WMSIC Electronic Components

XINLUDA XL7219

ModelXL7219
PackageSOP-24-300mil
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XL7219
Type
XINLUDA
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XL7219
Electronic Component
1
Package
SOP-24-300mil
Electronic Component
LED Segment Display Driver
Electronic Component
8 x8 positions
Electronic Component
1.01g
Electronic Component
1
Electronic Component
BM0257590130
Operating Temperature
40℃~+85℃
Operating Voltage
4V~5.5V
Driver Current
320mA
Driver Current
30mA
Clock Frequency(fc)
10MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL7219 产品概述

一、产品简介

XL7219(信路达 XINLUDA)是一款面向小型点阵和多位数码管驱动的高集成度驱动器,采用 SOP-24-300mil 封装,适用于 8 段 × 8 位的显示矩阵。器件工作电压范围为 4.0V ~ 5.5V,最高时钟频率可达 10MHz,工作温度范围 -40℃ ~ +85℃,适应工业级温度环境。XL7219 提供较大的位驱动能力与段驱动能力,便于在高亮度显示或多个 LED 并联场景下可靠驱动。

二、主要参数

  • 型号:XL7219(信路达)
  • 显示配置:8 段 × 8 位(适用于 8×8 LED 点阵或 8 位数码管)
  • 工作电压(VCC):4.0V ~ 5.5V
  • 时钟频率(fc):10 MHz(典型系统时钟/串行接口速率上限)
  • 位驱动电流(Digit driver):320 mA(每位峰值/吸收能力)
  • 段驱动电流(Segment driver):30 mA(每段输出最大电流)
  • 工作温度范围:-40℃ ~ +85℃
  • 封装:SOP-24-300mil
  • 描述分类:未分类(通用显示驱动器应用)

三、电气与功率管理注意事项

  1. 电源与供电能力:XL7219 的工作电压为 4.0V~5.5V,设计电源时应保证在所有工作工况下供电稳定,推荐在 VCC 端并联去耦电容(例如 0.1 μF 陶瓷 + 10 μF 电解/陶瓷组合),以抑制瞬态电流与噪声。
  2. 峰值与平均电流预算:位驱动 320 mA 为位输出峰值能力,而段驱动 30 mA 为单段最大电流。对 8×8 动态扫描显示而言,通常采用逐位(或逐列)扫描,单位时间内只有一位导通,因而实际平均电流低于峰值。举例:单位段设定为 30 mA、8 段同时点亮时单位位的瞬时电流为 8 × 30 mA = 240 mA,低于 320 mA 限值;但系统电源需能承受峰值瞬间总和(尤其多个位快速切换时)。因此在电源容量与走线设计上要留有裕量。
  3. 散热与热设计:在高电流与高占空比工作下,器件会产生热量。建议在 PCB 布局时提供良好接地层和散热路径,避免通过过细的走线传导全部返流电流,必要时在器件附近设热铜箔或多通孔(vias)以改善散热。
  4. 布线与时钟信号:若使用高频(接近 10 MHz)时钟/串行接口,建议保持时钟线短且阻抗连续,避免长线导致信号完整性问题。对高速控制信号,应采用合理的上拉/下拉和阻尼(series resistor)以抑制反射和振铃。
  5. 保护与滤波:针对可能的电流浪涌和电磁干扰,建议在电源入口加入滤波与浪涌抑制器件(例如 TVS 或共模电感),并对驱动线增加适当 RC 滤波以保护段/位输出。

四、机械与可靠性建议

  1. 封装与 PCB 安装:SOP-24-300mil 封装在走线密度与焊盘布局上有明确要求,参考厂商封装图及 PCB 推荐焊盘尺寸进行设计,保证焊点完整与可焊性。
  2. 热循环与环境适应:器件工作温度范围覆盖 -40℃~+85℃,适合工业级环境,但长期高温(接近上限)会加速老化,建议在高温工况下限制占空比或降低段电流以延长寿命。
  3. 可靠性测试建议:在批量应用前进行温度循环、功耗老化与电磁兼容测试,确保在最终产品环境中的稳定性。

五、典型应用场景

  • 8×8 LED 点阵显示(图形、符号、滚动文本)
  • 多位数码管显控(8 位或多位串联驱动)
  • 信息面板、仪表显示、家电与工业控制面板的状态/报警指示
  • 需要在 5V 供电环境下实现高亮度显示的嵌入式系统

六、设计与调试要点

  • 在样机阶段根据实际 LED 正向电压和亮度需求校核段电流与位电流,合理选择电阻或限流方式,避免超出段/位最大额定值。
  • 测试时观察不同占空比与扫描频率下的亮度均匀性与视觉闪烁情况,必要时调整刷新频率或驱动策略。
  • 对高电流路径(如公共位回流)进行宽铜设计,并测量 PCB 热点温升以验证散热方案。
  • 如果为多模块级联使用,应验证总线时序与总电源容量,避免级联引起的电流冲击和信号畸变。

总结:XL7219 以其 8×8 配置、较宽的工作电压范围与较高的位段驱动能力,适合在 5V 智能显示场景中作为可靠的显示驱动核心。合理的电源设计、热管理与 PCB 布局是获得稳定高亮显示效果的关键。

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