WMSIC Electronic Components

XTX XT25F64FSOIGT

ModelXT25F64FSOIGT
PackageSOP8 150mil
BrandXTX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XTX XT25F64FSOIGT
Type
XTX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XTX
Electronic Component
XT25F64FSOIGT
Electronic Component
1
Package
SOP8 150mil
Electronic Component
NOR FLASH
Electronic Component
0.14g
Electronic Component
1
Electronic Component
BM0257346223
Electronic Component
64Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
0.3uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
133MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XT25F64FSOIGT 产品概述

一、产品简介

XT25F64FSOIGT 是 XTX(芯天下)推出的一款工业级 SPI 串行闪存产品,容量 64Mbit(即 8MByte),封装为 SOP8 150mil。器件支持高达 133MHz 的 SPI 时钟频率,工作电压范围 2.7V 至 3.6V,适用于对可靠性和数据保持要求较高的嵌入式与工业控制应用。该器件在设计上强调低功耗、长寿命与多层写保护机制,适合固件存储、参数保存与数据记录等场景。

二、主要规格

  • 接口类型:SPI 串行接口
  • 存储容量:64Mbit(8MByte)
  • 最大时钟频率(fc):133MHz
  • 工作电压:2.7V ~ 3.6V
  • 待机电流:0.3 μA(低功耗待机)
  • 擦写寿命:100,000 次(典型)
  • 页写入时间(Tpp):400 μs(典型)
  • 数据保留(TDR):20 年
  • 工作温度:-40℃ ~ +85℃(工业级)
  • 封装:SOP8 150mil
  • 品牌:XTX(芯天下)

三、可靠性与寿命

XT25F64FSOIGT 针对工业应用的长期稳定性进行了优化。器件支持典型 100,000 次的擦写循环,适合经常更新固件或日志的场景;数据在无电状态下的保存期典型达到 20 年,满足长期存储要求。宽温工作范围(-40℃ 至 +85℃)保证了在恶劣环境下的稳定运行。低待机电流(0.3 μA)有助于系统在电池供电或节能模式下延长工作时间。

四、关键功能说明

  • 硬件写保护(Hardware WP):通过专用引脚实现对整个器件或特定区域的物理写保护,防止误擦写或恶意改写。
  • 绝对写保护(Absolute Protect):提供更高优先级的保护机制,用于对关键区域施加永久或半永久保护,提高数据安全性。
  • 写使能锁存(Write Enable Latch):写操作需先设置写使能位,防止意外写入或擦除。
  • 软件写保护(Software Protect):通过指令级别对扇区或区域进行写保护管理,配合硬件保护提供灵活的保护策略。
    以上保护机制可单独或组合使用,以满足不同安全与可靠性需求。

五、应用场景与设计建议

  • 典型应用:工业控制器固件存储、PLC 配置与日志保存、通信设备固件、仪器仪表参数保存、工控 HMI 存储等。
  • PCB 设计提示:SOP8 150mil 封装常用封装布局,请参考厂商推荐的封装和焊盘尺寸;为保证信号完整性与稳定供电,建议在 VCC 引脚附近放置去耦电容(如 0.1 μF 与 1 μF 的组合)。
  • 电源与时序:工作电压范围为 2.7V~3.6V,设计时应保证电源稳定,避免在写/擦操作期间出现电压掉落。高频 SPI(最高 133MHz)对 PCB 布线要求较高,尽量缩短 CS、SCLK、MOSI、MISO 的线长并注意阻抗匹配。
  • 保护策略:在关键数据区启用硬件与软件写保护组合,可在出厂或现场通过绝对写保护防止非法修改。使用写使能锁存可作为二次防护,避免意外的写命令执行。
  • 功耗管理:待机电流仅 0.3 μA,适合低功耗应用;在系统进入休眠或待机时,可通过 SPI 指令或引脚控制将器件置于低功耗模式以延长电池寿命。

总结:XT25F64FSOIGT 以其工业级温度范围、较高的接口频率、低待机功耗以及完善的写保护机制,适合对可靠性、数据安全与长期存储有较高要求的各类嵌入式与工业应用。在实际设计中,注意电源完整性、PCB 布线和合理使用多层写保护功能,可充分发挥该器件的性能与可靠性优势。

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