WMSIC Electronic Components

XTX XT26G08DWSIGA

ModelXT26G08DWSIGA
PackageWSON8 8x6mm
BrandXTX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XTX XT26G08DWSIGA
Type
XTX
Minimum package
480 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XTX
Electronic Component
XT26G08DWSIGA
Electronic Component
1
Package
WSON8 8x6mm
Electronic Component
NAND FLASH
Electronic Component
4.364g
Electronic Component
1
Features
OTP and; ECC; positions
Electronic Component
BM0264826352
Electronic Component
8Gbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.7V~3.6V
Current
100uA
Interface Type
SPI
Electronic Component
6

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XT26G08DWSIGA 产品概述

一、概述

XT26G08DWSIGA(简称 XT26G08D)是芯天下(XTX)推出的一款高性能 SPI NAND 闪存器件,容量为 8Gbit(1024 MByte),采用标准 SPI 接口并支持双/四路 I/O 模式。器件工作电压范围宽(2.7V~3.6V),最大工作时钟可达 120MHz,适用于对容量、读写速度及可靠性有较高要求的嵌入式存储、固件存储与数据记录等应用场景。

二、主要规格参数

  • 存储容量:8Gbit(1024 MByte)
  • 接口类型:SPI(支持标准 SPI、Dual/Quad I/O)
  • 最大时钟频率(fc):120 MHz
  • 工作电压:2.7 V ~ 3.6 V
  • 页写入时间(Tpp):400 μs(典型)
  • 块擦除时间(tBE):3.5 ms(典型)
  • 数据保留(TDR):10 年
  • 擦写寿命:60,000 次(典型)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 待机电流:100 μA(典型)
  • 封装:WSON8 8×6 mm
  • 品牌:XTX(芯天下)

三、功能特性

  • 硬件写保护(H/W write-protect):提供可靠的硬件级写保护机制,防止误写或非法擦写。
  • 软件写保护与写使能锁存:支持软件级写保护配置与写使能锁存(WEL),便于细粒度控制写操作。
  • 读缓存功能:支持读缓存加速随机/顺序读取,提升主机访问效率。
  • OTP 区域写保护与锁定:提供一次性可编程(OTP)区域,支持写保护与永久锁定,适合存放序列号、校准数据或安全密钥。
  • ECC 纠错功能:内建 ECC 机制,提高数据可靠性,降低主机负担。
  • 软件复位功能:支持异常恢复,提升系统可靠性。
  • 复制回写(Copy-back):支持页面间内部数据复制以加速数据迁移与垃圾回收操作。

四、可靠性与性能

XT26G08D 在擦写寿命(6 万次)与数据保留(10 年)之间取得平衡,适用于工业级长期部署。页写入(400 μs)与块擦除(3.5 ms)的典型时序,可满足大多数嵌入式系统对写入延迟与擦除效率的要求。器件在 -40 ℃ 到 +85 ℃ 运行稳定,适合工业、车规级附近应用(需参考具体认证)。

五、应用场景

  • 嵌入式操作系统/固件存储(Boot ROM、固件升级)
  • 工业与楼宇控制器的事件日志与数据记录
  • 消费电子设备(机顶盒、智能路由、安防设备)
  • 物联网终端与传感器网关(高密度本地存储)
  • 汽车信息娱乐与辅助电子(需结合车规认证评估)

六、设计与使用建议

  • 电源与去耦:推荐在 VCC 处放置 0.1 μF 及 1 μF 旁路电容,靠近器件引脚,以降低瞬态电流影响。
  • IO 信号完整性:120 MHz 工作下,建议尽量缩短 SPI 总线走线,必要时在 IO 信号线上并联小阻值串联电阻(22-47 Ω)以抑制反射。
  • 写保护与复位引脚:对 WP/HOLD 等保护引脚采用上/下拉电阻以保证上电态确定,外部需预留复位与写保护控制策略。
  • ECC 与坏块管理:尽管器件内置 ECC,系统仍需实现坏块管理与磨损均衡策略以延长寿命与保障数据完整性。
  • OTP 使用:OTP 区域一旦锁定不可恢复,建议在生产或首次初始化时写入关键不可变信息。
  • 热管理:在高温环境下请考虑散热与布局,保证长期可靠性。

七、封装与采购信息

  • 封装型号:WSON8 8×6 mm,适合表面贴装生产工艺。
  • 品牌:XTX(芯天下)。
  • 订购前请确认具体的器件型号后缀与温度/标定版本,并索取完整数据手册以校验时序、引脚、命令集及可靠性测试数据。

总结:XT26G08DWSIGA 提供大容量、宽电压、高速 SPI 接口与完善的写保护、ECC 等功能,是嵌入式系统中可靠的非易失性存储选择。请在设计前阅读完整数据手册并根据应用场景设计合适的电源、信号与保护策略。

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