WMSIC Electronic Components

XBLW 24C64S

Model24C64S(XBLW)
PackageSOT-23-5
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW 24C64S(XBLW)
Type
XBLW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
24C64S(XBLW)
Electronic Component
1
Package
SOT-23-5
Electronic Component
EEPROM
Electronic Component
0.044g
Electronic Component
1
Features
Built-in positions(POR)
Electronic Component
BM0265583732
Electronic Component
64Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.8V~5.5V
Interface Type
I2C
Electronic Component
100
Clock Frequency(fc)
1MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

24C64S(XBLW) I2C接口串行EEPROM产品概述

24C64S是芯伯乐(XBLW)推出的一款64Kbit(8KB)I2C接口串行EEPROM,专为低功耗、小型化、高可靠性的电子系统设计,兼容宽电压范围与工业级温度环境,适合各类嵌入式设备的参数存储、数据备份等场景。

一、核心存储参数

24C64S的存储容量为64Kbit(8192字节),采用非易失性EEPROM存储单元,掉电后数据无需电池供电即可长期保留,是系统配置参数、传感器校准数据、用户信息等关键数据的理想载体。其串行I2C接口无需复杂并行总线,可大幅节省PCB空间,降低系统设计复杂度。

二、I2C接口特性

作为I2C总线器件,24C64S具备以下核心优势:

  1. 高速通信能力:支持最大时钟频率1MHz(I2C高速模式),相比传统100kHz/400kHz速率,数据传输效率提升2.5~10倍,适合对读写速度有要求的应用;
  2. 宽电压兼容性:工作电压范围为1.8V~5.5V,可直接匹配1.8V低功耗MCU(如STM32L系列)、3.3V主流MCU(如STM32F系列)及5V传统MCU(如ATmega系列),无需电平转换电路,简化系统设计;
  3. 多设备级联:通过硬件地址引脚(SOT-23-5封装内置地址配置)可配置8个不同设备ID,支持多片级联扩展存储容量,满足更大数据存储需求。

三、关键性能指标

24C64S在性能上具备明显竞争力:

  • 写周期时间短:单次写周期仅需5ms,是同类产品(通常10ms)的一半,可快速完成参数写入,提升系统响应速度;
  • 数据保留时间长:掉电后数据可保留100年,远超工业级EEPROM的10~20年标准,即使长期闲置也能保证数据完整性;
  • 写寿命长:支持100万次写操作,是普通EEPROM(10万次)的10倍,适合频繁更新数据的场景(如传感器动态校准、设备固件配置)。

四、可靠性与环境适应性

24C64S针对工业级应用优化了可靠性:

  1. 宽温度范围:工作温度覆盖**-40℃~+85℃**,可适应户外、车载、工业现场等恶劣环境(如低温冷库、高温车间);
  2. 抗干扰能力:内置ESD防护设计(符合IEC 61000-4-2标准),可承受静电冲击,提升系统稳定性;
  3. 低功耗特性:待机电流仅微安级,写操作电流也处于低水平,适合电池供电的便携式设备。

五、封装与典型应用

24C64S采用SOT-23-5超小型封装,尺寸约2.9mm×1.6mm×1.1mm,体积仅为传统DIP封装的1/10,适合小型化产品设计。其典型应用场景包括:

  • 穿戴设备:智能手环、手表的用户数据(步数、心率历史)、设备配置存储;
  • 工业传感器:温度、压力传感器的校准参数(一次写入长期有效,无需频繁校准);
  • 智能家居:智能插座、灯泡的Wi-Fi配置、定时参数存储;
  • 汽车电子辅助模块:车载USB充电器、胎压监测辅助单元的状态数据存储;
  • 小型电子设备:电子玩具、遥控器的用户自定义参数存储。

24C64S(XBLW)凭借高容量、高速、宽兼容、小封装等优势,成为嵌入式系统中存储关键数据的高性价比选择,可满足不同行业的多样化需求。

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