WMSIC Electronic Components

XILINX XC7Z020-2CLG484I XC7Z020

ModelXC7Z020-2CLG484I
PackageCSPBGA-484
BrandXILINX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 199282

Availability on request

Technical data

Product details

20 specifications

Core information

Product name
XILINX XC7Z020-2CLG484I
Type
XILINX
Unit
Electronic Component
Minimum package
420 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
XILINX
Electronic Component
XC7Z020-2CLG484I
Electronic Component
1
Electronic Component
DMA
Package
CSPBGA-484
Electronic Component
MCU,FPGA
Electronic Component
Programmable Logic Device (CPLD / FPGA)
Electronic Component
766MHz
Electronic Component
0.4g
Electronic Component
1
RAM
256KB
Electronic Component
Artix™-7 FPGA, 85K Logic
Electronic Component
BM0227374815
Operating Temperature
40°C ~ 100°C(TJ)

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC7Z020-2CLG484I 产品概述

一、产品简介

XC7Z020-2CLG484I 是赛灵思(XILINX)面向嵌入式与可编程加速应用的片上系统(SoC)器件,集成双核 ARM® Cortex®-A9 MPCore™ 处理子系统与基于 Artix™‑7 的 FPGA 逻辑单元(约 85K 逻辑单元)。器件为 CSPBGA‑484(19×19)封装,速度等级为 -2,适用于工业级与车规近等高可靠性场景,工作结温范围 -40°C 至 100°C(TJ)。

二、主要规格亮点

  • 处理器:双 ARM® Cortex‑A9 MPCore™,集成 CoreSight™ 调试跟踪
  • FPGA 逻辑:Artix™‑7 架构,约 85K 逻辑单元
  • 主频/速度:最高 766 MHz(主频指标,用于参考系统性能评估)
  • 内部 RAM:256 KB(用于片上高速缓冲/控制)
  • 外设与总线:DMA 控制器、CANbus、EBI/EMI、以太网、I²C、MMC/SD/SDIO、SPI、UART/USART、USB OTG
  • 封装:CSPBGA‑484(19×19)
  • 工作温度:-40°C ~ 100°C(TJ)

三、处理能力与调试

双核 Cortex‑A9 提供对称多处理能力,适合运行实时操作系统或 Linux + 实时任务的混合架构。CoreSight™ 支持片上调试与性能分析,便于软件调试、断点/跟踪和性能优化。结合 DMA,可实现高速数据搬运、减轻处理器负担,提升系统吞吐。

四、FPGA 可编程资源与协同

基于 Artix‑7 的 FPGA 逻辑为定制加速、专用接口与硬件信号处理提供了灵活实现路径。常见应用包括协议转接、图像/信号预处理、加密引擎与低延迟数据通道。FPGA 与 ARM 子系统可通过高速片上互联实现低延迟协同。

五、接口与系统集成建议

丰富的外设支持工业与通信需求:以太网与 USB OTG 满足网络与主机/设备连接,CANbus 适用于车用/工业控制,SD/SDIO 提供启动与数据扩展方案。集成 EBI/EMI 有利于与外部并行存储器或外设的接口。建议在设计时关注电源序列、差分对布线、时钟源完整性与 I/O 速率匹配。

六、典型应用场景

  • 工业控制与运动控制系统(CANbus、实时控制)
  • 网络通信与边缘计算(以太网、协议加速)
  • 视频/图像前端处理与高性能数据流处理
  • 汽车电子与仪表域控制(耐温、可靠通信)
  • 安全监控与加速加密/解密任务

七、设计注意事项与工具链

建议使用 Xilinx Vivado 与 SDK 进行设计和调试,利用 CoreSight 完成软件调试;在硬件设计上注意电源去耦、封装热管理与 PCB 高速信号布局。采用 DMA 与硬件加速模块可显著降低软件开销,优化整体功耗与延迟。

XC7Z020‑2CLG484I 将通用处理与可编程逻辑有效结合,适合对性能、接口多样性与可定制硬件加速有较高要求的嵌入式系统设计。

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