Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XUNPU D-SUB-DR-15PCG-AB
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XUNPU D-SUB-DR-15PCG-AB
- Type
- XUNPU
- Minimum package
- 70 托盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- XUNPU
- Electronic Component
- D-SUB-DR-15PCG-AB
- Electronic Component
- 1
- Package
- Electronic Component
- Electronic Component
- 2
- Electronic Component
- D-Sub / VGA Connector
- Electronic Component
- 9.669g
- Electronic Component
- Electronic Component
- Electronic Component
- 1
- Electronic Component
- BM0265723309
- Electronic Component
- Electronic Component
- Operating Temperature
- 55℃~+105℃
- PIN
- 15P
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
D-SUB-DR-15PCG-AB 产品概述
一、产品基本属性与定位
D-SUB-DR-15PCG-AB是讯普（XUNPU） 品牌推出的一款通用型15Pin公头D-Sub/VGA连接器，采用弯插安装方式，核心定位为工业级信号传输+小功率负载连接组件。该产品兼容D-Sub标准接口规范，同时适配VGA模拟信号传输场景，可覆盖工业控制、车载电子、仪器仪表等对连接稳定性、宽温适应性有明确要求的领域。
二、核心参数详解
该产品的参数明确了应用边界与性能表现，关键指标如下：
类别 具体参数 说明 接口属性 公头/15Pin/2排布局 匹配D-Sub标准15Pin接口，对接母头无兼容问题 安装方式 弯插（插针垂直于PCB） 节省设备内部水平空间，适合紧凑结构设计 电气性能 信号脚额定电流3A 比常规VGA连接器电流承载更高，兼顾信号与小功率供电 环境参数 工作温度-55℃~+105℃/黑色外壳 覆盖工业级与车载级宽温需求，耐脏抗老化 品牌封装 讯普原厂/弯插封装 批量生产一致性稳定，符合工业标准三、结构设计与工艺特点
讯普针对该连接器的结构与工艺做了针对性优化，确保性能可靠：
- 弯插结构优势：插针采用垂直折弯设计，安装时无需占用PCB水平空间，适配小型PLC、车载显示器等紧凑设备；
- 标准接口兼容性：2排15Pin布局完全匹配D-Sub/VGA接口规范，可与同规格母头无缝对接，避免接口错位问题；
- 导电性能保障：插针采用高导电率磷青铜材质，表面镀锡/镀金（讯普常规工艺），接触电阻低（≤20mΩ），减少信号衰减；
- 外壳防护设计：黑色外壳采用耐冲击工程塑料，可承受轻微外力碰撞，同时隔离电磁干扰，提升信号传输质量。
四、典型适用场景
该产品的参数与设计使其适用于以下核心场景：
- 工业控制：PLC信号输入输出接口、传感器数据采集模块连接；
- 车载电子：车载显示器VGA信号传输、车载控制器信号接口（宽温满足-40℃~85℃车载环境）；
- 仪器仪表：示波器、信号发生器等测试设备的外部接口（需稳定传输模拟/数字信号）；
- 消费电子：老旧显示器的VGA连接、小型机顶盒的多通道信号接口。
五、可靠性与环境适应性
该产品的可靠性设计满足多场景需求：
- 宽温稳定性：-55℃~+105℃的工作范围，可在北方户外低温、工业烤箱旁高温环境下稳定工作；
- 电流承载能力：3A信号脚电流，可同时传输信号与驱动小功率负载（如小型继电器、LED指示灯），减少额外接口设计；
- 插拔寿命：经过讯普内部测试，插拔次数≥5000次，适合需要频繁维护的设备；
- 抗腐蚀性能：黑色外壳与插针表面处理，可抵抗轻微盐雾腐蚀，适配沿海或潮湿环境。
六、安装与应用注意事项
为确保产品性能与设备安全，安装时需注意：
- PCB适配：确认PCB焊盘间距（2.54mm标准间距）、孔径与弯插插针尺寸匹配，避免插针无法插入；
- 焊接规范：回流焊温度≤260℃（持续时间≤10秒），手工焊用低温焊锡（≤230℃），防止插针变形；
- 插拔操作：对接母头时保持垂直方向，避免斜向插拔导致插针弯曲；
- 环境防护：潮湿/腐蚀性环境中，建议配合密封胶圈使用，进一步提升抗腐蚀能力。
该产品以高性价比、宽温适应性与紧凑结构，成为工业与消费电子领域D-Sub/VGA连接的优选组件，讯普原厂品质也确保了长期使用的稳定性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
