃85℃）环境；
- 消费电子终端：笔记本电脑（无线网卡、SSD模块）、平板电脑扩展接口，低Profile适配轻薄化趋势；
- 通信设备：小型基站、路由器、交换机的板间连接，稳定传输10Gbps级数据；
- 物联网终端：智能网关、传感器节点，SMD封装适合自动化生产，降低终端成本；
- 车载辅助系统：部分车载信息娱乐模块（需确认环境温度匹配），定位柱结构抗车辆振动。
五、性能优势总结
- 宽温可靠性：-40℃~+85℃覆盖90%以上应用场景，极端温度下无性能失效；
- 信号传输稳定：36P数据PIN支持高速传输，镀金接触保证低电阻，减少信号干扰；
- 生产适配性：SMD封装兼容常规SMT工艺，自动化贴装效率高，降低人工成本；
- 机械抗振性：卧贴+定位柱设计，可承受10G/20~2000Hz振动测试，适配移动设备；
- 成本效益：讯普成熟工艺保证一致性，性价比高于进口同类产品，适合批量采购。
六、使用注意事项
- 贴装工艺：需按SMD规范使用焊膏（Sn63Pb37或无铅焊料），回流焊温度曲线需匹配（峰值230℃±5℃）；
- 静电防护：连接器为ESD敏感元件，操作时需佩戴防静电手环，使用防静电工具；
- 插拔规范：避免频繁插拔（≤50次），插拔时对准定位柱，禁止强行倾斜插拔；
- 环境防护：避免长期暴露在潮湿（相对湿度>95%）或腐蚀性气体（硫化物）中，必要时做密封处理；
- 方向确认：金手指需与模块方向一致，反插可能导致连接器或模块损坏。
该产品通过了RoHS认证，符合环保要求，可满足国内外客户的合规性需求，是一款兼顾性能与成本的实用型mPCI-E连接器。
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