WMSIC Electronic Components

XBLW MCP6002T-I/SN MCP6002T

ModelMCP6002T-I/SN(XBLW)
PackageSOP-8
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW MCP6002T-I / SN(XBLW)
Type
XBLW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
MCP6002T-I/SN(XBLW)
Electronic Component
1
Package
SOP-8
Electronic Component
Operational Amplifier
Electronic Component
0.178g
Electronic Component
1
Electronic Component
Output
Features
Built-in
Electronic Component
BM0258535750
Operating Temperature
40℃~+125℃
Amplifier
2
Output Current
40mA
(SR)
800V/ms
Power Supply Voltage
1.8V~6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MCP6002T-I/SN (XBLW) 产品概述

MCP6002T-I/SN(XBLW)是一款双路低功耗轨到轨运算放大器,适合便携设备、传感器前端、信号调理与低频滤波等多种应用场景。器件在低电压下仍能保持良好的线性与低噪声特性,同时具备较强的输出驱动能力,能够在单电源或对称双电源配置下工作,便于在多种系统拓扑中应用。

一、主要特性(概览)

  • 双路放大器(双通道)
  • 最大电源电压差(Vdd−Vss):7 V
  • 轨到轨输入与轨到轨输出(RRO/RRI)
  • 增益带宽积(GBP):1 MHz
  • 输入失调电压(Vos):典型 4.5 mV
  • 输入失调电压温漂(Vos TC):2.3 μV/℃
  • 压摆率(SR):800 V/ms(即 0.8 V/μs)
  • 输入偏置电流(Ib):1 pA(典型)
  • 输入失调电流(Ios):1 pA
  • 噪声密度(eN):35 nV/√Hz @ 1 kHz
  • 共模抑制比(CMRR):90 dB
  • 静态电流(Iq):约 80 μA(典型)
  • 输出电流:可达 40 mA
  • 工作温度范围:-40 ℃ ~ +125 ℃
  • 供电范围:单电源 1.8 V ~ 6 V;最大电源差 7 V(支持常见双电源对称配置,如 ±1.5 V、±3 V 等)
  • 封装:SOP-8
  • 品牌:XBLW(芯伯乐)

二、性能亮点与设计优势

  • 轨到轨输入/输出:输入与输出能够接近电源轨,方便在低电压单电源系统中直接对接传感器与ADC,无需额外偏置电路。
  • 低功耗:每通道静态电流低(约 80 μA),适合电池供电或低功耗系统。
  • 低输入偏置、低失调与低噪声:1 pA 的偏置电流与 4.5 mV 的失调电压使其在高阻抗传感器接口(如电化学、温度测量)中表现稳定,35 nV/√Hz 的噪声密度保证了良好的信噪比。
  • 较强输出驱动能力:单通道最高可达 40 mA 输出电流,能直接驱动一定负载或驱动后续缓冲/滤波网络。
  • 宽工作温度:适用工业级温度范围(-40 ℃ 至 +125 ℃),适合恶劣环境应用。

三、典型应用场景

  • 便携式仪器与电池供电设备:ADC 缓冲、传感器接口、比较放大
  • 工业传感器前端:温度、压力、湿度传感器放大与滤波
  • 低频主动滤波器:二阶低通、高通与带通滤波器
  • 信号调理与采集系统:放大、差分转换、缓冲
  • 驱动小负载:小型继电器驱动、LED 驱动器(在允许的负载与限制内)

四、使用建议与注意事项

  • 电源滤波:推荐在近引脚处放置 0.1 μF 陶瓷旁路电容,以抑制瞬态噪声并提高稳定性。对于对噪声敏感的应用,可在电源线上并联更大容量电解电容(例如 4.7 μF)。
  • 输入保护:尽管为轨到轨器件,仍建议避免在输入端施加超出电源轨的电压,必要时加入限流电阻或钳位二极管。
  • 布局优化:将模拟输入与敏感节点走短线,地线采用单点或星形接地,减少共模干扰。差分或高阻抗输入应尽量靠近芯片引脚布线。
  • 稳定性考量:若用于高增益配置或与容性负载直接驱动,需评估相位裕度。对于容性负载可在输出端串联小阻抗以保持稳定。

五、封装与订购信息

  • 封装形式:SOP-8,适合常规贴片回流焊工艺,方便批量生产与装配。
  • 推荐型号:MCP6002T-I/SN(XBLW)— 请在下单时确认完整的器件代码与供应信息,以确保温度等级与包装形式满足需求。

六、结论

MCP6002T-I/SN(XBLW)是一款面向低电压、低功耗且需要轨到轨输入输出能力的双通道运放。其低噪声、低偏置电流和适度的输出驱动能力,使其在便携设备、传感器前端与低频信号调理中具有良好性价比。设计时结合适当的电源滤波与布线措施,能够发挥该器件稳定而可靠的性能。若需更详细的电气特性曲线、引脚排列或参考电路,请提供是否需要完整数据手册以便进一步补充。

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