WMSIC Electronic Components

XTX XT25F32FSOIGU

ModelXT25F32FSOIGU
PackageSOP8 150mil
BrandXTX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XTX XT25F32FSOIGU
Type
XTX
Minimum package
100 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XTX
Electronic Component
XT25F32FSOIGU
Electronic Component
1
Package
SOP8 150mil
Electronic Component
NOR FLASH
Electronic Component
0.2g
Electronic Component
1
Electronic Component
BM0264982910
Electronic Component
32Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
0.3uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
133MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XT25F32FSOIGU 产品概述

一、产品简介

XT25F32FSOIGU(芯天下 XTX)是一款容量为 32Mbit 的高速串行闪存,采用标准 SPI 接口并向下兼容双/四线 SPI 模式。器件工作电压范围为 2.7V ~ 3.6V,最高串行时钟频率 fc 可达 133MHz,适合需要高速代码或数据存取的嵌入式系统与消费电子产品。

二、主要规格参数

  • 存储容量:32 Mbit
  • 接口类型:标准 SPI,支持 Dual/Quad SPI(SI = I/O0、SO = I/O1、I/O2 = WP#、I/O3 = HOLD#)
  • 最大时钟:133 MHz
  • 工作电压:2.7V ~ 3.6V
  • 待机电流:0.3 μA(典型)
  • 页写入时间 (Tpp):400 μs(典型)
  • 擦写寿命:100,000 次(典型)
  • 数据保留 (TDR):20 年
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:SOP8 150mil

三、功能特性

  • 硬件写保护与绝对写保护,支持对全部或部分存储区进行物理级防写入;
  • 写使能锁存(Write Enable Latch)机制,防止误写操作;
  • 软件写保护功能,通过寄存器配置实现灵活保护策略;
  • 支持标准 SPI 与 Dual/Quad 传输模式,以提高读写吞吐量。

四、接口与引脚

器件通过 SPI 常用信号进行通信:片选(CS)、串行时钟(SCLK)、串行输入(SI/I/O0)、串行输出(SO/I/O1)、WP#(I/O2,写保护控制)与 HOLD#(I/O3,暂停/保持)。在不使用 WP# 与 HOLD# 时,建议用上拉电阻拉至 VCC 以保证线上稳定。

五、性能与可靠性

XT25F32FSOIGU 在高达 133MHz 的 SPI 时钟下实现快速读取,页写入典型时间为 400 μs,支持 ≥100k 次擦写循环,数据保留可靠性达 20 年,适合要求长期可靠存储的固件与配置数据保存场景。超低待机电流(0.3 μA)有利于电池供电设备的低功耗设计。

六、典型应用

  • MCU 外部代码/数据闪存(固件存储、引导代码)
  • 物联网设备与智能终端配置存储
  • 网络/通信设备的配置与日志保存
  • 消费类电子产品(智能家居、便携设备)

七、设计注意事项

  • 电源旁路:在 VCC 近旁放置 0.1 μF 与 1 μF 去耦电容,降低电源噪声;
  • WP#/HOLD#:若不使用,建议通过 10kΩ 上拉至 VCC;若需要硬件写保护,应设计独立控制信号并遵循器件写保护流程;
  • 信号完整性:133MHz 时钟下建议在 MOSI/MISO 等高速线路上使用小阻值串联(如 22Ω)抑制反射与振铃;
  • 写入管理:写操作需先发写使能并在写入后轮询状态寄存器或等待 Tpp 以确保操作完成,避免并发冲突;
  • 温度与寿命评估:在高温或高擦写频率场景下进行加速寿命验证,确保满足系统级可靠性要求。

八、封装与选型建议

XT25F32FSOIGU 提供 SOP8 150mil 封装,适用常规 PCB 组装流程。选型时关注工作电压、温度范围以及对硬件写保护的需求;在对吞吐量或多线传输有更高要求的方案中,可优先开启 Dual/Quad 模式以提升读写性能。

如需更详细的电气参数、时序图或指令集(命令/寄存器定义),建议参考芯天下(XTX)XT25F32FSOIGU 的完整数据手册以取得精确设计信息。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.