WMSIC Electronic Components

XINLUDA XL74HC245

ModelXL74HC245
PackageSOP-20-300mil
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XL74HC245
Type
XINLUDA
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XL74HC245
Electronic Component
1
Package
SOP-20-300mil
Electronic Component
Buffers / Drivers / Transceivers
Electronic Component
74HC
Electronic Component
0.931g
Electronic Component
1
Electronic Component
1
Features
Output
Electronic Component
BM0230014976
Operating Temperature
40℃~+85℃
Operating Voltage
2V~6V
Output Type
Electronic Component
Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL74HC245 产品概述

一、产品简介

XL74HC245 是 XINLUDA(信路达)推出的一款高性能三态缓冲器/驱动器/收发器,属于 74HC 系列,单片元件含 1 个器件、8 位双向通道,封装为 SOP-20-300MIL。器件支持 2V 至 6V 宽工作电压,工作温度范围为 -40℃ 至 +85℃,适用于各种低功耗、高速的总线隔离与数据缓冲场合。

二、主要特点

  • 输出类型:三态(可使能输出高阻,以实现总线共享)。
  • 通道类型:双向 8 位收发,适合一对一的双向数据传输。
  • 工作电压:2.0V ~ 6.0V,便于与 1.8V、3.3V、5V 等多种系统电压兼容(需注意接口电平规则)。
  • 静态电流 (Iq):典型 8 μA,适合低功耗设计。
  • 传播延迟 (tpd):9 ns(在 4.5V、CL=50 pF 条件下),具备良好的开关速度。
  • 封装:SOP-20-300MIL,适合手工焊接与自动贴片生产。

三、典型电气性能(关键参数)

  • 静态电流:8 μA(典型,工作电压范围内参照器件手册)。
  • 传播延迟:9 ns @ VCC=4.5V, CL=50 pF(上升/下降时间与负载相关)。 说明:以上参数为代表性典型值,设计时应参考厂家完整的电气规格书以获得最严格的极限值及温度漂移信息。

四、功能与引脚概览

XL74HC245 通常带有方向控制(DIR)和输出使能(OE\,通常为低有效)两枚控制引脚:

  • DIR:选择数据流向(A→B 或 B→A)。
  • OE\:使能或禁止所有输出,置为高阻态以实现多设备总线共享。 具体引脚分配请参照 XINLUDA 提供的原厂引脚图与封装说明。

五、典型应用场景

  • CPU/外设总线隔离与多主机总线拓扑中的总线收发器。
  • 不同电压域之间的缓冲与驱动(在满足电平和容限条件下)。
  • 存储器接口、地址/数据总线缓冲、FPGA 与微处理器间的短线驱动。
  • 需要三态控制的多设备并联场合。

六、使用建议与 PCB 布局要点

  • 在 VCC 引脚附近放置 0.1 μF 陶瓷去耦电容,靠近器件引脚焊盘以抑制瞬态噪声。
  • 建议使用连续地参考地平面,减少回流路径阻抗与串扰。
  • 长总线建议分段布线并加终端阻抗或串联阻抗,避免反射与振铃。
  • 输出驱动大电容负载时注意上升/下降时间与功耗增加,必要时加入限流阻抗。
  • 处理与存储符合防静电规范(ESD),焊接温度与时间参考封装工艺要求。

七、包装与可靠性

  • 封装为 SOP-20-300MIL,便于标准 SMT 生产线装配。
  • 工作温度 -40℃ 至 +85℃,适合工业级温度需求。
  • 品牌:XINLUDA(信路达),请在采购时核对批号与数据手册,保证质量与可追溯性。

总结:XL74HC245 以其低静态电流、宽工作电压以及三态双向 8 位收发能力,适合用于需要总线共享、总线隔离与高速缓冲的设计。具体应用与极限参数请以 XINLUDA 的完整产品规格书为准。

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