WMSIC Electronic Components

XUNPU WAFER-HY2.0-8PWZ

ModelWAFER-HY2.0-8PWZ
PackageP=2mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-HY2.0-8PWZ
Type
XUNPU
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
WAFER-HY2.0-8PWZ
Electronic Component
1
Package
P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.503g
Electronic Component
2mm
Electronic Component
Electronic Component
PIN
8P
Electronic Component
1
Electronic Component
HY
Electronic Component
BM0264982303
Electronic Component
PA66
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-HY2.0-8PWZ 线对板针座产品概述

一、产品基本属性

该针座为讯普(XUNPU)HY系列线对板连接组件,核心规格清晰:

  • 针数:8Pin单排布局(1×8P),无多排冗余设计;
  • 间距:2.0mm(行业常规间距,兼容多数同规格线端连接器);
  • 安装方式:弯插式(引脚90°折弯,适配PCB侧面或紧凑空间布局);
  • 外观:白色PA66塑料基座,视觉辨识度高,符合电子设备常规配色。

二、核心电气性能

满足中低功率设备的信号/电源传输需求:

  • 额定电流:2A(AC/DC通用,单Pin最大承载电流稳定);
  • 额定电压:250V(符合低压电气安全标准,避免过压风险);
  • 工作温度范围:-25℃至+85℃,适配室内/工业环境的温度波动(如智能家居、小型工业模块);
  • 电气可靠性:黄铜触头+锡镀层设计,低接触电阻(<10mΩ),长期使用无明显氧化失效。

三、机械结构与安装适配

尺寸紧凑,适配小体积设备布局:

  • 插针布局:单排8Pin,间距2.0mm,焊盘间距与行业通用标准一致;
  • 安装参数:弯插式引脚,适配PCB板侧面焊接,节省正面空间;
  • 尺寸细节:Z轴板上高度5.1mm(低profile设计),X轴底边长度18mm(1×8P+7个间距的总长度),Y轴宽度8mm(基座宽度适配常规焊盘间距);
  • 安装便利性:引脚折弯角度精准,焊接时不易偏移,适配自动贴装或手工焊接。

四、材料与可靠性设计

兼顾导电性能与环境适应性:

  • 触头部分:黄铜基材(导电优异、机械强度适中)+ 锡镀层(焊接性好,抗氧化,适配波峰焊/回流焊);
  • 塑料基座:PA66(尼龙66),耐温性强(匹配工作温度范围)、抗冲击、耐潮湿;
  • 阻燃安全:UL94V-0级(北美安全标准),遇火难燃,降低设备火灾隐患;
  • 长期可靠性:塑料材质抗老化,触头镀层无脱落风险,正常使用下寿命可达10万次插拔。

五、典型应用场景

因2mm间距、8Pin单排、弯插设计,适配小体积中低功率设备:

  1. 消费电子:智能家居控制器(灯光/窗帘模块)、小型家电(加湿器、智能插座);
  2. 工业控制:小型传感器模块(温湿度、接近传感器)、PLC扩展口(低功率信号传输);
  3. 通信设备:小型路由器/交换机内部电源/信号连接;
  4. 车载周边:车载小设备(行车记录仪供电模块,需确认环境温度匹配)。

六、选型与使用提示

  1. PCB适配:确认PCB焊盘间距为2.0mm,焊盘尺寸与弯插引脚匹配;
  2. 焊接工艺:采用波峰焊/回流焊,焊接温度≤260℃(避免过热损坏PA66基座);
  3. 电流限制:单Pin最大2A,若需传输更大功率,需并联多Pin或选更高规格;
  4. 环境匹配:避免极端低温(<-25℃)或高温(>85℃)环境,潮湿环境需加防护。

该针座以高性价比、紧凑设计满足多数小功率设备的线对板连接需求,是电子设计中常见的基础组件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.