WMSIC Electronic Components

XILINX XC7Z030-2FFG676I XC7Z030

ModelXC7Z030-2FFG676I
PackageFCBGA-676
BrandXILINX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 199284

Availability on request

Technical data

Product details

19 specifications

Core information

Product name
XILINX XC7Z030-2FFG676I
Type
XILINX
Minimum package
40 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XILINX
Electronic Component
XC7Z030-2FFG676I
Electronic Component
1
Electronic Component
DMA
Package
FCBGA-676
Electronic Component
MCU,FPGA
Electronic Component
Programmable Logic Device (CPLD / FPGA)
Electronic Component
800MHz
Electronic Component
6.15g
Electronic Component
1
RAM
256KB
Electronic Component
Kintex™-7 FPGA, 125K Logic
Electronic Component
BM0263488155
Operating Temperature
40°C ~ 100°C(TJ)
Electronic Component
CANbus, EBI / EMI, Ethernet, I²C, MMC / SD / SDIO, SPI, UART / USART, USB OTG

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XC7Z030-2FFG676I 产品概述

一、核心架构与产品定位

XC7Z030-2FFG676I是赛灵思(Xilinx)Zynq-7000系列的异构嵌入式SoC(片上系统),采用「双ARM Cortex-A9 MPCore处理器 + Kintex-7 FPGA」混合架构——既保留通用处理器的软件灵活性,又具备FPGA的硬件并行加速能力,专为工业级高性能嵌入式场景设计。

二、处理器子系统特性

该器件的核心控制单元为双ARM Cortex-A9 MPCore,主频可达800MHz,是工业级SoC中性能与功耗平衡的典型方案:

  • 集成CoreSight™调试模块,支持实时代码调试、性能追踪,降低软件开发与系统优化难度;
  • 片上内置256KB高速RAM(含L1/L2缓存及片上数据存储),满足实时数据处理的低延迟需求;
  • 支持SMP(对称多处理)与AMP(非对称多处理)模式,可灵活分配任务(如ARM负责逻辑调度、FPGA负责硬件加速)。

三、FPGA逻辑子系统

搭配的Kintex-7 FPGA提供125K逻辑单元(CLB),具备赛灵思28nm工艺FPGA的核心优势:

  • 高性能并行运算:可定制化实现实时图像处理、通信协议转换等硬件加速任务,弥补纯处理器的并行处理短板;
  • 低功耗设计:平衡性能与功耗,适合长时间稳定运行的工业环境;
  • 处理器-FPGA高速互联:无需外部桥接芯片,实现数据与控制指令的高效传输,简化系统设计。

四、丰富外设与接口

XC7Z030-2FFG676I配备多样化接口,覆盖工业通信、存储、外设扩展等需求:

  • 通信类:CANbus(工业现场总线)、以太网(高速网络)、UART/USART(串行通信)、SPI/I²C(低速外设控制);
  • 存储类:MMC/SD/SDIO接口(外接高速存储)、EBI/EMI接口(扩展外部DDR等存储器);
  • 通用类:USB OTG(双模式:主机/设备)、内置DMA控制器(减轻处理器负载,实现外设-内存高速传输)。

五、封装与工作温度

  • 封装:FCBGA-676封装,尺寸27×27mm,引脚密度适合高密度PCB设计,兼顾散热与可靠性;
  • 工作温度:结温(TJ)范围-40°C ~ 100°C,符合工业级环境要求,可稳定运行于极端温度场景(如户外工业设备、车载电子)。

六、典型应用场景

基于异构架构与工业级特性,该器件广泛应用于:

  1. 工业控制:PLC、机器人控制器(FPGA实现实时运动控制,ARM负责逻辑调度);
  2. 嵌入式视觉:机器视觉系统(FPGA预处理图像,ARM做算法决策);
  3. 通信设备:工业以太网交换机、无线网关(FPGA转协议+高速转发,ARM管网络);
  4. 医疗设备:监护仪、超声设备(FPGA采集数据,ARM控界面与算法)。

XC7Z030-2FFG676I通过异构架构整合通用计算与定制加速能力,为工业级嵌入式系统提供了高效、灵活的硬件基础。

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