WMSIC Electronic Components

XINLUDA XL74HC595

ModelXL74HC595
PackageSOP-16
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XL74HC595
Type
XINLUDA
Minimum package
2500 圆盘

Technical parameters

Electronic Component
to
Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XL74HC595
Electronic Component
1
Package
SOP-16
Electronic Component
positions Register
Electronic Component
74HC
Electronic Component
0.331g
Electronic Component
1
Electronic Component
1
Features
Output
Electronic Component
BM0228561305
Operating Temperature
40℃~+85℃
Operating Voltage
2V~6V
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL74HC595(信路达)产品概述

一、主要特性

XL74HC595 是一款基于 74HC 系列工艺的 8 位串行入并行出移位寄存器,带独立暂存锁存和三态输出控制。核心特性包括:工作电压 2.0V6.0V、工作温度范围 -40℃+85℃、每片 8 位并行输出、输出为三态(可实现总线共享)、在 6V、50pF 负载条件下传播延迟 tpd≈15ns,典型最大时钟频率可达到 30MHz(取决于负载与电源条件)。封装为 SOP-16(150mil),品牌为 XINLUDA(信路达)。

二、产品参数(概览)

  • 功能:串行至并行移位寄存器(含输出暂存器)
  • 位数:8 位
  • 输出类型:三态(输出使能可控)
  • 电源电压:2.0V ~ 6.0V
  • 工作温度:-40℃ ~ +85℃
  • 传播延迟:15ns(@6V, CL=50pF)
  • 典型时钟频率:最高可达 30MHz(受工况影响)
  • 封装:SOP-16_150MIL

三、功能要点与引脚说明(概念)

器件包含一个串入式移位寄存器和一个独立的输出暂存寄存器。典型控制信号有串行数据输入(SER)、移位时钟(SRCLK)、暂存时钟/锁存(RCLK)、输出使能(OE,低有效)以及移位清零(SRCLR,低有效)。通过将 Q7'(串出)级联,可方便实现多片并行扩展。三态输出支持总线共享与多模块驱动场景。

四、典型应用场景

  • LED 点阵/显示驱动(配合限流电阻或驱动晶体管)
  • IO 扩展(单片 MCU 控制多路并行设备)
  • 数字指示与状态灯控制
  • 串并转换、移位寄存器级联场景
  • 需要节省 MCU 引脚或实现远端并行控制的系统

五、使用建议与注意事项

  • 供电与去耦:建议 VCC 旁近端放置 0.1μF 陶瓷去耦电容,减少供电瞬变。
  • 输入不得悬空:未使用的输入应拉高或拉低,避免噪声误触发。
  • 输出驱动:HC 系列为 CMOS 输出,直接驱动大电流负载(如大量 LED)会超出规格,建议使用外部驱动器或限流元件,并参考厂商最大输出电流与功耗规范。
  • 时序要求:在高速或大负载条件下,关注时钟与锁存的建立/保持时间与抖动,必要时在设计中预留冗余。
  • 级联连接:串出 Q7' 直接接下级 SER,统一移位时钟,按需单独控制锁存以实现滚动更新或同步输出。

六、封装与采购建议

XL74HC595 提供 SOP-16 标准封装,适合中小批量手工焊接与表面贴装生产。选型时请确认供应商信路达提供的完整资料与器件批次,下载并参考官方数据手册以获取详细绝对最大额定值、电流限制、典型时序图和 PCB 封装尺寸。若用于工业或高可靠性场景,建议索取器件级可靠性与测试报告。

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