WMSIC Electronic Components

XINLUDA XL3485

ModelXL3485
PackageSOP-8
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XL3485
Type
XINLUDA
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XL3485
Electronic Component
1
Package
SOP-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0.232g
Electronic Component
256
Electronic Component
1
Features
Tx / Rx;;;; Low Power
Electronic Component
BM0226963862
Operating Temperature
40℃~+85℃
Operating Voltage
3V~3.6V
Receiver
1
Data
12Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL3485 产品概述

一、产品简介

XL3485 是信路达(XINLUDA)推出的一款工业级 RS-485/RS-422 差分收发器,封装为 SOP-8(150 mil)。该器件集成 1 个驱动器与 1 个接收器,支持半双工通讯模式,工作电压范围 3.0V 至 3.6V,典型用于 3.3V 系统。器件支持最高 12 Mbps 的数据速率,最大节点数可达 256 个,工作温度范围为 -40℃ 至 +85℃,静态电流低至 520 µA,适用于工业控制、楼宇自动化、仪表及远程数据采集等领域。

二、主要特性

  • 通信标准:兼容 RS-485 / RS-422 差分总线架构
  • 收发结构:1 路驱动器 + 1 路接收器(半双工)
  • 工作电压:3.0 V ~ 3.6 V(适配 3.3 V 系统)
  • 数据速率:高达 12 Mbps,支持高速差分通信
  • 总线容量:支持多达 256 节点(实际数目受网络拓扑与终端阻抗影响)
  • 工作温度:-40℃ ~ +85℃(工业级)
  • 静态/静止电流:520 µA(典型值,低功耗)
  • 封装与品牌:SOP-8(150 mil),品牌 XINLUDA(信路达)
  • 通讯模式:半双工,通常通过使能引脚控制驱动器发射/接收切换

三、功能与优势

  • 低功耗:520 µA 的静态电流使 XL3485 适合对能耗敏感的远程节点和电池供电设备。
  • 高速传输:支持 12 Mbps,满足高速数据采集、实时控制与视频/数据短帧传输的需要。
  • 工业级温度范围:-40℃ 到 +85℃,可靠性满足恶劣环境下长时间运行要求。
  • 大节点支持:理论上可并联多达 256 个节点,便于大规模现场总线布线和扩展。
  • 兼容性好:可与常见 3.3V MCU 直接接口,便于系统集成与软件移植。

四、典型应用场景

  • 工业现场总线与 PLC 扩展模块
  • 楼宇自控、门禁与安防系统
  • 电力和水表抄表系统、数据记录仪
  • 无线网关与远程 I/O 采集终端
  • 仪器仪表与嵌入式通信接口

五、系统设计注意事项

  • 电源与旁路:在 VCC 引脚附近放置 0.1 µF 陶瓷旁路电容,减小电源噪声与瞬态电流冲击。
  • 差分线终端:长线或点对点应用应在两端采用 120 Ω(或按线缆特性匹配的阻抗)终端电阻,减少反射。
  • 偏置与失效保护:若器件本身无内置偏置与失电保护,建议采用总线偏置电阻(例如在主控端加上拉/下拉电阻),保证空闲总线时接收器输出稳定,防止噪声触发。
  • 半双工控制:通过驱动器使能(DE)/接收器使能(/RE)引脚控制收发切换,注意换向延时与总线仲裁,避免冲突发送。软件/硬件需协调好驱动器释放到接收器准备状态的时间。
  • 布线与接地:差分对应尽量并行布线,保持恒定间距,避免与高频或高电流回路平行布线。接地线应尽量粗短且直,必要时采用单点接地或隔离以减少地环路影响。
  • ESD 与浪涌保护:工业现场易受静电与浪涌干扰,建议在 A、B 差分线上并联 TVS 二极管或其他防护元件,提高系统抗扰度。
  • 芯片布局:SOP-8 标准封装,布板时确保足够散热面与焊盘可靠性,关注回流焊工艺兼容性。

六、封装与采购信息

  • 封装形式:SOP-8(150 mil)塑封,适用于常规贴片工艺与手工焊接调试。
  • 品牌:XINLUDA(信路达)
  • 采购建议:在批量采购前建议样片验证,确认系统中的终端匹配、通信协议与半双工控制策略。

七、实用建议与常见问题

  • 若需更高节点数或长距离网络,务必考虑拓扑、终端匹配与信号衰减,必要时增加中继或差分转光纤方案。
  • 在高噪声环境中,合理使用屏蔽线与接地参考,避免共模干扰超过芯片允许范围。
  • 设计时预留驱动器使能信号的延时余量,防止切换瞬间数据丢失或总线冲突。

综上所述,XL3485 以其低功耗、高速、工业级温度和大节点支持的特点,是常规 RS-485/RS-422 半双工通信系统中性价比较高的选择。实际使用时按上述布局与保护建议优化硬件设计与软件控制,可显著提升系统的稳定性与可靠性。

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