Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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SN74HC08N(芯伯乐XBLW)是一款4通道2输入CMOS与门阵列,属于74HC高速CMOS逻辑系列,兼容传统74LS系列引脚与功能,同时具备低功耗、宽电压、高抗干扰的特性。产品采用DIP-14双列直插封装,适合面包板原型开发、直插焊接及工业级电路设计,广泛应用于数字逻辑运算、信号选通、单片机外围逻辑控制等场景。
该芯片的电气参数平衡了高速性能与低功耗需求,核心参数如下:
传播延迟(tpd):典型值9ns(VCC=5V,CL=50pF),满足中等速度数字电路的实时运算需求。
产品采用DIP-14双列直插封装,引脚顺序与功能明确,便于焊接与调试:
引脚号 功能描述 引脚号 功能描述 1 通道1输入A(1A) 8 通道3输入A(3A) 2 通道1输入B(1B) 9 通道3输入B(3B) 3 通道1输出Y(1Y) 10 通道3输出Y(3Y) 4 通道2输入A(2A) 11 通道4输入A(4A) 5 通道2输入B(2B) 12 通道4输入B(4B) 6 通道2输出Y(2Y) 13 通道4输出Y(4Y) 7 接地(GND) 14 电源(VCC)注:每个通道为独立2输入与门,输出满足逻辑关系:Y = A ∧ B(仅当A、B均为高电平时,Y输出高电平)。
该芯片因多通道、低功耗、宽电压的特性,适用于以下场景:
作为基础逻辑单元,用于实现与逻辑判断(如“双信号同时有效”“条件触发”等),可扩展为更复杂的逻辑电路(如与非、或与等);
芯伯乐(XBLW)作为国内专业逻辑芯片厂商,SN74HC08N系列产品通过ISO9001质量认证,符合RoHS环保标准,供货稳定,适合量产与原型开发需求。
该产品以高性价比、宽适配性成为数字电路设计中的基础核心器件,可满足从原型验证到工业量产的多场景需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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