WMSIC Electronic Components

XINLUDA XL74LS00

ModelXL74LS00
PackageSOP-14
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XL74LS00
Type
XINLUDA
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XL74LS00
Electronic Component
1
Package
SOP-14
Electronic Component
Logic Gate
Electronic Component
74LS
Electronic Component
0.324g
Electronic Component
1
Channel Count
4
Electronic Component
BM0230014973
Operating Temperature
0℃~+70℃
Operating Voltage
4.75V~5.25V
Logic Type
and Gate
Current(IOH)
400uA
Current(IOL)
8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL74LS00 产品概述

一、产品简介

XL74LS00(信路达 XINLUDA)为经典的 74LS 系列四路二输入与非门(Quad 2‑input NAND)逻辑芯片,封装为 SOP‑14。器件在标准 TTL 电源 5V(4.75V~5.25V)下工作,适用于常规数字逻辑控制、门电路构成与低速数字系统的逻辑实现。

二、主要特性

  • 逻辑类型:与非门(NAND),每通道 2 个输入,器件共 4 个通道。
  • 工作电压:4.75V ~ 5.25V。
  • 输出驱动能力:下拉电流 IOL = 8 mA;上拉电流 IOH = 400 μA(典型)。
  • 输入门限:VIH = 2.0 V(输入高电平);VIL = 0.8 V(输入低电平),与 TTL 兼容。
  • 输出电平:VOH ≧ 2.7 V;VOL ≦ 0.5 V(典型)。
  • 传播延迟:tpd ≈ 25 ns @ 5V, CL = 15 pF。
  • 工作温度:0 ℃ ~ +70 ℃。
  • 封装:SOP‑14,品牌:XINLUDA(信路达)。

三、电气参数要点

74LS00 属于低功耗肖特基 TTL(LS)家族,输出高电平能提供的电流有限(IOH 约 400 μA),因此在做高电平驱动或与 CMOS 直接接口时要注意电平匹配。下拉能力较强(IOL = 8 mA),适合拉低多个 TTL 输入。由于 VOH 较接近 TTL 规范下限,级间扇出建议按规范控制,典型扇出约为 10(视具体输入电流而定)。

四、典型应用

  • 通用逻辑门阵列与组合逻辑实现。
  • 时序电路、译码与地址选通信号处理。
  • 低速驱动、小型控制器与接口电平整形。
  • 教学与实验平台中的基础逻辑模块。

五、设计与使用建议

  • 电源去耦:在 VCC 与 GND 之间靠近芯片焊盘放置 0.1 μF 陶瓷去耦电容,抑制瞬态噪声。
  • 输入保护:避免悬空输入,未使用输入应接至合适电平(GND 或 VCC)以防冒险触发与增加功耗。
  • 与 CMOS 互联:若与 5V 承受能力有限的 CMOS 直连,建议采取电平移位或使用缓冲器,因 VOH/IOH 特性可能影响可靠识别。
  • 布线:减少长导线与串扰,尤其是高频切换边沿处。必要时在输入端加小阻尼(几十欧姆)以抑制反射与振铃。
  • 热与环境:工作温度范围为 0~70 ℃,在更宽温度或工业级场合请选用相应等级器件。

六、封装与可靠性

SOP‑14 表面贴装封装,便于自动贴片与波峰/回流焊接。信路达提供出厂前的静电防护与基本质量检验,适合商业与一般工业类应用场景。长期可靠性建议参考供应商的完整规格书与应力测试报告。

七、采购与替代

型号:XL74LS00(信路达 XINLUDA),封装 SOP‑14。若需替代,可选用其他厂家兼容的 74LS00 系列器件或更现代的 CMOS 等效(如 74HC00/74HCT00,若需更低功耗或更高输入阻抗时使用 HCT 可保持 TTL 兼容电平)。采购时请确认温度等级、批次与放行文件以保证一致性。

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