WMSIC Electronic Components

XTX XT25Q16DDTIGT

ModelXT25Q16DDTIGT
PackageUDFN-8-EP(2x3)
BrandXTX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XTX XT25Q16DDTIGT
Type
XTX
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XTX
Electronic Component
XT25Q16DDTIGT
Electronic Component
1
Package
UDFN-8-EP(2x3)
Electronic Component
NOR FLASH
Electronic Component
0.053g
Electronic Component
1
Electronic Component
BM0264982911
Electronic Component
16Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.65V~2.1V
Current
0.3uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
108MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XT25Q16DDTIGT 产品概述

XT25Q16DDTIGT 是 XTX(芯天下)推出的一款 16Mbit 串行闪存器件,专为低功耗、嵌入式存储与高速代码/数据读取应用设计。器件支持标准 SPI、双/四路 SPI 模式,提供灵活的接口与高带宽数据传输能力,同时具备多级写保护与工业级工作温度范围,适合物联网、消费电子、工业控制和便携设备的固件存储与数据记录需求。

一、主要规格概览

  • 存储容量:16Mbit(2MB)
  • 接口类型:标准 SPI,支持 Dual I/O 与 Quad I/O
  • 最大单路时钟频率(fc):108 MHz(单路 SPI)
  • 传输速率:
    • 单路 SPI:最高 108 Mbit/s
    • 双路 I/O:最高 216 Mbit/s
    • 四路 I/O / 四路输出:最高 432 Mbit/s
  • 工作电压:1.65 V ~ 2.1 V(低压单电源)
  • 待机电流:典型 0.3 µA(超低功耗待机)
  • 擦写寿命:100,000 次(典型)
  • 数据保留(TDR):20 年
  • 页写入时间(Tpp):350 µs(典型)
  • 块擦除时间(tBE):150 ms @ 64 KB(典型)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:UDFN-8-EP (2 × 3 mm)
  • 品牌:XTX(芯天下)

二、引脚与接口说明

XT25Q16DDTIGT 提供标准 SPI 引脚并扩展为双/四路 I/O:

  • SCLK:串行时钟输入
  • CS#:片选(低有效)
  • IO0(SI)/ IO1(SO):标准 MOSI/MISO,双路 I/O 参与数据传输
  • IO2(WP#):写保护输入(硬件写保护)
  • IO3(HOLD#/RESET#):保持/复位功能(四路 I/O 下为数据线) 器件在不同模式下引脚功能可复用,设计时需根据工作模式配置 WP# 与 HOLD# 的上拉/下拉电阻以保证可靠性。

三、功能特性与可靠性

  • 多级写保护:
    • 硬件写保护(WP# 引脚)
    • 绝对写保护(针对全部或部分区域的不可逆保护)
    • 写使能锁存(WEL bit,防止误写)
    • 软件写保护(通过指令配置保护区域)
  • 支持标准 SPI 命令集,兼容常见 SPI 主控 MCU 与 FPGA。
  • 支持高速 Dual/Quad I/O,显著提升连续读取与代码执行速度(XIP)场景性能。
  • 工业级耐久性与长期数据保持:100k 擦写循环与 20 年数据保留,满足固件长期可靠性要求。

四、典型应用场景

  • MCU/SoC 固件存储(Boot ROM、引导加载)
  • 外部代码执行(XIP)与高速读取缓存
  • 无线模块与物联网终端的固件与配置存储
  • 工业设备与数据记录器的非易失性存储
  • 消费类便携设备中的系统固件与资源文件存储

五、设计与布局建议

  • 电源去耦:靠近 VCC 引脚放置 0.1 µF 旁路电容,保证瞬态响应与信号完整性。
  • WP# / HOLD#:建议对 WP# 与 HOLD# 使用上拉或下拉电阻(取决于默认保护策略),防止悬空导致误动作。若不使用 HOLD#/RESET# 功能,应根据应用将其拉高或拉低到安全电平。
  • PCB 布局:UDFN-8-EP 带有底部焊盘(exposed pad),需要良好焊盘与热沉设计以利于焊接可靠性与散热。使用短且阻抗匹配的 SPI 时钟线,避免跳线与长走线。
  • ESD 与可靠性:在高静电环境下,建议在电源入口与信号线加 TVS 或缓冲电路以保护器件。

六、选型参考与注意事项

  • 确认主控对 Dual/Quad 模式的支持以发挥更高数据带宽。
  • 工作电压 1.65~2.1V 适配低功耗系统;与系统电压匹配时注意 IO 电平兼容性。
  • 评估写入与擦除频率以判断擦写寿命是否满足长期使用需求;对频繁写入场景建议采用 wear leveling 或增加冗余存储策略。
  • 若需要更高温度范围或不同封装形式,请与供应商咨询相应型号。

XT25Q16DDTIGT 以低电压、低功耗、高速传输与多级写保护为优势,适合对尺寸、功耗与可靠性有严格要求的嵌入式存储应用。若需详细命令集、电气参数曲线或参考电路图,建议查阅器件数据手册或联系 XTX(芯天下)技术支持获取完整设计文档。

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