Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XINLUDA XD74LS192
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XINLUDA XD74LS192
- Type
- XINLUDA
- Minimum package
- 1000 管装
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XINLUDA
- Electronic Component
- XD74LS192
- Electronic Component
- 1
- Package
- DIP-16
- Electronic Component
- Counter / Divider
- Electronic Component
- 1.68g
- Electronic Component
- Electronic Component
- Electronic Component
- 1
- Features
- Programmable Division; positions;;; Synchronous
- Electronic Component
- BM0228561306
- Operating Temperature
- 0℃~+70℃
- Operating Voltage
- 4.75V~5.25V
- Electronic Component
- 25MHz
- Electronic Component
- Synchronous
- (tpd)
- 38ns
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XD74LS192 产品概述
一、产品简介
XD74LS192 是信路达（XINLUDA）出品的一款同步可串/并联计数器，支持向上计数和向下计数两种方向，适用于高速数字计数与时序控制场合。器件采用 DIP-16 封装，兼容常见的 TTL 低功耗逻辑家族，便于在传统与现代混合电路中替换和集成。
二、主要参数
- 计数方向：向上计数器；向下计数器（可双向计数）
- 工作电压：4.75V ~ 5.25V
- 触发沿：上升沿触发
- 计时方式：同步计数（所有触发信号在同一时钟沿同时生效）
- 最大计数速率：25 MHz
- 工作温度：0℃ ~ +70℃
- 传播延迟 (tpd)：38 ns
- 封装形式：DIP-16
- 品牌：XINLUDA（信路达）
三、功能与特点
XD74LS192 以同步设计为核心，保证在高频时钟下的计数稳定性和确定性。上升沿触发减少了时钟边沿方向的不确定性，传播延迟典型值为 38 ns，满足多数中高速计数应用。器件通常具备并行预置（LOAD）、清零（CLEAR）及进位/借位接口，方便与其它逻辑单元级联或做进位/借位处理（具体引脚功能请参照产品数据手册）。
四、典型应用
- 频率计数与脉冲计数器
- 数字时序与定时电路
- 分频器与状态计数控制单元
- 数字仪表、测量设备中的计数模块
- 教学与实验电路、原型开发板
五、使用建议与注意事项
- 电源：推荐使用稳压 5V 电源，且在芯片电源引脚附近放置 0.1 μF 陶瓷旁路电容以抑制瞬态噪声。
- 输入端：避免浮空输入，未使用的控制端建议拉到定义的电平（上拉或下拉）以防止不确定触发。
- 时钟与速率：实际工作频率请留有裕量，不建议长期满速运行；高频时应注意信号完整性与布线阻抗。
- 热与环境：工作温度限定在 0℃~+70℃，超出范围需选用工业级器件或采取温控措施。
- 级联与负载：注意输出驱动能力与扇出限制，不当并联可能影响传播延迟与计数可靠性。
- 数据手册：为保证正确接线与时序配合，建议在设计前详细阅读信路达官方数据手册与典型应用电路。
六、封装与订购建议
XD74LS192 提供标准 DIP-16 封装，便于手工焊接与面包板测试。若用于批量生产或 SMT 需求，建议向供应商咨询是否有 SOP/PLCC 等封装或兼容型号。订购时确认器件的版本、温度等级与测试报告，以确保与系统需求匹配。
如需更详细的引脚功能、时序图和典型接线示意，请提供是否需要完整数据手册或具体应用场景，我可为您进一步整理并给出电路范例与布局建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
