WMSIC Electronic Components

XUNPU TYPEC-1103-BRP24

ModelTYPEC-1103-BRP24
PackageSMD
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU TYPEC-1103-BRP24
Type
XUNPU
Minimum package
50 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
TYPEC-1103-BRP24
Electronic Component
1
Package
SMD
Electronic Component
USB Connector
Electronic Component
1.13g
(L)
10.4mm
Electronic Component
1
Electronic Component
USB 3.1
Electronic Component
BM0265723304
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
1
Electronic Component
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TYPEC-1103-BRP24 USB 3.1 Type-C 夹板母座产品概述

一、产品定位与核心价值

TYPEC-1103-BRP24是讯普(XUNPU)针对高速数据传输+大电流供电双重需求推出的Type-C母座连接器,采用夹板式SMD封装设计,兼顾小体积与高可靠性,适配消费电子、智能穿戴、物联网等多领域设备的Type-C接口升级需求。其核心价值在于:既满足USB 3.1 10Gbps的高速传输(兼容USB 2.0),又支持5A/5V的大功率供电,同时通过紧凑尺寸与长寿命设计,降低终端产品的空间占用与维护成本。

二、基础规格参数梳理

类别 具体参数 连接器类型 Type-C母座(正反插) 协议标准 USB 3.1(兼容USB 2.0/1.1) 触点数量 24Pin(全功能型) 端口数量 单端口 供电参数 额定电流5A,额定电压5V(支持PD扩展) 机械尺寸 10.45mm(长)×8.94mm(宽)×3.16mm(高) 工作温度范围 -25℃ ~ +85℃(宽温适应性) 插拔寿命 10000次(≥行业常规1万次标准) 封装/安装方式 SMD贴片+夹板固定 胶芯颜色 黑色(耐高温工程塑料)

三、关键性能特性解析

3.1 高速传输与兼容能力

基于USB 3.1协议,支持10Gbps(1.25GB/s)的理论传输速率,是USB 2.0(480Mbps)的20倍以上,可快速传输4K视频、大文件(如10GB电影仅需8秒左右);同时向下兼容USB 2.0/1.1设备,无需担心旧外设无法适配,降低终端产品的兼容成本。

3.2 大功率供电适配

额定5A电流可覆盖主流PD快充协议(PD3.0/PD2.0),支持手机、平板、笔记本的快速充电(如iPhone 14系列PD快充,1小时可充至80%以上);5V额定电压符合USB Type-C基础供电规范,可扩展至更高电压(如9V/12V)满足大功率设备需求。

3.3 可靠性与环境适应性

  • 插拔寿命:10000次插拔,按日常每天插拔10次计算,可稳定使用2年以上,远高于行业常规8000次的标准;
  • 宽温范围:-25℃至+85℃,适配户外设备(如便携式投影仪)、工业手持终端等高低温场景;
  • 电气性能:触点接触电阻≤30mΩ(保证信号与电流稳定传输),绝缘电阻≥100MΩ@500V DC(防止短路故障)。

四、典型应用场景

  1. 消费电子终端:智能手机、平板电脑、笔记本电脑的Type-C充电/数据接口;
  2. 智能穿戴设备:智能手表、无线耳机的充电底座接口;
  3. 物联网设备:智能家居控制器、环境传感器、智能门锁的数据/供电接口;
  4. 小型外设:移动硬盘、高速U盘、Type-C充电器的母座端;
  5. 工业手持设备:便携式检测仪器、条码扫描枪的Type-C连接接口。

五、安装与结构设计优势

  • 夹板式SMD封装:采用贴片回流焊+夹板固定设计,生产效率高(适合自动化产线),且夹板结构增强了连接器与PCB板的连接强度,减少焊接后脱落风险;
  • 防误插设计:Type-C正反插特性,用户无需区分方向即可插拔,提升使用体验;
  • 耐高温材料:胶芯采用LCP(液晶聚合物),可承受260℃以上回流焊温度,适配无铅焊接工艺;
  • 触点防护:触点表面镀金(行业常规工艺),防氧化、耐腐蚀,保证长期使用后的信号稳定性。

六、品牌与品质保障

讯普(XUNPU)作为专注连接器研发10余年的品牌,TYPEC-1103-BRP24通过RoHS环保认证(无铅、无镉等有害物质),符合欧盟REACH法规要求;产品批量供货稳定,可提供样品测试与定制化服务(如触点镀金厚度调整);售后支持完善,可协助终端厂商解决焊接、兼容性问题。

该产品以高性价比、全功能特性,成为Type-C接口升级的优选方案,适配多场景设备的性能需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.