WMSIC Electronic Components

XUNPU TS-1002S-04526C

ModelTS-1002S-04526C
PackageSMD,6x6mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU TS-1002S-04526C
Type
XUNPU
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
TS-1002S-04526C
Electronic Component
1
Package
SMD,6x6mm
Electronic Component
Switch
Electronic Component
0.496g
Electronic Component
2.6N
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0264241828
Electronic Component
Electronic Component
Switch
6mm
Switch
6mm
Switch
4.5mm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TS-1002S-04526C轻触开关产品概述

TS-1002S-04526C是讯普(XUNPU) 推出的一款微型SMD立贴轻触开关,专为低功耗、紧凑空间的电子设备设计,兼具操作便捷性与可靠性,广泛适配消费电子、智能家居等领域的功能控制需求。

一、产品核心定位与应用场景

TS-1002S-04526C主打小型化、低功耗、高集成三大核心,针对需要微型控制按键的设备场景优化:

  • 消费电子类:智能手环、蓝牙耳机、便携式MP3、小型遥控器的功能切换/确认按键;
  • 智能家居类:智能开关面板、温湿度传感器的模式调节按键;
  • 工业手持类:小型条码扫描枪、数据采集器的触发按键;
  • 医疗小型类:便携式血糖仪、雾化器的参数设置按键。

其紧凑尺寸与稳定性能,可完美嵌入各类微型设备的内部结构,不占用额外空间。

二、关键参数与结构设计

1. 电气与机械核心参数

  • 电路结构:单刀单掷(SPST),开关状态清晰(通/断),无多余触点干扰;
  • 作用力:2.6N适中触感,按压反馈明确,避免误触同时减少操作疲劳;
  • 电气规格:额定电压12V DC,触点电流50mA DC,适配低功耗电路设计(如单片机控制回路);
  • 尺寸参数:开关主体长×宽×高=6mm×6mm×4.5mm,SMD封装6×6mm,属于微型轻触开关范畴。

2. 结构与外观细节

  • 按钮设计:圆形按钮,表面黑色喷涂(耐脏、易识别),按压面积适配手指操作,手感均匀;
  • 引脚样式:鸥翼型引脚,立贴安装方式,适配自动化回流焊工艺,焊接牢固且抗振动;
  • 支架配置:不带支架,进一步减少安装空间占用,适合高密度PCB布局。

三、安装与可靠性特点

1. 安装便捷性

  • 立贴SMD封装:鸥翼引脚设计可直接贴合PCB表面,无需插件孔,节省PCB布线空间;
  • 回流焊兼容:引脚耐热性满足回流焊工艺(260℃以下峰值温度),可与其他SMD元件同步焊接,提升生产效率。

2. 可靠性保障

  • 触点稳定性:采用耐磨触点材料,典型使用寿命≥10万次(讯普标准测试),减少设备售后维护成本;
  • 环境适应性:符合RoHS、REACH环保标准,无有害物质,适配一般室内/户外(非极端环境)使用;
  • 抗振动性:立贴结构与鸥翼引脚焊接牢固,可承受一定强度的机械振动(如手持设备晃动),开关状态稳定。

四、品牌与品质保障

讯普(XUNPU)作为国内轻触开关领域的成熟厂商,TS-1002S-04526C继承了品牌的品质管控体系:

  • 全流程生产检测:从原材料采购到成品测试,每批次产品均通过电气性能、机械寿命、外观等多维度检测;
  • 定制化适配:可根据客户需求提供按钮颜色(如白色、红色)、引脚长度微调等定制服务(需提前沟通);
  • 技术支持:提供安装手册、焊接参数指导,协助客户解决选型与应用中的问题。

五、选型与注意事项

1. 适用场景确认

  • 仅适配低功耗电路(触点电流≤50mA),避免用于大功率负载(如电机控制);
  • 安装空间需预留至少6.5mm×6.5mm(含引脚间隙),高度方向需≥5mm(含PCB厚度)。

2. 操作与维护建议

  • 避免用尖锐物体按压按钮(如针、螺丝刀),防止按钮损坏;
  • 焊接时注意引脚温度,避免超过260℃导致引脚变形或焊点氧化;
  • 长期使用后若出现按键失灵,可检查焊点是否脱落、触点是否磨损(非人为损坏可联系售后)。

TS-1002S-04526C凭借其微型化、稳定可靠的特点,成为各类紧凑电子设备的理想控制按键选择,可满足多数低功耗场景的功能控制需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.