Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XUNPU WAFER-PHB2.0-16PLB-GM
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XUNPU WAFER-PHB2.0-16PLB-GM
- Type
- XUNPU
- Minimum package
- 400 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XUNPU
- Electronic Component
- WAFER-PHB2.0-16PLB-GM
- Electronic Component
- 1
- Package
- SMD,P=2mm
- Electronic Component
- 2
- Electronic Component
- Wire-to-Board
- Electronic Component
- 2mm
- Electronic Component
- 1.978g
- Electronic Component
- 2mm
- Electronic Component
- Electronic Component
- PIN
- 16P
- Electronic Component
- 1
- Electronic Component
- BM0262178984
- Electronic Component
- LCP
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WAFER-PHB2.0-16PLB-GM 产品概述
一、产品简介
WAFER-PHB2.0-16PLB-GM 是讯普（XUNPU）推出的一款 2×8 排立贴线对板针座，间距 2.0mm，总 PIN 数 16P，封装为 SMD。该针座适用于小间距、高密度连接场合，提供可靠的线对板连接解决方案，颜色为米色并带有辅助焊脚以增强焊接与机械强度。
二、主要电气参数
- 额定电流：3A（单针）
- 额定电压：250V
- 工作温度：-25℃ ~ +85℃
- 触头材质：铜合金，触头镀层：锡
这些参数使其可满足中小电流供电与信号传输需求，适用于工业控制、通信设备及消费电子等领域。
三、结构与材料特点
- 触头为优质铜合金并镀锡，兼顾导电性与焊接性；
- 塑料体采用 LCP 材质，阻燃等级达到 UL94V-0，耐温性与机械强度佳；
- 辅助焊脚设计可提高元件在回流焊过程中的定位稳定性与焊点可靠性。
四、机械尺寸与封装信息
- 排数：2 排，每排 8 针，总 16P；
- 间距（P）：2.00mm；行距：2mm；
- 板上高度（Z 轴）：8.43mm；X 轴板上底边长度：18mm；Y 轴板上底边宽度：8mm；
- 封装形式：SMD，适配自动贴片与回流焊工艺。请参考厂商推荐 PCB 焊盘尺寸及过孔布局以确保可靠焊接。
五、适用场景与优势
- 适用于线对板连接、排线接口、模块间互连等应用；
- 小间距设计节省 PCB 面积，适合高密度布局；
- LCP 与 UL94V-0 等级保证在较高温度与有限空间内的可靠性；
- 辅助焊脚与立贴结构提高抗振动及机械可靠性，适合工业与运输类产品使用。
六、使用建议与注意事项
- 推荐采用标准回流焊工艺，遵循制造商的回流焊温度曲线；
- PCB 设计时应按供应商提供的焊盘与焊膏模板尺寸布置，以避免焊接缺陷；
- 对于 3A 近限工作电流，请注意整机散热与铜箔线宽设计；
- 存储与使用环境尽量避免潮湿与强腐蚀性气体，以维持镀层与塑料性能。
本产品适合需要紧凑布局与可靠机械支撑的线对板连接场合，如需样品、3D 模型或 PCB 焊盘建议图，请联系供应商获取详细资料与支持。
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