Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XC6SLX25-2FTG256C是赛灵思(XILINX)Spartan-6系列中的中等容量可编程逻辑器件(FPGA),专为成本敏感、低功耗、中等复杂度的电子系统设计,兼顾性能与成本控制,是工业控制、消费电子等领域的主流选型之一。该系列区别于高端Virtex系列,主打性价比与低功耗,适合无需极致性能但需灵活逻辑定制的场景。
集成1879个LAB(逻辑阵列块),每个LAB包含多路逻辑单元(LC),总逻辑单元数达24051,可支撑中等复杂度的数字逻辑设计(如状态机、算术运算、接口控制等),满足8~16位处理器核、多通道信号处理等功能需求。
总RAM位数为958464位,支持分布式RAM(嵌入逻辑单元,灵活小容量)和块RAM(Block RAM)(独立大容量,高速访问)两种结构,可配置为数据缓存、FIFO、配置存储等,无需额外外挂存储芯片,简化系统设计。
配备186个通用I/O引脚,支持多电压域(1.2V~3.3V),兼容LVCMOS、LVTTL、SSTL等电平标准,可直接连接传感器、执行器、通信模块(SPI、I2C、UART等),适配多种外设接口。
核心电压范围为1.14V~1.26V,属于低功耗设计,可有效降低系统功耗与散热要求;I/O电压支持多种标准,适配不同外设的电平需求,无需额外电平转换电路。
采用256-FTBGA(17mm×17mm) 表面贴装封装,引脚间距合理,既保证高密度集成,又便于PCB布线;封装尺寸紧凑,适合小型化电子设备(如智能家居网关、便携式测试仪器)的空间限制。
工作结温(TJ)为0°C~85°C,覆盖商业级到准工业级应用场景,可稳定运行于室内设备、一般工业现场(非极端高温环境),满足大部分常规应用的温度可靠性要求。
XC6SLX25-2FTG256C凭借灵活的逻辑定制、低功耗与高集成度,成为中等复杂度电子系统的优选FPGA方案。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products