WMSIC Electronic Components

XBLW LMV324ATDTR

ModelLMV324ATDTR(XBLW)
PackageTSSOP-14
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW LMV324ATDTR(XBLW)
Type
XBLW
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
LMV324ATDTR(XBLW)
Electronic Component
1
Package
TSSOP-14
Electronic Component
Operational Amplifier
Electronic Component
0.101g
Electronic Component
1
Electronic Component
Output
Features
Built-in
Electronic Component
BM0265621929
Operating Temperature
40℃~+125℃
Amplifier
4
Output Current
40mA
(SR)
800V/ms
Power Supply Voltage
2.3V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMV324ATDTR(XBLW芯伯乐)运算放大器产品概述

一、产品定位与核心特性

LMV324ATDTR是芯伯乐(XBLW)推出的四路轨到轨输入输出运算放大器,专为低功耗、宽电源范围、高速信号处理场景设计,兼容标准LMV324引脚布局,可直接替换同封装产品。核心特性包括:

  • 全轨到轨(RRIO):输入覆盖电源轨,输出接近电源轨,最大化单电源下的信号动态范围;
  • 低功耗:总静态电流仅80μA,单通道20μA,适配电池供电设备;
  • 高速性能:800V/ms压摆率(SR)+1MHz增益带宽积(GBP),满足中等速度信号调理;
  • 高输入阻抗:1pA输入偏置电流(Ib),适配高阻抗传感器或微弱信号;
  • 宽电源适应性:单/双电源兼容,覆盖工业及消费电子常见供电场景。

二、关键参数深度解析

1. 电源适应性

  • 单电源:2.3V~5.5V,兼容3.3V、5V主流供电系统;
  • 双电源:±1.15V±2.75V(对应Vcc-Vee=2.3V5.5V),适配正负电源设计;
  • 电源波动耐受度高,可适应设备供电不稳定场景。

2. 轨到轨性能

  • 输入共模范围:单电源下覆盖Vss~Vdd,可处理接近电源轨的信号(如传感器输出的低幅信号);
  • 输出摆幅:单电源5V下典型值达Vss+10mV~Vdd-10mV,动态范围比传统运放提升30%以上,避免信号削顶。

3. 性能与精度

  • 增益带宽积(GBP):1MHz,增益10时带宽约100kHz,满足音频、低速数据采集需求;
  • 压摆率(SR):800V/ms,满幅(4V)信号上升时间仅5μs,适合脉冲信号或快速变化信号;
  • 直流精度:输入失调电压(Vos)1mV、温漂2.3μV/℃,输入失调电流(Ios)1pA,宽温下保持稳定输出,适配精密调理。

4. 噪声与输出能力

  • 电压噪声密度:35nV/√Hz@1kHz,低噪声特性适合微弱信号放大(如传感器输出);
  • 输出电流:40mA(典型值),可驱动中等负载(如小型显示、继电器线圈);
  • 共模抑制比(CMRR):90dB,抑制共模干扰能力强,适配工业噪声环境。

三、封装与引脚兼容性

LMV324ATDTR采用TSSOP-14封装,引脚布局与标准LMV324完全兼容,无需重新设计PCB即可替换升级。TSSOP封装体积小(4.4mm×3.0mm),适合便携式设备的紧凑空间,散热性能满足工业级宽温需求。

四、典型应用场景

1. 便携式电子设备

  • 智能手环、蓝牙耳机等电池供电设备的信号放大;
  • 3.3V单电源适配,轨到轨输出满足低电压下的信号动态。

2. 传感器信号调理

  • 压电传感器、光电二极管等高阻抗传感器的信号放大;
  • 低噪声+宽温特性适配工业压力、温度传感器的滤波调理。

3. 工业控制与自动化

  • 工作温度-40℃~+125℃,适配车间、户外等极端环境;
  • 40mA输出电流驱动PLC输入模块、小型执行器。

4. 消费电子与医疗设备

  • 小型音箱、耳机的音频信号放大;
  • 血糖监测仪、血氧仪等便携式医疗设备的微弱信号处理。

五、环境适应性与可靠性

LMV324ATDTR符合工业级宽温要求,可在-40℃~+125℃稳定工作;低静态电流延长电池设备续航;轨到轨特性避免传统运放的“轨外”信号损失,提升系统性能。

总结:LMV324ATDTR(XBLW)是一款高性价比四路轨到轨运放,平衡了低功耗、高速性能与宽电源适应性,适配从消费电子到工业控制的多场景,引脚兼容优势便于快速升级替换。

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