Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XINLUDA XD74LS21
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XINLUDA XD74LS21
- Type
- XINLUDA
- Minimum package
- 1000 管装
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XINLUDA
- Electronic Component
- XD74LS21
- Electronic Component
- 1
- Package
- DIP-14
- Electronic Component
- Logic Gate
- Electronic Component
- 74LS
- Electronic Component
- 1.631g
- Electronic Component
- 1
- Channel Count
- 2
- Electronic Component
- BM0228586568
- Operating Temperature
- 0℃~+70℃
- Operating Voltage
- 4.75V~5.25V
- Logic Type
- and Gate
- Current(IOH)
- 400uA
- Current(IOL)
- 8mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XD74LS21 产品概述
一 产品简介
XD74LS21 是 XINLUDA（信路达）提供的一款双 4 输入与门（dual 4-input AND），属于 74LS 低功耗肖特基 TTL 系列。器件采用 DIP-14 封装，工作电压 4.75V～5.25V，工作温度范围为 0℃～+70℃，适用于常规商业温区的数字逻辑电路和门阵列搭接场合。
二 主要特性
- 双通道 4 输入与门结构，适合实现多路条件的组合控制与地址译码。
- 输入阈值：VIH ≥ 2.0V，VIL ≤ 1.0V，兼容标准 TTL 电平。
- 输出电平：高电平 VOH 范围 2.7V～3.4V，低电平 VOL 典型/极限值在 250mV～500mV 区间（视工作条件而定）。
- 驱动能力：下拉（IOL）可达 8mA，输出上拉（IOH）约 400μA，符合 LS 家族常见负载驱动能力特性。
- 传输延迟：在 5V、CIN≈15pF 条件下，tpd 典型/最大值约为 15ns～20ns，适合中等速率的逻辑系统。
三 电气性能要点与设计提示
- 电源与去耦：为保证稳定工作并降低传输延迟散布，建议 VCC-GND 之间并联 0.01µF～0.1µF 的去耦电容，放置在芯片引脚附近。
- 扇出与负载计算：由于 VOH 源电流较小（IOH ≈ 400µA），在需要驱动多个输入或上拉负载时，应以 VOH 保持在有效高电平为准进行计算；低电平驱动能力较强（IOL = 8mA），能可靠拉低多点输入。
- 电平兼容性：输入阈值和输出电平满足 TTL 族互连要求，但与 CMOS 直连时需注意输入漏电流和噪声裕度差异。
- 温度与电压工况：工作电压应严格控制在 4.75V～5.25V；在边界电压或高温环境下，输出电平和延迟会有偏移，应在系统级验证。
四 典型应用场景
- 多条件控制与门电路、地址译码（地址线条件合成）、芯片选通信号生成。
- 通用数字门阵列、逻辑清洗（glue logic）以及需要中等速度和标准 TTL 接口的系统工程。
五 包装与兼容性
XD74LS21 提供 DIP-14 等常见封装，便于面包板与插座使用。作为 74LS 系列器件，其引脚功能和逻辑兼容性与其它 74LS 双 4 输入与门型号一致，便于替换和系统集成。但在替换时仍建议核对器件电气极限与厂商数据手册，确保在具体电源、温度与负载条件下满足系统要求。
如需更详细的引脚图、时序图或器件级典型电路，请告知具体应用场景与限制条件，我可进一步提供针对性的设计建议与校核计算。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
