WMSIC Electronic Components

XBLW SN74HC08N

ModelSN74HC08N(XBLW)
PackageDIP-14
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW SN74HC08N(XBLW)
Type
XBLW
Minimum package
25 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
SN74HC08N(XBLW)
Electronic Component
1
Package
DIP-14
Electronic Component
Logic Gate
Electronic Component
74HC
Electronic Component
1.697g
Electronic Component
1
Channel Count
4
Features
Electronic Component
Electronic Component
BM0265609075
Operating Temperature
40℃~+105℃
Operating Voltage
2V~6V
Logic Type
and Gate
Current(IOH)
5.2mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74HC08N(芯伯乐XBLW)逻辑门阵列产品概述

一、产品核心定位与基本属性

SN74HC08N(芯伯乐XBLW)是一款4通道2输入CMOS与门阵列,属于74HC高速CMOS逻辑系列,兼容传统74LS系列引脚与功能,同时具备低功耗、宽电压、高抗干扰的特性。产品采用DIP-14双列直插封装,适合面包板原型开发、直插焊接及工业级电路设计,广泛应用于数字逻辑运算、信号选通、单片机外围逻辑控制等场景。

二、关键电气参数详解

该芯片的电气参数平衡了高速性能与低功耗需求,核心参数如下:

1. 电源与功耗特性

  • 工作电压范围:2V~6V,覆盖低电压(如2.5V、3.3V)与标准5V系统,适配多种数字平台;
  • 静态电流(Iq):仅2μA(典型值),待机功耗极低,适合电池供电的便携设备;

2. 输入输出特性

  • 输入逻辑电平:
    • 高电平(VIH):对应不同VCC下的阈值(如VCC=2V时≥1.5V,VCC=4.5V时≥3.15V,VCC=6V时≥4.2V);
    • 低电平(VIL):对应不同VCC下的阈值(如VCC=2V时≤0.5V,VCC=4.5V时≤1.35V,VCC=6V时≤1.8V);
  • 输出逻辑电平:
    • 高电平(VOH):VCC=5V时≥4.5V(IOH=-20μA),接近电源电压,驱动能力强;
    • 低电平(VOL):VCC=5V时≤0.1V(IOL=4mA),噪声裕量充足;
  • 驱动能力:灌电流(IOL)4mA(可驱动LED、小型继电器),拉电流(IOH)5.2mA(低负载驱动);

3. 高速性能

传播延迟(tpd):典型值9ns(VCC=5V,CL=50pF),满足中等速度数字电路的实时运算需求。

三、封装与引脚配置

产品采用DIP-14双列直插封装,引脚顺序与功能明确,便于焊接与调试:

引脚号 功能描述 引脚号 功能描述 1 通道1输入A(1A) 8 通道3输入A(3A) 2 通道1输入B(1B) 9 通道3输入B(3B) 3 通道1输出Y(1Y) 10 通道3输出Y(3Y) 4 通道2输入A(2A) 11 通道4输入A(4A) 5 通道2输入B(2B) 12 通道4输入B(4B) 6 通道2输出Y(2Y) 13 通道4输出Y(4Y) 7 接地(GND) 14 电源(VCC)

注:每个通道为独立2输入与门,输出满足逻辑关系:Y = A ∧ B(仅当A、B均为高电平时,Y输出高电平)。

四、典型应用场景

该芯片因多通道、低功耗、宽电压的特性,适用于以下场景:

1. 数字逻辑运算

作为基础逻辑单元,用于实现与逻辑判断(如“双信号同时有效”“条件触发”等),可扩展为更复杂的逻辑电路(如与非、或与等);

2. 单片机外围逻辑控制

  • 按键防抖:将按键信号与防抖电容/电阻输出接入与门,过滤机械抖动;
  • 状态判断:多个传感器信号的与逻辑组合(如“温度+湿度均达标”才触发执行);

3. 信号选通与电平转换

  • 信号选通:通过与门控制某路信号的通断(如“使能信号+数据信号”选通输出);
  • 电平适配:兼容2V~6V电压范围,可作为3.3V系统与5V系统的电平转换桥接;

4. 工业与消费电子

  • 工业控制:传感器信号的逻辑过滤、继电器驱动的使能控制;
  • 消费电子:LED显示的选通、小型家电的逻辑开关控制。

五、环境适应性与可靠性

  • 工作温度范围:-40℃~+105℃,覆盖工业级温宽,适合户外、车载及 harsh 环境;
  • 抗干扰能力:CMOS工艺自带输入保护二极管,抗静电(ESD)能力强,减少噪声干扰;
  • 兼容性:完全兼容TI SN74HC08N引脚与功能,可直接替换,降低设计风险。

六、品牌与品质保障

芯伯乐(XBLW)作为国内专业逻辑芯片厂商,SN74HC08N系列产品通过ISO9001质量认证,符合RoHS环保标准,供货稳定,适合量产与原型开发需求。

该产品以高性价比、宽适配性成为数字电路设计中的基础核心器件,可满足从原型验证到工业量产的多场景需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.