Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XBLW SN74LS02N
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XBLW SN74LS02N(XBLW)
- Type
- XBLW
- Minimum package
- 25 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XBLW
- Electronic Component
- SN74LS02N(XBLW)
- Electronic Component
- 1
- Package
- DIP-14
- Electronic Component
- Logic Gate
- Electronic Component
- 74LS
- Electronic Component
- 1.606g
- Electronic Component
- 1
- Channel Count
- 4
- Features
- Electronic Component
- Electronic Component
- BM0265621953
- Operating Temperature
- 20℃~+85℃
- Operating Voltage
- 2V~6V
- Logic Type
- Gate
- Current(IOH)
- 5.2mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SN74LS02N（芯伯乐XBLW）4通道或非门产品概述
SN74LS02N是芯伯乐（XBLW）推出的一款4通道2输入或非门逻辑器件，属于经典74LS系列的国产化兼容产品，兼顾低功耗、高速性能与宽电压适配性，广泛适用于数字电路原型开发、工业控制及消费电子等场景。
一、产品核心逻辑与定位
SN74LS02N集成4个独立的2输入或非门，每个通道实现逻辑功能：( Y = eg(A + B) )（输出为两个输入的“或”运算结果取反）。作为LS（低功耗肖特基）技术衍生器件，它平衡了传统TTL的高速特性与CMOS的低功耗优势，兼容74LS02标准引脚与电气规范，可直接替换进口同型号器件，降低采购成本。
二、关键电气参数解析
XBLW版本的SN74LS02N在参数上优化了功耗与电平特性，核心参数如下：
- 宽电压适配：工作电压范围2V~6V，兼容3.3V低电压系统与传统5V逻辑平台，适配不同电源设计需求；
- 超低静态功耗：静态电流( I_q )仅2μA，相比普通74LS系列器件（典型几十μA）节能显著，适合电池供电的便携设备；
- 均衡驱动能力：灌电流( I_{OL} )与拉电流( I_{OH} )均为5.2mA，可直接驱动LED、小型继电器等中小功率负载，无需额外缓冲电路；
- 清晰电平特性：输入高电平( V_{IH} )典型4.2V，输出高电平( V_{OH} )达5.81V（带载测试值），输出低电平( V_{OL} )仅260mV，电平摆幅大，抗电磁干扰能力强；
- 高速响应：传播延迟( t_{pd} )在5V电源、15pF负载下仅7ns，满足高速数字电路（如计数器、译码器）的时序要求。
三、封装与典型应用场景
- 封装形式：采用DIP-14（双列直插14脚）封装，引脚间距2.54mm，适配标准面包板、原型PCB及传统焊接工艺，便于手工操作与批量生产；
- 典型应用：
- 数字逻辑运算：在计数器、触发器、译码器中作为或非逻辑单元，实现状态转换与信号判断；
- 原型开发：学生实验、工程师快速验证电路，DIP封装便于调试与替换；
- 工业控制：工作温度覆盖-20℃~+85℃，可用于小型工业传感器信号处理、设备状态监测；
- 电平转换：利用宽电压特性，实现3.3V与5V逻辑系统间的信号兼容。
四、工作环境与可靠性
SN74LS02N的工作温度范围为-20℃~+85℃，满足商业级到工业级的环境需求，可适应室内外（非极端低温/高温）场景；XBLW对器件进行了焊接温度冲击、高低温存储等可靠性测试，确保在规定参数下长期稳定工作。此外，DIP-14封装的机械强度高，引脚不易氧化，适合长期使用。
这款器件以其高性价比、兼容性强的特点，成为数字电路设计中或非逻辑运算的常用选择，尤其适合需要兼顾功耗与速度的应用场景。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
