WMSIC Electronic Components

XTX XT25F04DSOIGU

ModelXT25F04DSOIGU
PackageSOP8 150mil
BrandXTX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XTX XT25F04DSOIGU
Type
XTX
Minimum package
100 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XTX
Electronic Component
XT25F04DSOIGU
Electronic Component
1
Package
SOP8 150mil
Electronic Component
NOR FLASH
Electronic Component
0.442g
Electronic Component
1
Electronic Component
BM0264826334
Operating Voltage
2.7V~3.6V
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
120MHz
Electronic Component
Electronic Component
Electronic Component
100
(t BE)
450ms@(64KB)

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XT25F04DSOIGU 产品概述

一、产品简介

XT25F04DSOIGU 是芯天下(XTX)推出的一款 4M-bit 串行闪存器件,采用标准 SPI 接口并支持双 SPI(Dual I/O)模式,适用于需要高性能、低功耗与高可靠性的嵌入式存储场景。器件封装为 SOP8 150mil,工作电压范围宽(2.7V ~ 3.6V),可直接替代常见的 SPI NOR Flash 方案,便于在消费电子、工业控制与通信设备中集成。

二、主要规格参数

  • 接口类型:标准 SPI,支持 Dual I/O(I/O0 = SI、I/O1 = SO)
  • 最大时钟频率(fc):120 MHz
  • 双 I/O 数据速率:208 Mbits/s(Dual I/O 模式下)
  • 容量:4 Mbit(512 KB)
  • 工作电压:2.7 V ~ 3.6 V
  • 擦写寿命:100,000 次(典型)
  • 页写入时间(Tpp):900 μs(典型)
  • 块擦除时间(tBE):450 ms @ 64 KB(典型)
  • 数据保持(TDR):20 年
  • 封装:SOP8 150mil
  • 品牌:XTX(芯天下)

三、主要特性与优势

  • 高速数据传输:支持 120 MHz SPI 时钟,Dual I/O 模式下可达 208 Mbits/s,显著提高读写吞吐,缩短固件更新与数据加载时间。
  • 宽电压与低功耗:2.7–3.6 V 供电兼容常见 MCU/SoC 电源,待机与操作功耗优化适合电池供电与低功耗设计。
  • 高可靠性:100k 次擦写寿命与 20 年数据保持满足工业与长期使用的耐久性需求。
  • 易于替换与布线:SOP8 封装(150 mil)兼容多数通用焊盘,便于在现有 PCB 设计中替代或升级。

四、典型应用场景

  • 产品固件存储(Boot ROM / Firmware)与系统启动代码
  • 配置参数与日志数据保存(需频繁读/少量写的场景)
  • 消费电子设备的资源存储(如音视频设备、智能家居)
  • 工业控制与通信设备中要求长期数据保持与高擦写寿命的场合

五、设计导则与注意事项

  • 电源旁路:在 VCC 近端放置 0.1 μF 陶瓷电容,降低电源噪声,保证高速 SPI 时序稳定。
  • 时钟与信号完整性:当使用接近 120 MHz 的 SCLK 或 Dual I/O 208 Mbps 传输时,注意走线阻抗控制、终端匹配与最短回路,避免反射与串扰。
  • 片选/命令序列:确保在片选(CS)为低时完成整个命令与地址/数据传输,遵循器件时序规范以避免误操作。
  • 擦写与寿命管理:合理规划擦写策略(Wear Leveling、日志压缩等),避免在单一地址频繁擦写以延长器件寿命。
  • 温度与可靠性评估:在目标环境温度下验证写入/擦除时间与数据保持能力,特别是工业温区对擦写次数与保留时间的影响。

六、结论

XT25F04DSOIGU 以其高速的 Dual I/O 传输、宽电压兼容性和高耐久性,适合用于要求快速启动、高可靠存储和长期数据保持的产品。合理的 PCB 设计、供电旁路和擦写管理可以充分发挥该器件的性能优势,为系统提供稳定可靠的非易失性存储解决方案。若需更详细的时序、命令列表或参考电路,请查阅器件数据手册或联系芯天下技术支持。

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