WMSIC Electronic Components

XLSEMI XL6108

ModelXL6108
PackageSOP-8-EP
BrandXLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XLSEMI XL6108
Type
XLSEMI
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XLSEMI
Electronic Component
XL6108
Electronic Component
1
Package
SOP-8-EP
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.128g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0264553920
Operating Temperature
40℃~+125℃
Operating Voltage
2.5V~25V
Switching Frequency
1.2MHz
Electronic Component
SEPIC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL6108 产品概述

XL6108 是芯龙(XLSEMI)推出的一款高效率升压型 DC-DC 转换器,集成高频功率开关管与肖特基二极管,支持输入电压 2.5V~25V,输出可调 3V~27V,输出电流最高可达 1A。器件内部集成频率补偿及保护电路,开关频率为 1.2MHz,适合使用小型、低成本的外部无源器件,从而减小系统体积与成本。封装为 SOP-8-EP,工作温度范围 -40℃~+125℃。

一、主要参数与功能特性

  • 输入电压范围:2.5V ~ 25V
  • 输出电压范围:3V ~ 27V(可调)
  • 最大输出电流:1A
  • 开关频率:1.2MHz(内部固定)
  • 静态电流(Iq):约 2.3mA
  • 拓扑支持:SEPIC / 升压(Boost)
  • 同步整流:否(内部集成肖特基二极管)
  • 保护功能:过流保护(内置)
  • 封装:SOP-8-EP(带散热焊盘)
  • 工作温度:-40℃ ~ +125℃

二、产品优势

  • 高频工作(1.2MHz):允许使用更小体积的电感和电容,节省 PCB 面积并降低被动件成本。
  • 集成开关与肖特基二极管:简化外围电路,减少器件数量与设计复杂度。
  • 宽输入范围与可调输出:适配各种电池与系统供电场景,输出灵活可配置。
  • 低静态电流:适合便携与中低功耗应用,待机损耗较小。
  • 内置保护与频率补偿:提升系统可靠性,缩短调试时间。

三、典型应用场景

  • 便携式设备电源(充电宝、便携仪器)
  • 汽车电子的升压电源(车载点烟器到外设供电、点亮 12V/24V 区域)
  • 工业控制与仪表中的局部升压供电
  • 液晶/显示驱动电源、传感器前端供电

四、设计与布局建议

  • 外围元件选择:根据输出电流与电压选择合适电感(常见范围 2.2µH ~ 10µH,视功率与纹波要求而定)与输入/输出电容(建议低 ESR 陶瓷电容,输入 4.7µF~22µF,输出 10µF~100µF)。
  • SEPIC 应用注意:若采用 SEPIC 拓扑,需要增加耦合电容与第二电感(或分离电感),并关注极性与电流路径。
  • 布局要点:开关节点(SW/LX)、电感与外部电容之间走线尽量短且宽,减小回路面积;输入旁路电容靠近芯片 VIN 与 GND 引脚布置;将 SOP-8-EP 的散热焊盘牢靠焊接到大面积地铜,提升热耗散能力。
  • 热管理:在高负载或高环境温度条件下注意热沉与散热路径设计,确保芯片工作在安全结温范围内。
  • 保护配置:虽然器件内置过流保护,但仍建议在系统层加入短路与温度保护策略以提高可靠性。

五、典型电路说明

  • 基本升压(Boost):VIN -> 输入电容 -> 芯片 VIN;芯片开关端与电感串联;输出端通过内部肖特基二极管整流至输出电容与负载;VFB 与分压电阻设定输出电压。
  • SEPIC:在标准 SEPIC 结构中需配置耦合电容(隔直电容)与第二电感,注意隔直电容电压评级与极性要求。具体外围元件数值推荐可依据输出功率、输入/输出电压差与允许纹波进行计算与仿真。

XL6108 适用于对体积、成本与效率有综合要求的升压方案,凭借内部高频开关与集成肖特基器件,能在多种便携与嵌入式场景中提供稳定的升压能力。

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