WMSIC Electronic Components

XBLW 24C16S

Model24C16S(XBLW)
PackageSOT-23-5
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW 24C16S(XBLW)
Type
XBLW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
24C16S(XBLW)
Electronic Component
1
Package
SOT-23-5
Electronic Component
EEPROM
Electronic Component
0.041g
Electronic Component
1
Features
Built-in positions(POR)
Electronic Component
BM0265583733
Electronic Component
16Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

24C16S(XBLW)串行EEPROM产品概述

一、产品核心定位与应用价值

24C16S是芯伯乐(XBLW)推出的16Kbit容量I2C接口串行EEPROM,聚焦嵌入式系统的参数存储、数据备份需求,核心优势在于平衡了小体积、宽电压、高可靠性三大特性——既适配从1.8V低功耗MCU到5V传统系统的全电压区间,又通过100万次写寿命、100年数据保留满足工业级可靠性要求,适合消费电子、工业控制、物联网等多领域的小型化设备应用。

二、关键技术参数详解

2.1 存储与接口特性

  • 存储容量:16Kbit(等效2048字节),采用页写模式(典型页大小16字节),支持随机读/写与顺序读操作,可高效存储设备配置、校准数据、ID信息等。
  • 接口类型:标准I2C双向串行接口,兼容100kHz(标准)、400kHz(快速)、1MHz(高速)三种模式,仅需SDA(数据线)、SCL(时钟线)两根线通信,大幅简化系统布线。

2.2 电气性能参数

  • 工作电压范围:1.8V~5.5V,覆盖主流MCU的电压区间(如1.8V低功耗单片机、3.3V物联网芯片、5V工业控制器),无需额外电平转换电路。
  • 时钟频率:最高1MHz(高速I2C),通信效率是标准I2C的10倍,可缩短系统参数读取/写入时间。

2.3 可靠性与环境适应性

  • 写周期寿命:100万次(典型值),可满足频繁参数更新场景(如工业传感器的校准数据迭代、智能穿戴的用户设置);
  • 数据保留时间:100年(25℃环境下),确保长期断电后核心数据(如设备ID、出厂参数)不丢失;
  • 工作温度范围:-40℃~+85℃(工业级温度),可稳定工作于户外物联网节点、工业现场控制器等 harsh 环境。

2.4 写操作性能

  • 写周期时间(Tw):5ms(字节写/页写完成时间),远快于多数同容量EEPROM的10ms标准,可提升系统响应效率(如遥控器键位配置的实时生效)。

三、典型应用场景

24C16S的特性使其适配多领域实际需求:

  1. 工业控制:传感器节点的校准系数存储、PLC的参数备份、电机控制器的运行模式设定;
  2. 消费电子:智能手环的心率校准数据、遥控器的自定义键位、蓝牙耳机的配对记录;
  3. 物联网设备:低功耗节点的Wi-Fi配置、环境监测传感器的历史数据缓存;
  4. 汽车电子:倒车雷达的灵敏度参数、胎压监测模块的ID存储。

四、封装与引脚说明

  • 封装形式:SOT-23-5(超小型贴片封装),尺寸约2.9mm×2.5mm×1.1mm,适合高密度PCB布局,满足智能手环、微型传感器等小型化设备的空间限制;
  • 引脚定义(SOT-23-5引脚顺序:1→5):
    1. A0:地址引脚(接VCC/GND配置地址,支持设备级联);
    2. A1:地址引脚(同A0,最多支持4个设备级联);
    3. GND:电源地;
    4. SDA:I2C数据线;
    5. SCL:I2C时钟线。

五、使用注意事项

  1. 写操作防护:写过程中需确保电源稳定(避免断电导致数据错误),写周期(5ms)内不可重复发起写命令;
  2. 地址配置:A0/A1需根据级联需求设置(如A0=GND、A1=GND时地址为0x50),避免地址冲突;
  3. I2C上拉电阻:SDA/SCL需外接4.7kΩ~10kΩ上拉电阻(电压越高电阻可适当增大),确保通信信号完整性;
  4. 温度适配:工业级温度应用中,需优化PCB布局(避免局部过热),确保数据存储可靠性。

24C16S通过高性价比与工业级可靠性,成为嵌入式系统参数存储的主流选择之一,可满足多数场景的核心存储需求。

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